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Method and apparatus for laser marking by ablation 원문보기

IPC분류정보
국가/구분 United States(US) Patent 등록
국제특허분류(IPC7판)
  • B23K-026/06
  • B23K-026/38
  • B23K-026/00
출원번호 US-0332923 (2006-01-16)
발명자 / 주소
  • Ehrmann,Jonathan S.
  • Cordingley,James J.
  • Smart,Donald V.
  • Svetkoff,Donald J.
출원인 / 주소
  • GSI Group Corporation
대리인 / 주소
    Brooks Kushman P.C.
인용정보 피인용 횟수 : 22  인용 특허 : 54

초록

A precision, laser-based method and system for high-speed, sequential processing of material of targets within a field are disclosed that control the irradiation distribution pattern of imaged spots. For each spot, a laser beam is incident on a first anamorphic optical device and a second anamorphic

대표청구항

What is claimed is: 1. A marking method of selectively processing target material with a precisely controlled laser ablation threshold, the method comprising: generating with a narrow pulse laser system a laser beam along a propagation path; controllably modifying the laser beam to obtain a modifie

이 특허에 인용된 특허 (54)

  1. Geyer Frederick F. (Rochester NY), Apparatus for use in correcting beam anamorphicity by vector diffraction.
  2. Cordingley James J. ; Smart Donald V. ; Plotkin Michael ; Lauer William, Controlling laser polarization.
  3. Tada Nobuhiko (Ushiku JPX) Ogata Kojiro (Ishioka JPX) Miyanagi Naoki (Ibaraki-ken JPX) Shimomura Yoshiaki (Ibaraki-ken JPX) Sakurai Shigeyuki (Tsukuba JPX) Nagano Yoshinari (Ibaraki-ken JPX) Okumura , Dam bar cutting apparatus and dam bar cutting method.
  4. Yoshiichirou Iwakiri JP; Susumu Honda JP, Device for engraving and inspecting a semiconductor wafer identification mark.
  5. Murokh, Igor Y.; Kerner, Alex, Duplicate laser marking discrete consumable articles.
  6. Smart, Donald V.; Svetkoff, Donald J., Energy-efficient method and system for processing target material using an amplified, wavelength-shifted pulse train.
  7. Dickey Fred M. ; Holswade Scott C. ; Romero Louis A., Gaussian beam profile shaping apparatus, method therefor and evaluation thereof.
  8. Cahill Steven P. ; Hunter Bradley L., High-speed precision positioning apparatus.
  9. Ehrmann, Jonathan S.; Cordingley, James J.; Smart, Donald V.; Svetkoff, Donald J., High-speed, precision, laser-based method and system for processing material of one or more targets within a field.
  10. Lloyd A. Hackel ; C. Brent Dane ; Fritz Harris, Identification marking by means of laser peening.
  11. Rieder Heinz (St. Pantaleon ATX) Schwaiger Max (Ostermiething ATX), Incremental measuring and machine control system.
  12. Welz Martin (Bad Durkheim DEX) Prissok Frank (Lemforde DEX), Inscription of moldings.
  13. Perrotto Joseph A. (Landenberg PA) Hergenroeder ; Jr. Emil J. C. (Baltimore MD) Davis Robert S. (Hatboro PA), Jig for polishing the edge of a thin solid state array panel.
  14. Pollack Dieter,DEX ; Morgenthal Lothar,DEX ; Gnann Rudiger Arnold,DEX, Laser beam shaping device and process including a rotating mirror.
  15. Amako Jun,JPX ; Murai Masami,JPX ; Ota Tsutomu,JPX ; Sonehara Tomio,JPX, Laser machining apparatus with rotatable phase grating.
  16. Lappalainen Reijo (Helsinki FIX) Siren Sten (Parainen FIX) Salmi Teijo (Jarvenpaa FIX) Helle Pertti (Parainen FIX), Laser marking method and a metal surface marked by this method.
  17. Folk Lee E. (Phoenix AZ) Asher Reginald K. (Scottsdale AZ), Laser marking method and ablative coating for use therein.
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  19. Luck ; Jr. Clarence F. (Waltham MA) Bowness Colin (Weston MA), Laser material removal apparatus.
  20. Smart Donald V., Laser processing.
  21. Sinohara Hisato (Sagamihara JPX), Laser scriving system and method.
  22. Tada Nobuhiko (Ushiku JPX) Miyanagi Naoki (Ibaraki-ken JPX) Shimomura Yoshiaki (Ibaraki-ken JPX) Sakurai Shigeyuki (Ibaraki-ken JPX) Nagano Yoshinari (Ibaraki-ken JPX), Lead frame fabricating method and lead frame fabricating apparatus.
  23. Rieder Heinz (St. Pantaleon ATX) Schwaiger Max (Ostermiething ATX), Linear incremental measuring system for measuring speed and displacement.
  24. Tondorf, Sebastian; Pechak, Peter, Linear measuring device.
  25. Rieder Heinz (St. Pantaleon ATX) Schwaiger Max (Ostermiething ATX), Linear measuring system.
  26. Jestdt Albrecht (Friedrichsdorf DEX) Oprach Klaus (Schwalbach DEX) Schfer Gerhard (Frankfurt DEX), Long-hair trimming device for dry shaving apparatus.
  27. James Douglas J. (Ottawa CAX) Andrews Kenneth J. (Stettsville CAX) McKee Terrence J. (Nepean CAX), Marking of a workpiece by light energy.
  28. James H Morris ; Michael Powers ; Harry Rieger, Method and apparatus for laser ablation of a target material.
  29. Timothy Fillion ; Arkady Savikovsky ; Jonathan S. Ehrmann, Method and apparatus for shaping a laser-beam intensity profile by dithering.
  30. Veldkamp Wilfrid B. (Lexington MA), Method and apparatus for shaping electromagnetic beams.
  31. Bradley L. Hunter ; Steven P. Cahill ; Jonathan S. Ehrmann ; Michael Plotkin, Method and system for precisely positioning a waist of a material-processing laser beam to process microstructures within a laser-processing site.
  32. Ehrmann, Jonathan S.; Cordingley, James J.; Smart, Donald V.; Svetkoff, Donald J., Method and system for processing one or more microstructures of a multi-material device.
  33. Mourou Gerard A. (Ann Arbor MI) Du Detao (Ann Arbor MI) Dutta Subrata K. (Ann Arbor MI) Elner Victor (Ann Arbor MI) Kurtz Ron (Ann Arbor MI) Lichter Paul R. (Ann Arbor MI) Liu Xinbing (Ann Arbor MI) , Method for controlling configuration of laser induced breakdown and ablation.
  34. Benz, Gerhard; Wawra, Thomas; Schneider, Rainer; Eisemann, Achim, Method for making defined conical holes using a laser beam.
  35. Ohtani Ryuji (Kadoma JPX) Okamoto Takeshi (Kadoma JPX) Nakamura Yoshimitsu (Kadoma JPX) Uchinono Yosiyuki (Kadoma JPX) Kamada Kazuo (Kadoma JPX) Nakashima Kunzi (Kadoma JPX) Suzuki Toshiyuki (Kadoma , Method for manufacturing printed circuit board.
  36. Homer, Michael; Henshaw, James R; Holden, Peter G, Method for producing an optical scale.
  37. Cordingley James J. (Cumberland RI), Method for severing integrated-circuit connection paths by a phase-plate-adjusted laser beam.
  38. Behn Reinhard (Munich DEX), Method for the formation of narrow, metal-free strips in a metal layer on plastic sheets.
  39. Golker Walter (Munich DEX), Method for the manufacture of a code disk for optical incremental shaft encoders and absolute shaft encoders.
  40. McMurtry D. R. (Wotton-under-Edge GBX) Stephens W. F. N. (Badminton GBX) Kirkbride M. (Dursley GBX), Method of producing a metrological scale and scale produced by such method.
  41. Sun Yunlong ; Swenson Edward J., Method of severing electrically conductive links with ultraviolet laser output.
  42. Uhling Thomas F. (Monument CO) Yearsley Philip J. (Colorado Springs CO) Pittock Dale L. (Colorado Springs CO) Mathews Mark E. (Colorado Springs CO), Method of trimming an electronic circuit.
  43. McMurtry David R. (Wotton-Under-Edge GBX) Stephens William F. N. (Badminton GBX), Opto-electronic scale-reading apparatus wherein phase-separated secondary orders of diffraction are generated.
  44. Heinz Rieder (St. Pantaleon ATX) Schwaiger Max (Ostermiething ATX), Optoelectronic measuring system.
  45. McMurtry David R. (Wotton-Under-Edge GBX) Wilson David (Stonehouse GBX) Pitt Gillies D. (Hewelsfield GBX), Position determination apparatus.
  46. Ludwig Boge DE; Hans-Joachim Freitag DE, Position measuring device.
  47. Swenson, Edward J.; Sun, Yunlong; Harris, Richard S., Resistor trimming with small uniform spot from solid-state UV laser.
  48. Stephens William F. N. (Badminton GBX), Scale for use with opto-electronic scale reading apparatus.
  49. Wei Bo ; Meyer Dallas W. ; Pan Zhengda ; Xuan Jialuo J. ; Shih Chung Y., Shaped-beam laser texturing of magnetic media.
  50. Boege Ludwig,DEX ; Freitag Hans-Joachim,DEX, Strip-shaped resiliently flexible measuring tape for length--or angle-measuring devices.
  51. Adachi Yoshi (16214 Watson Cir. Westminster CA 92683), Superior resolution laser using bessel transform optical filter.
  52. Marshall John (Farnborough GB3) Raven Anthony L. (Royston GB3) Welford Walter T. (London GB3) Ness Karen M. M. (Royston GB3), Surface erosion using lasers.
  53. Sun Yunlong (Portland OR) Hutchens Craig D. (Portland OR), System and method for selectively laser processing a target structure of one or more materials of a multimaterial, multi.
  54. Ngoi Bryan Kok Ann,SGX ; Venkatakrishnan Krishnan,SGX, Three dimensional micro machining with a modulated ultra-short laser pulse.

이 특허를 인용한 특허 (22)

  1. Hall, Brian; Holbrook, David S.; Wall, David L., Apparatus for minimizing a heat affected zone during laser micro-machining.
  2. Farrow, Roger L.; Kliner, Dahv A. V., Fiber source with cascaded gain stages and/or multimode delivery fiber with low splice loss.
  3. Gu,Bo; Ehrmann,Jonathan S.; Svetkoff,Donald J.; Cahill,Steven P.; Sullivan,Kevin E., Laser-based method and system for processing targeted surface material and article produced thereby.
  4. Gu, Bo; Smart, Donald V.; Cordingley, James J.; Lee, Joohan; Svetkoff, Donald J.; Johnson, Shepard D.; Ehrmann, Jonathan S., Laser-based method and system for removing one or more target link structures.
  5. Gu, Bo; Smart, Donald V.; Cordingley, James J.; Lee, Joohan; Svetkoff, Donald J.; Johnson, Shepard D.; Ehrmann, Jonathan S., Laser-based method and system for removing one or more target link structures.
  6. Baldwin, Leo, Method and apparatus for laser machining.
  7. Kleinert, Jan; Reichenbach, Robert; Unrath, Mark; Matsumoto, Hisashi; Howerton, Jefferey; Alpay, Mehmet E.; Moore, Andy, Method and apparatus for marking an article.
  8. Griffiths, Joseph J.; Pelsue, Kurt, Method and system for adaptively controlling a laser-based material processing process and method and system for qualifying same.
  9. Gu, Bo; Ehrmann, Jonathan S.; Lento, Joseph V.; Couch, Bruce L.; Chu, Yun Fee; Johnson, Shepard D., Method and system for high-speed precise laser trimming and scan lens for use therein.
  10. Gu, Bo; Ehrmann, Jonathan S.; Lento, Joseph V.; Couch, Bruce L.; Chu, Yun Fee; Johnson, Shepard D., Method and system for high-speed precise laser trimming and scan lens for use therein.
  11. Couch, Bruce L.; Ehrmann, Jonathan S.; Lento, Joseph V.; Johnson, Shepard D., Method and system for high-speed, precise micromachining an array of devices.
  12. Couch, Bruce L.; Erhmann, Jonathan S.; Chu, Yun Fee; Lento, Joseph V.; Johnson, Shepard D., Method and system for high-speed, precise micromachining an array of devices.
  13. Gu, Bo, Method and system for laser processing targets of different types on a workpiece.
  14. Gu, Bo, Method and system for laser processing targets of different types on a workpiece.
  15. Gu, Bo; Ehrmann, Jonathan S., Method and system for laser soft marking.
  16. Nemets, Christian; Woelki, Michael; Engineer, Amit V., Method and system for machine vision-based feature detection and mark verification in a workpiece or wafer marking system.
  17. Ehrmann,Jonathan S.; Kilgus,Donald B. T., Optical scanning method and system and method for correcting optical aberrations introduced into the system by a beam deflector.
  18. Kliner, Dahv A. V., Scalable high power fiber laser.
  19. Sercel, Patrick J.; Sercel, Jeffrey P.; Park, Jongkook, System and method for cutting using a variable astigmatic focal beam spot.
  20. Sercel, Patrick J.; Sercel, Jeffrey P.; Park, Jongkook, System and method for cutting using a variable astigmatic focal beam spot.
  21. Sercel,Patrick J.; Sercel,Jeffrey P.; Park,Jongkook, System and method for cutting using a variable astigmatic focal beam spot.
  22. Karlsen, Scott R.; Kennedy, Keith; Martinsen, Robert J., Thermal processing with line beams.
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