초록 ▼

An integrated circuit module, decoupling capacitor assembly and method are disclosed. The integrated circuit module includes a substrate and integrated circuit die mounted on the substrate and having die pads and an exposed surface opposite from the substrate. A plurality of substrate bonding pads a

An integrated circuit module, decoupling capacitor assembly and method are disclosed. The integrated circuit module includes a substrate and integrated circuit die mounted on the substrate and having die pads and an exposed surface opposite from the substrate. A plurality of substrate bonding pads are positioned on the substrate adjacent the integrated circuit die. A decoupling capacitor assembly is mounted on each integrated circuit die and includes a capacitor carrier secured onto the exposed surface of the integrated circuit die and a decoupling capacitor carried by the capacitor carrier. A wire bond extends from the decoupling capacitor assembly to a die pad and from a die pad to a substrate bonding pad.

대표청구항 ▼

That which is claimed is: 1. An integrated circuit chip module comprising: a substrate; at least one integrated circuit die mounted directly on the substrate and having die pads and an exposed surface opposite from the substrate; a plurality of substrate bonding pads positioned directly on the subs

That which is claimed is: 1. An integrated circuit chip module comprising: a substrate; at least one integrated circuit die mounted directly on the substrate and having die pads and an exposed surface opposite from the substrate; a plurality of substrate bonding pads positioned directly on the substrate adjacent the integrated circuit die; a plurality of decoupling capacitor assemblies mounted in series directly on the integrated circuit die, each decoupling capacitor assembly comprising a capacitor carrier secured onto the exposed surface of the integrated circuit die, a thin film metallization layer formed directly on said capacitor carrier; a conductive adhesive layer applied directly onto said thin film metallization layer; a decoupling capacitor secured directly onto said thin film metallization layer by said conductive adhesive layer; a wire bond extending from the thin film metallization layer to a logic pin of the integrated circuit die; and a wire bond extending from a logic pin to a substrate bonding pad. 2. An integrated circuit chip module according to claim 1, wherein said capacitor carrier is formed from an aluminum nitride substrate. 3. An integrated circuit chip module according to claim 2, wherein said aluminum nitride substrate ranges in thickness from about 5 mil to about 50 mil. 4. An integrated circuit chip module according to claim 1, and including a bonding pad on said thin film metallization layer for securing a wire bond.