IPC분류정보
| 국가/구분 |
United States(US) Patent
등록
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| 국제특허분류(IPC7판) |
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| 출원번호 |
US-0692114
(2003-10-23)
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발명자
/ 주소 |
- Khandros,Igor Y.
- Eldridge,Benjamin N.
- Mathieu,Gaetan L.
- Dozier, II,Thomas H.
- Smith,William D.
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| 출원인 / 주소 |
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| 인용정보 |
피인용 횟수 :
26 인용 특허 :
89 |
초록
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An interconnection apparatus and a method of forming an interconnection apparatus. Contact structures are attached to or formed on a first substrate. The first substrate is attached to a second substrate, which is larger than the first substrate. Multiple such first substrates may be attached to the
An interconnection apparatus and a method of forming an interconnection apparatus. Contact structures are attached to or formed on a first substrate. The first substrate is attached to a second substrate, which is larger than the first substrate. Multiple such first substrates may be attached to the second substrate in order to create an array of contact structures. Each contact structure may be elongate and resilient and may comprise a core that is over coated with a material that imparts desired structural properties to the contact structure.
대표청구항
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What is claimed is: 1. An interconnection apparatus comprising: a plurality of first substrates; a plurality of free standing, elongate, resilient contact structures attached to said first substrates; and a second substrate comprising: a plurality of first terminals on a first side thereof, a plur
What is claimed is: 1. An interconnection apparatus comprising: a plurality of first substrates; a plurality of free standing, elongate, resilient contact structures attached to said first substrates; and a second substrate comprising: a plurality of first terminals on a first side thereof, a plurality of second terminals on a second side thereof, said second side opposite said first side, and a plurality of interconnections through said second substrate electrically connecting ones of said first terminals with ones of said second terminals; wherein said first substrates are attached to said second substrate, and ones of said contact structures are electrically connected to ones of said first terminals. 2. The interconnection apparatus of claim 1, wherein said first terminals are disposed in a first pattern on said first side of said second substrate, and said second terminals are disposed in a second pattern on said second side of said second substrate, and wherein said first pattern is different than said second pattern. 3. The interconnection apparatus of claim 2, wherein said first terminals in said first pattern are in a tighter pitch than said second terminals in said second pattern. 4. The interconnection apparatus of claim 1 further comprising an electrical interface to a semiconductor tester, wherein ones of said second terminals are electrically connected to said interface. 5. The interconnection apparatus of claim 4 further comprising a probe card, wherein said probe card comprises said interface. 6. The interconnection apparatus of claim 1, wherein each said first substrate corresponds to one of said dice. 7. The interconnection apparatus of claim 1, wherein each said first substrate corresponds to a plurality of said dice. 8. The interconnection apparatus of claim 1, wherein contact structures are attached to each said first substrate in a pattern that corresponds to a pattern of contacts on one of said dice. 9. The interconnection apparatus of claim 1, wherein contact structures are attached to each said first substrate in a pattern that corresponds to a pattern of contacts on at least two of said dice. 10. The interconnection apparatus of claim 1, wherein contact structures are attached to each said first substrate in a pattern that corresponds to a portion of one of said dice and a portion of an adjacent die. 11. The interconnection apparatus of claim 1, wherein each of said contact structures comprises a wire. 12. The interconnection apparatus of claim 11, wherein each of said contact structures further comprise an overcoat enveloping at least a portion of said wire. 13. The interconnection apparatus of claim 12, wherein said overcoat comprises a material having a greater yield strength than a material composing said wires. 14. The interconnect apparatus of claim 1, wherein said contact structures are not encapsulated in an elastomer material. 15. The interconnect apparatus of claim 1, wherein said contact structures are not encapsulated in an encapsulate common to more than one of said contact structures. 16. The interconnect apparatus of claim 1, said plurality of contact structures is for contacting dice of a semiconductor wafer, and each said first substrate corresponds to one of (i) at least one of said dice or (ii) a portion of one of said dice and a portion of an adjacent die. 17. The interconnect apparatus of claim 1, wherein each of said first substrates comprises third terminals on a first side of said first substrate, fourth terminals on a second, opposite side of said first substrate, and interconnections through said first substrate electrically connecting ones of said third terminals with ones of said fourth terminals. 18. The interconnect apparatus of claim 17, wherein ones of said fourth terminals are connected to ones of said first terminals. 19. The interconnect apparatus of claim 18, wherein each of said contact structures comprises a wire bonded to one of said third terminals. 20. The interconnect apparatus of claim 19, wherein each of said contact structures further comprises an overcoat enveloping at least a portion of said wire. 21. The interconnect apparatus of claim 20, wherein said overcoat comprises a material having a greater yield strength than a material composing said wires. 22. The interconnect apparatus of claim 1, wherein said ones of said contact structures that are electrically connected to said ones of said first terminals are not attached directly to said ones of said first terminals.
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