이 특허에 인용된 특허 (368) 인용/피인용 타임라인 분석

1. Miller, Charles A., Adjustable delay transmission line.

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2. Beaman Brian Samuel ; Fogel Keith Edward ; Lauro Paul Alfred ; Shih Da-Yuan, Angled flying lead wire bonding process.

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3. Beaman, Brian Samuel; Fogel, Keith Edward; Lauro, Paul Alfred; Shih, Da-Yuan, Angled flying lead wire bonding process.

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4. Beaman, Brian Samuel; Fogel, Keith Edward; Lauro, Paul Alfred; Shih, Da-Yuan, Angled flying lead wire bonding process.

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5. Miller, Charles A.; Hreish, Emad B., Apparatus and method for electromechanical testing and validation of probe cards.

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6. O'Boyle John O., Apparatus and method for retaining a semiconductor wafer during testing.

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7. Mallory Chester (Campbell CA) Perloff David S. (Sunnyvale CA) Pham Hung V. (San Jose CA) Droblisch Sandor (Monte Sereno CA), Apparatus and methods for semiconductor wafer testing.

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8. Mathieu Gaetan L., Apparatus for controlling plating over a face of a substrate.

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9. Benjamin N. Eldridge ; Charles A. Miller, Apparatus for reducing power supply noise in an integrated circuit.

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10. Benjamin N. Eldridge ; Charles A. Miller, Apparatus for reducing power supply noise in an integrated circuit.

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11. Pasiecznik ; Jr. John (Malibu CA), Apparatus for testing integrated circuits.

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12. Grube, Gary W., Apparatuses and methods for cleaning test probes.

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13. Boll Gregory G. ; Boll Harry J., Broadband impedance matching probe.

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14. Sutherland, Alexander Tennant, Calibration of an analogue probe.

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15. Toda Akitoshi (Tokyo JPX) Matsuyama Katsuhiro (Tokyo JPX), Cantilever chip for scanning probe microscope.

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16. Crook David T. (Loveland CO) Heumann John M. (Loveland CO) McDermid John E. (Loveland CO) Peiffer Ronald J. (Fort Collins CO) Schlotzhauer Ed O. (Loveland CO), Capacitively-coupled test probe.

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17. Logan John K. (26527 Silver Spur Rd. Rancho Palos Verdes CA 90274), Ceramic microstrip probe blade.

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18. Behfar-Rad Abbas (Poughquag NY) Perry Charles H. (Poughkeepsie NY) Sachdev Krishna G. (Hopewell Junction NY), Ceramic probe card and method for reducing leakage current.

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19. Chang Sung Chul ; Khandros Igor Y. ; Smith William D., Chip-scale carrier for semiconductor devices including mounted spring contacts.

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20. Ota Masanori (Funabashi JPX) Aoki Masafumi (Funabashi JPX) Nakamura Masashi (Funabashi JPX) Mizusawa Kenichi (Funabashi JPX) Kasahara Kumi (Funabashi JPX), Chloroisocyanuric acid composition having storage stability.

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21. Miller, Charles A.; Long, John Matthew, Closed-grid bus architecture for wafer interconnect structure.

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22. Miller, Charles A.; Long, John Matthew, Closed-grid bus architecture for wafer interconnect structure.

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23. Burr Jeremy (Portland OR) Nordgren Gregory (Portland OR) Strid Eric W. (Portland OR) Gleason Kimberly R. (Portland OR), Coaxial wafer probe with tip shielding.

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24. Pade, Wolfgang, Compact coupler plug, particularly for a planar broadband lambda probe, in which single-conductor seals are prevented from being lost.

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25. Slater, Joseph B., Compact optical measurement probe.

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26. Miller, Charles A., Compensation for test signal degradation due to DUT fault.

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27. Khandros Igor Y. ; Mathieu Gaetan L., Composite interconnection element for microelectronic components, and method of making same.

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28. Benjamin N. Eldridge ; Igor Y. Khandros ; David V. Pedersen ; Ralph G. Whitten, Concurrent design and subsequent partitioning of product and test die.

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29. Buchoff Leonard S. (Bloomfield NJ) Kosiarski Joseph P. (Englishtown NJ) Dalamangas Chris A. (Fort Lee NJ), Conductive elastomeric contacts and connectors.

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30. Boegh-Petersen Allan (Flongvaenget 14 Hedehusene DK-2640 DKX), Connector assembly for a circuit board testing machine, a circuit board testing machine, and a method of testing a circu.

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31. Mok, Sammy; Chong, Fu Chiung; Swiatowiec, Frank John; Lahiri, Syamal Kumar; Haemer, Joseph Michael, Construction structures and manufacturing processes for probe card assemblies and packages having wafer level springs.

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32. Khandros Igor Y. ; Eldridge Benjamin N. ; Mathieu Gaetan L. ; Dozier Thomas H. ; Smith William D., Contact carriers (tiles) for populating larger substrates with spring contacts.

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33. Khandros, Igor Y.; Eldridge, Benjamin N.; Mathieu, Gaetan L.; Dozier, Thomas H.; Smith, William D., Contact carriers (tiles) for populating larger substrates with spring contacts.

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34. Byrnes Herbert P. (Poughkeepsie NY) Wahl Richard (Fishkill NY), Contact for an electrical contactor assembly.

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35. Yoshida, Hideaki; Ishii, Toshinori; Matsuda, Atushi; Ueki, Mituyoshi; Tachikawa, Noriyoshi; Nakamura, Tadashi; Katou, Naoki; Tai, Shou; Sasaki, Hayato; Iwamoto, Naohumi; Mishima, Akihumi; Hiji, Toshi, Contact probe and probe device.

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36. Yoshida, Hideaki; Ishii, Toshinori; Matsuda, Atushi; Ueki, Mituyoshi; Tachikawa, Noriyoshi; Nakamura, Tadashi; Katou, Naoki; Tai, Shou; Sasaki, Hayato; Iwamoto, Naohumi; Mishima, Akihumi; Hiji, Toshi, Contact probe and probe device.

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37. Yoshida, Hideaki; Ishii, Toshinori; Matsuda, Atushi; Ueki, Mituyoshi; Tachikawa, Noriyoshi; Nakamura, Tadashi; Katou, Naoki; Tai, Shou; Sasaki, Hayato; Iwamoto, Naohumi; Mishima, Akihumi; Hiji, Toshi, Contact probe and probe device.

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38. Yoshida, Hideaki; Ishii, Toshinori; Matsuda, Atushi; Ueki, Mituyoshi; Tachikawa, Noriyoshi; Nakamura, Tadashi; Katou, Naoki; Tai, Shou; Sasaki, Hayato; Iwamoto, Naohumi; Mishima, Akihumi; Hiji, Toshi, Contact probe and probe device.

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39. Yoshida, Hideaki; Ishii, Toshinori; Matsuda, Atushi; Ueki, Mituyoshi; Tachikawa, Noriyoshi; Nakamura, Tadashi; Katou, Naoki; Tai, Shou; Sasaki, Hayato; Iwamoto, Naohumi; Mishima, Akihumi; Hiji, Toshi, Contact probe and probe device.

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40. Khandros Igor Y. ; Mathieu Gaetar L., Contact structure device for interconnections, interposer, semiconductor assembly and package using the same and method.

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41. Benjamin N. Eldridge ; Gary W. Grube ; Igor Y. Khandros ; Alec Madsen ; Gaetan L. Mathieu, Contact structures with blades having a wiping motion.

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42. Lao Binneg Y. (Rancho Palos Verdes CA) Rowe David A. (Redondo Beach CA), Coplanar and stripline probe card apparatus.

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43. Miller, Charles A., Cross-correlation timing calibration for wafer-level IC tester interconnect systems.

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44. McQueeney, Kenneth A., Detecting field from different ignition coils using adjustable probe.

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45. Eroglu Adnan,CHX ; Knopfel Hans Peter,CHX ; Senior Peter,GB3, Device and method for injecting fuels into compressed gaseous media.

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46. Kempf Stefan,DEX ; Reising Michael,DEX, Device for gripping and holding substrates.

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47. Higgins H. Dan (323 E. Redfield Rd. Chandler AZ 85225) Normington Peter (516 Country Plz. South Gilbert AZ 85234), Die carrier apparatus.

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48. Sweet, Charles M.; Dryden, Cameron D.; Lewinnek, David W., Differential coaxial contact array for high-density, high-speed signals.

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49. Richard S. Roy ; Charles A. Miller, Distributed interface for parallel testing of multiple devices using a single tester channel.

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50. Roy, Richard S.; Miller, Charles A., Distributed interface for parallel testing of multiple devices using a single tester channel.

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51. Smith Monty (Forest Grove OR) Campbell Julie A. (Portland OR), Double insulated floating high voltage test probe.

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52. Eldridge, Benjamin N.; Grube, Gary W.; Khandros, Igor Y.; Mathieu, Gaetan L., ELECTRICAL CONTACT STRUCTURES FORMED BY CONFIGURING A FLEXIBLE WIRE TO HAVE A SPRINGABLE SHAPE AND OVERCOATING THE WIRE WITH AT LEAST ONE LAYER OF A RESILIENT CONDUCTIVE MATERIAL, METHODS OF MOUNTING.

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53. Eldridge, Benjamin N.; Grube, Gary W.; Khandros, Igor Y; Mathieu, Gaetan L., ELECTRICAL CONTACT STRUCTURES FORMED BY CONFIGURING A FLEXIBLE WIRE TO HAVE A SPRINGABLE SHAPE AND OVERCOATING THE WIRE WITH AT LEAST ONE LAYER OF A RESILIENT CONDUCTIVE MATERIAL, METHODS OF MOUNTING.

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54. Gifford, Carl B.; Uyehara, Clyde T., Eddy current probe having sensing elements defined by first and second elongated coils and an associated inspection method.

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55. Charles A. Miller ; Richard S. Roy, Efficient parallel testing of integrated circuit devices using a known good device to generate expected responses.

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56. Miller, Charles A.; Roy, Richard S., Efficient parallel testing of semiconductor devices using a known good device to generate expected responses.

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57. Gross Hal D. (San Diego CA) Hudon Gerard M. (St. Paul MN), Elastic membrane probe.

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58. Zifcak Mark S. (Putnam CT) Kosa Bruce G. (Woodstock CT), Electrical circuit board interconnect.

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59. Benjamin N. Eldridge, Electrical contactor especially wafer level contactor using fluid pressure.

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60. Miller, Charles A., Electromagnetically coupled interconnect system.

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61. Khandros, Igor Y.; Pedersen, David V.; Eldridge, Benjamin N.; Roy, Richard S.; Mathieu, Gaetan, Electronic component overlapping dice of unsingulated semiconductor wafer.

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62. Eldridge Benjamin N. ; Khandros Igor Y. ; Mathieu Gaetan L. ; Pedersen David V., Electronic component with terminals and spring contact elements extending from areas which are remote from the terminals.

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63. Eldridge Benjamin N. ; Khandros Igor Y. ; Mathieu Gaetan L. ; Pedersen David V., Electronic components with terminals and spring contact elements extending from areas which are remote from the terminals.

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64. Hedrick James Lupton ; Shih Da-Yuan, Electronic devices comprising dielectric foamed polymers.

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65. Swart Mark A. (Upland CA), Expandable diaphragm test modules and connectors.

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66. Khandros Igor Y. ; Eldridge Benjamin N. ; Mathieu Gaetan L., Fabricating interconnects and tips using sacrificial substrates.

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67. Eldridge, Benjamin N.; Khandros, Igor Y., Fan out of interconnect elements attached to semiconductor wafer.

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68. Miller Charles A., Filter structures for integrated circuit interfaces.

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69. Miller, Charles A., Filter structures for integrated circuit interfaces.

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70. McBride Donald G. (Binghamton NY) Ellis Theron L. (Vestal NY), Flexible carrier for an electronic device.

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71. Parks Howard L. (Woodland Hills CA) Kuronen John M. (Camarillo CA), Flexible connector cable.

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72. Khandros Igor Y. ; Mathieu Gaetan L., Flexible contact structure with an electrically conductive shell.

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73. Crumly William R. (Anaheim CA), Flexible electrical cable connector with double sided dots.

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74. MacKay Colin A. (Austin TX), Flexible electrical interconnect and method of making.

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75. Mazur, Robert G., Flexible membrane probe and method of use thereof.

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76. Yanagawa Kouichi (Hachiojishi JPX) Yagi Kazuyuki (Hachiojishi JPX), Floating driver circuit and a device for measuring impedances of electrical components.

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77. Fogel Keith Edward ; Hedrick James Lupton ; Lauro Paul Alfred ; Liao Yun-Hsin ; Shih Da-Yuan, Foamed elastomers for wafer probing applications and interposer connectors.

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78. Huff Richard E. (Belmont CA) Leslie Brian (Cupertino CA), Force delivery system for improved precision membrane probe.

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79. Eldridge, Benjamin N.; Wenzel, Stuart W., Forming tool for forming a contoured microelectronic spring mold.

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80. Shihadeh Elias E.,ILX ; Weiler Peter M., General purpose assembly programmable multi-chip package substrate.

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81. Cannon, James E., High bandwidth oscilloscope probe with replaceable cable.

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82. Miller Charles A., High bandwidth passive integrated circuit tester probe card assembly.

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83. Beaman Brian Samuel ; Fogel Keith Edward ; Lauro Paul Alfred ; Norcott Maurice Heathcote ; Shih Da-Yaun, High density cantilevered probe for electronic devices.

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84. Beaman Brian Samuel ; Fogel Keith Edward ; Lauro Paul Alfred ; Norcott Maurice Heathcote ; Shih Da-Yuan, High density cantilevered probe for electronic devices.

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85. Beaman Brian Samuel ; Fogel Keith Edward ; Lauro Paul Alfred ; Norcott Maurice Heathcote ; Shih Da-Yuan, High density cantilevered probe for electronic devices.

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86. Chapin Fletcher W. (Vestal NY) Dranchak David W. (Endwell NY) Engle David E. (Vestal NY) Hall Richard R. (Endwell NY) Macek Thomas G. (Endicott NY), High density connector.

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87. Albrecht Thomas R. (San Jose CA) Mamin Harry J. (Palo Alto CA) Rugar Daniel (Palo Alto CA), High density data storage system with topographic contact sensor.

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88. Beaman Brian Samuel ; Fogel Keith Edward ; Lauro Paul Alfred ; Norcott Maurice Heathcote ; Shih Da-Yuan ; Walker George Frederick, High density integrated circuit apparatus, test probe and methods of use thereof.

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89. Brian Samuel Beaman ; Keith Edward Fogel ; Paul Alfred Lauro ; Maurice Heathcote Norcott ; Da-Yuan Shih ; George Frederick Walker, High density integrated circuit apparatus, test probe and methods of use thereof.

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90. Feldman, Steven, High density probe device.

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91. Ardezzone Frank J. (Santa Clara CA), High density probe-head with isolated and shielded transmission lines.

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92. Beaman Brian Samuel ; Fogel Keith Edward ; Lauro Paul Alfred ; Norcott Maurice Heathcote ; Shih Da-Yuan, High density test probe with rigid surface structure.

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93. Beaman Brian Samuel ; Fogel Keith Edward ; Lauro Paul Alfred ; Norcott Maurice Heathcote ; Shih Da-Yuan, High density test probe with rigid surface structure.

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94. Bove Ronald (Wappingers Falls NY) Hubacher Eric M. (Wappingers Falls NY), High density wafer contacting and test system.

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95. Wilson, Lester; Rincon, Reynaldo M.; Broz, Jerry; Arnold, Richard W., High density, area array probe card apparatus.

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96. Hechtman Charles D. (Plainsboro NJ), High frequency in-circuit test fixture.

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97. Hreish, Emad B.; Miller, Charles A., High frequency printed circuit board via.

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98. Hreish, Emad B.; Miller, Charles A., High frequency printed circuit board via.

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99. Chraft, Matthew; Henson, Roy J.; Miller, Charles A.; Tseng, Chih-Chiang, High performance probe system.

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100. Roch ; Jacques L., High speed precision chuck assembly.

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101. Roch Jacques L. (San Jose CA), High speed precision chuck assembly.

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102. Gleason K. Reed (Portland OR) Jones Keith E. (Aloha OR), High-frequency active probe having replaceable contact needles.

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103. Godshalk Edward M. (Beaverton OR) Williams Jeffrey A. (Beaverton OR) Burr Jeremy N. (Portland OR), High-frequency probe tip assembly.

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104. Bell Theodore F. (c/o Norbell Corp. ; 400 Fentress Blvd. Daytona Beach FL 32014), Index table.

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105. Khoshaba Mushie (Elk Grove Village IL), Indexing chuck.

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106. Grube, Gary W., Insulative covering of probe tips.

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107. Beaman Brian Samuel ; Fogel Keith Edward ; Lauro Paul Alfred ; Norcott Maurice Heathcote ; Shih Da-Yuan ; Walker George Frederick, Integral rigid chip test probe.

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108. Charles A. Miller, Integrated circuit interconnect system.

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109. Miller, Charles A., Integrated circuit interconnect system.

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110. Miller, Charles A., Integrated circuit interconnect system.

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111. Miller, Charles A., Integrated circuit interconnect system.

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112. Charles A. Miller, Integrated circuit interconnect system forming a multi-pole filter.

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113. Grangroth Robert H. (Osseo MN) Loy Jerald M. (Anoka MN), Integrated circuit interface.

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114. Snyder Delmer E. (Hillsboro OR) Veenendaal Cornelis T. (Cornelius OR) Creedon Theodore G. (Lake Oswego OR), Integrated circuit probe station.

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115. Boll Gregory G. (Watchung NJ) Boll Harry J. (Berkeley Heights NJ), Integrated circuit probing apparatus.

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116. Charles A. Miller, Integrated circuit tester with high bandwidth probe assembly.

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117. Miller, Charles A., Integrated circuit tester with high bandwidth probe assembly.

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118. Miller, Charles A., Integrated circuit tester with high bandwidth probe assembly.

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119. Beaman, Brian Samuel; Fogel, Keith Edward; Lauro, Paul Alfred; Shih, Da-Yuan, Integrated compliant probe for wafer level test and burn-in.

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120. Robillard David R. (Westboro MA) Michals Robert L. (Marlboro MA), Integrated test and assembly device.

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121. Eldridge, Benjamin N.; Mathieu, Gaetan, Interconnect assemblies and methods.

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122. Khandros Igor Y. ; Pedersen David V. ; Eldridge Benjamin N. ; Roy Richard S. ; Mathieu Gaetan, Interconnect assemblies and methods including ancillary electronic component connected in immediate proximity of semiconductor device.

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123. Mathieu, Gaetan L.; Eldridge, Benjamin N., Interconnect for microelectronic structures with enhanced spring characteristics.

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124. Eldridge, Benjamin N.; Grube, Gary W.; Khandros, Igor Y.; Madsen, Alec; Mathieu, Gaetan L., Interconnection element with contact blade.

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125. Khandros Igor Y. ; Mathieu Gaetan L., Interconnection substrates with resilient contact structures on both sides.

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126. Shih Da-Yuan ; Lauro Paul ; Fogel Keith Edward ; Beaman Brian ; Norcott Maurice, Interconnector with contact pads having enhanced durability.

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127. Shih Da-Yuan ; Lauro Paul ; Fogel Keith Edward ; Beaman Brian ; Norcott Maurice, Interconnector with contact pads having enhanced durability.

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128. Dozier, II, Thomas H.; Eldridge, Benjamin N.; Grube, Gary W.; Khandros, Igor Y.; Mathieu, Gaetan L., Interposer, socket and assembly for socketing an electronic component and method of making and using same.

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129. Khandros, Igor Y; Pedersen, David V.; Whitten, Ralph G., Large contactor with multiple, aligned contactor units.

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130. Mathieu Gaetan L. ; Eldridge Benjamin N. ; Grube Gary W., Lithographic contact elements.

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131. Mathieu, Gaetan L.; Eldridge, Benjamin N.; Grube, Gary W., Lithographic contact elements.

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132. Taura Toru,JPX ; Inoue Hirobumi,JPX ; Tanehashi Masao,JPX ; Matsunaga Kouji,JPX ; Yamagishi Yuuichi,JPX ; Hayakawa Satoshi,JPX ; Tsugane Hironori,JPX, Longitudinal type high frequency probe for narrow pitched electrodes.

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133. Littlebury Hugh W. (Chandler AZ) Simmons Marion I. (Tempe AZ), Low resistance probe for semiconductor.

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134. Boucher John N. (110 Coveridge La. Longwood FL 32779) Bajune David E. (6800 W. S.R. 46 Sanford FL 32773), Machine tool rotary table locking apparatus.

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135. Eldridge Benjamin N. ; Grube Gary W. ; Khandros Igor Y. ; Mathieu Gaetan L., Making discrete power connections to a space transformer of a probe card assembly.

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136. Hattori, Atsuo; Yoshino, Toshitaka; Hamano, Tetsutsugu; Sugiura, Masahiro, Manufacture of probe unit having lead probes extending beyond edge of substrate.

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137. Bhatt Anilkumar Chinuprasad ; Magnuson Roy Harvey ; Miller Thomas Richard ; Markovich Voya Rista ; Sambucetti Carlos J. ; Tisdale Stephen Leo, Manufacturing computer systems with fine line circuitized substrates.

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138. Enge Harald A. (20 Nason Hill Rd. Sherborn MA 01770), Mass recombinator for accelerator mass spectrometry.

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139. del Rio Eddy H. (Jupiter FL), Means to orbit and rotate target wafers supported on planet member.

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140. Crumly William R. (Anaheim CA), Membrane connector with stretch induced micro scrub.

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141. Kister January ; Lobacz Jerzy, Membrane for holding a probe tip in proper location.

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142. Huff Richard E. (Belmont CA), Membrane probe contact bump compliancy system.

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143. Huff Richard E. (1408 Solana Dr. Belmont CA 94002) Perlaki Miklos (1406 Sage Rd. Colfax CA 95713), Membrane probe with automatic contact scrub action.

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144. Liu Ken K. F. (Saratoga CA) Min Byoung-Youl (Cupertino CA) Moti Robert J. (San Jose CA) Husain Syed A. (Milpitas CA), Membrane probing of circuits.

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145. Gleason Reed ; Bayne Michael A. ; Smith Kenneth ; Lesher Timothy ; Koxxy Martin, Membrane probing system.

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146. Tervo, Paul A.; Smith, Kenneth R.; Cowan, Clarence E.; Dauphinais, Mike P.; Koxxy, Martin J., Membrane probing system.

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147. Gleason K. Reed ; Smith Kenneth R. ; Bayne Mike, Membrane probing system with local contact scrub.

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148. Roman Vitenberg IL, Method and apparatus for RF common-mode noise rejection in a DSL receiver.

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149. Eldridge Benjamin N. ; Khandros Igor Y. ; Mathieu Gaetan L., Method and apparatus for applying a layer of flowable coating material to a surface of an electronic component.

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150. Eldridge, Benjamin N.; Grube, Gary W.; Khandros, Igor Y.; Mathieu, Gaetan L., Method and apparatus for burning-in semiconductor devices in wafer form.

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151. Marin, Irina A.; Gehrmann, Thomas, Method and apparatus for contemporaneous utilization of a higher order probe in pre-stack and post-stack seismic domains.

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152. Mathieu Gaetan L., Method and apparatus for controlling plating over a face of a substrate.

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153. Mathieu, Gaetan L., Method and apparatus for controlling plating over a face of a substrate.

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154. Cheng David (711 Hibernia Ct. Sunnyvale CA 94087), Method and apparatus for handling wafers.

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155. Beaman Brian Samuel ; Fogel Keith Edward ; Lauro Paul Alfred ; Norcott Maurice Heathcote ; Shih Da-Yuan ; Walker George Frederick, Method and apparatus for passive characterization of semiconductor substrates subjected to high energy (MEV) ion implementation using high-injection surface photovoltage.

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156. Back, Gerald W.; Dang, Son; Tunaboylu, Bahadir, Method and apparatus for probe tip cleaning and shaping pad.

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157. Khandros, Igor Y.; Dozier, Thomas H.; Grube, Gary W.; Mathieu, Gaetan L., Method and apparatus for shaping spring elements.

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158. Khandros, Igor Y.; Dozier, Thomas H.; Grube, Gary W.; Mathieu, Gaetan L., Method and apparatus for shaping spring elements.

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159. Reano, Ronald M.; Whitaker, John F.; Katehi, Linda P. B., Method and apparatus for simultaneous measurement of electric field and temperature using an electrooptic semiconductor probe.

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160. Ondricek, Douglas S.; Pedersen, David V., Method and apparatus for the transport and tracking of an electronic component.

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161. Eldridge Benjamin N. (Danville CA) Mathieu Gaetan L. (Livermore CA), Method and apparatus for wirebonding, for severing bond wires, and for forming balls on the ends of bond wires.

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162. Eldridge, Benjamin N.; Brandemuehl, Mark W.; Graef, Stefan; Parent, Yves, Method and system for designing a probe card.

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163. Eldridge, Benjamin N.; Juergen Zschiegner, Stefan Jan, Method and system for detecting an arc condition.

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164. Schreiber Christopher M. (Newport Beach CA) Feigenbaum Haim (Irvine CA), Method for electrodepositing corrosion barrier on isolated circuitry.

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165. Farnworth Warren M. (Nampa ID), Method for fabricating a penetration limited contact having a rough textured surface.

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166. Miller, Charles A., Method for fabricating an IC interconnect system including an in-street integrated circuit wafer via.

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167. Lu, Nai-Cheng; Liao, Yu-Ting; Liu, Fu-Sung, Method for fabricating microelectronic fabrication electrical test apparatus electrical probe tip having pointed tips.

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168. Kouji Matsunaga JP; Hirobumi Inoue JP; Masao Tanehashi JP; Toru Taura JP; Masahiko Nikaidou JP; Yuuichi Yamagishi JP; Satoshi Hayakawa JP, Method for fabricating probe tip portion composed by coaxial cable.

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169. Elder Richard A. (Dallas TX) Wilson Arthur M. (Dallas TX) Bagen Susan V. (Dallas TX) Miller Juanita G. (Richardson TX), Method for fabrication of probe card for testing of semiconductor devices.

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170. Akram Salman (Boise ID) Farnworth Warren M. (Nampa ID) Wood Alan G. (Boise ID), Method for forming an interconnect having a penetration limited contact structure for establishing a temporary electrica.

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171. Kister January, Method for making a probe preserving a uniform stress distribution under deflection.

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172. Leedy Glenn (1061 E. Mountain Dr. Santa Barbara CA 93108), Method for making an interconnection structure for integrated circuits.

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173. Henson, Roy, Method for manufacturing a multi-layer printed circuit board.

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174. Khandros Igor Y., Method for manufacturing raised electrical contact pattern of controlled geometry.

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175. Khandros, Igor Y., Method for manufacturing raised electrical contact pattern of controlled geometry.

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176. Khandros, Igor Y., Method for manufacturing raised electrical contact pattern of controlled geometry.

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177. Mautz Karl Emerson, Method for measuring a characteristic of a semiconductor wafer using cylindrical control.

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178. Ondricek, Douglas S.; Pedersen, David V., Method for mounting an electronic component.

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179. Fyfield, Margaret S., Method for probing a semiconductor wafer.

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180. Ondricek, Douglas S.; Pederson, David V., Method for processing an integrated circuit including placing dice into a carrier and testing.

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181. Igor Y. Khandros ; Thomas H. Dozier ; Gary W. Grube ; Gaetan L. Mathieu, Method for shaping spring elements.

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182. Ralph G. Whitten ; Benjamin N. Eldridge, Method for testing signal paths between an integrated circuit wafer and a wafer tester.

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183. Cheng David (711 Hibernia Ct. Sunnyvale CA 94087), Method for transporting and testing wafers.

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184. Eldridge, Benjamin N., Method of assembling and testing an electronics module.

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185. Eldridge Benjamin N. ; Grube Gary W. ; Khandros Igor Y. ; Mathieu Gaetan L., Method of burning-in semiconductor devices.

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186. Miller, Charles A.; Long, John M., Method of designing, fabricating, testing and interconnecting an IC to external circuit nodes.

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187. Miller, Charles A.; Long, John M., Method of designing, fabricating, testing and interconnecting an IC to external circuit nodes.

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188. Mathieu, Gaetan L.; Eldridge, Benjamin N.; Wenzel, Stuart W., Method of fabricating shaped springs.

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189. Trobough Douglas W. (Beaverton OR), Method of forming a conductive contact bump on a flexible substrate and a flexible substrate.

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190. Beaman, Brian Samuel; Fogel, Keith Edward; Lauro, Paul Alfred; Norcott, Maurice Heathcote; Shih, Da-Yuan, Method of forming a structure for electronic devices contact locations.

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191. Beaman Brain S. (Hyde Park NY) Doany Fuad E. (Katonah NY) Fogel Keith E. (Bardonia NY) Hedrick ; Jr. James L. (Oakland CA) Lauro Paul A. (Nanuet NY) Norcott Maurice H. (Valley Cottage NY) Ritsko John, Method of forming a three dimensional high performance interconnection package.

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192. Ubbens Henricus D. U. (Eindhoven NLX) Langeveld Peer (Eindhoven NLX), Method of interconnecting conductors of different layers of a multilayer printed circuit board.

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193. Woith Blake F. (Orange CA) Pasiecznik ; Jr. John (Malibu CA) Crumly William R. (Anaheim CA) Betz Robert K. (Long Beach CA), Method of making a cast elastomer/membrane test probe assembly.

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194. Leedy Glenn J. (1061 E. Mountain Dr. Santa Barbara CA 93108), Method of making a flexible tester surface for testing integrated circuits.

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195. Chen Jimmy Kuo-Wei ; Eldridge Benjamin N. ; Dozier Thomas H. ; Yeh Junjye J. ; Herman Gayle J., Method of making a product with improved material properties by moderate heat-treatment of a metal incorporating a dilute additive.

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196. Mathieu Gaetan L. ; Eldridge Benjamin N. ; Grube Gary W., Method of making and using lithographic contact springs.

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197. Etsuji Suzuki JP; Akira Yonezawa JP; Toshio Okuno JP, Method of making conductive bump on wiring board.

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198. Eldridge Benjamin N. ; Grube Gary W. ; Khandros Igor Y. ; Mathieu Gaetan L., Method of making contact tip structures.

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199. Beaman Brian Samuel ; Fogel Keith Edward ; Lauro Paul Alfred ; Norcott Maurice H. ; Shih Da-Yuan ; Walker George Frederick, Method of making high density integral test probe.

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200. Mathieu, Gaetan L.; Eldridge, Benjamin N.; Grube, Gary W., Method of making lithographic contact springs.

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201. Benjamin N. Eldridge ; Gary W. Grube ; Igor Y. Khandros ; Gaetan L. Mathieu, Method of making microelectronic contact structures.

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202. Eldridge Benjamin N. ; Khandros Igor Y. ; Mathieu Gaetan L. ; Pedersen David V., Method of making microelectronic spring contact elements.

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203. Eldridge Benjamin N. ; Grube Gary W. ; Khandros Igor Y. ; Mathieu Gaetan L., Method of making temporary connections between electronic components.

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204. Grube, Gary W.; Khandros, Igor Y.; Eldridge, Benjamin N.; Mathieu, Gaetan L., Method of manufacturing a probe card.

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205. Grube, Gary W.; Khandros, Igor Y.; Eldridge, Benjamin N.; Mathieu, Gaetan L.; Lotfizadeh, Poya; Tseng, Chih-Chiang, Method of manufacturing a probe card.

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206. Chance Randal W. (Boise ID), Method of manufacturing edge connected semiconductor die.

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207. Khandros Igor Y. (Peekskil NY), Method of manufacturing electrical contacts, using a sacrificial member.

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208. Roberts Joseph A. (Grafton NH), Method of manufacturing printed circuits.

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209. Saijyo, Masakatsu; Kato, Toshiaki, Method of measuring contact resistance of probe and method of testing semiconductor device.

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210. Eldridge Benjamin N. ; Grube Gary W. ; Khandros Igor Y ; Mathieu Gaetan L., Method of modifying the thickness of a plating on a member by creating a temperature gradient on the member, applications for employing such a method, and structures resulting from such a method.

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211. Khandros Igor Y., Method of mounting free-standing resilient electrical contact structures to electronic components.

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212. Eldridge Benjamin N. ; Grube Gary W. ; Khandros Igor Y. ; Mathieu Gaetan L., Method of mounting resilient contact structures to semiconductor devices.

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213. Eldridge Benjamin N. ; Grube Gary W. ; Khandros Igor Y. ; Mathieu Gaetan L., Method of planarizing tips of probe elements of a probe card assembly.

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214. Watanabe Takashi,JPX ; Yoshida Minako,JPX, Method of producing micro contact structure and contact probe using same.

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215. Eldridge Benjamin N. ; Mathieu Gaetan L., Method of severing bond wires and forming balls at their ends.

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216. Khandros Igor Y. ; Mathieu Gaetan L., Method of stacking electronic components.

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217. Eldridge Benjamin N. ; Grube Gary W. ; Khandros Igor Y. ; Mathieu Gaetan L., Method of temporarily, then permanently, connecting to a semiconductor device.

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218. Eldridge Benjamin N. ; Grube Gary W. ; Khandros Igor Y. ; Mathieu Gaetan L., Method of testing semiconductor.

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219. Budnaitis John J. ; Leong Jimmy, Method of wafer level burn-in.

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220. Gaetan L. Mathieu ; Benjamin N. Eldridge ; Gary W. Grube, Methods for making spring interconnect structures.

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221. Dozier, II, Thomas H.; Eldridge, Benjamin N.; Grube, Gary W.; Khandros, Igor Y.; Mathieu, Gaetan L., Methods of removably mounting electronic components to a circuit board, and sockets formed by the methods.

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222. Palagonia Anthony Michael ; Pikna Paul Joseph ; Maddix John Thomas, Micro probe assembly and method of fabrication.

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223. Carver Thomas E. (Mountain View CA), Microcasting of microminiature tips.

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224. Eldridge, Benjamin N.; Grube, Gary W.; Khandros, Igor Y.; Mathieu, Gaetan L., Microelectronic contact structures, and methods of making same.

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225. Eldridge, Benjamin N.; Grube, Gary W.; Khandros, Igor Y.; Mathieu, Gaetan L., Microelectronic contact structures, and methods of making same.

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226. Benjamin N. Eldridge ; Gary W. Grube ; Igor Y. Khandros ; Gaetan L. Mathieu, Microelectronic spring contact element and electronic component having a plurality of spring contact elements.

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227. Eldridge, Benjamin N.; Khandros, Igor Y.; Mathieu, Gaetan L.; Pedersen, David V., Microelectronic spring contact elements.

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228. Grube, Gary W.; Mathieu, Gaetan L., Microelectronic spring contact repair.

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229. Grube, Gary W., Microelectronic spring with additional protruding member.

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230. Akram Salman ; Hembree David R. ; Wood Alan G., Micromachined probe card having compliant contact members for testing semiconductor wafers.

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231. Swapp Mavin (Mesa AZ), Micromachined semiconductor probe card.

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232. Gleason K. Reed (Portland OR) Jones Keith E. (Beaverton OR) Strid Eric W. (Portland OR), Microwave wafer probe having replaceable probe tip.

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233. Majidi-Ahy Gholamreza (Sunnyvale CA) Bloom David M. (Portola Valley CA), Millimeter-wave active probe.

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234. Majidi-Ahy Gholamreza (Sunnyvale CA) Bloom David M. (Portola Valley CA), Millimeter-wave active probe system.

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235. Cheng, Shih-Jye; Liu, An-Hong; Wang, Yeong-Her; Chao, Yeong-Ching; Lee, Yao-Jung, Modularized probe head.

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236. Kurosawa Souichi,JPX ; Matsuda Atsunori,JPX, Motor structure.

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237. Eldridge Benjamin N. ; Grube Gary W. ; Khandros Igor Y. ; Mathieu Gaetan L., Mounting spring elements on semiconductor devices.

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238. Smolley Robert (Porteughese Bend CA), Multi-element circuit construction.

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239. Leong Tony P. ; North Edward S. ; Herbst Richard Linsley, Multi-wavelength laser system, probe station and laser cutter system using the same.

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240. Leong Tony P. ; North Edward S. ; Herbst Richard Linsley, Multi-wavelength variable attenuator and half wave plate.

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241. Mitchell, Scott W.; Rincon, Reynaldo M.; Broz, Jerry; Laugier, Gerard, Multiple contact vertical probe solution enabling Kelvin connection benefits for conductive bump probing.

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242. Miller, Charles A., Multiple die interconnect system.

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243. Yasunaga Soichiro (Kawasaki JPX), Multiple function type D/A converter.

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244. Greub Hans J. (Troy NY) Garuts Valdis E. (Beaverton OR), Multiple lead probe for integrated circuits in wafer form.

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245. Altmann, Stephan Maximilian; H?rber, Johann Karl Heinrich, Multiple local probe measuring device and method.

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246. Pasiecznik ; Jr. John (Malibu CA), Multiport membrane probe for full-wafer testing.

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247. Hasegawa, Kenichi; Saguchi, Toshihiro, NMR probe.

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248. Lim, Yit Aun; Maas, Werner E., NMR probe circuit for generating close frequency resonances.

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249. Ryken, Jr., Marvin L.; Davis, Albert F., Near field probe.

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250. Jun, Tae-Un, Needle assembly of probe card.

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251. Yu, Hyun-Sik; Choi, Ji-Man; Shin, In-Dae, Needle fixture of a probe card in semiconductor inspection equipment and needle fixing method thereof.

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252. Hideo, Hosono; Masahiro, Hirano; Masanori, Oto; Gen, Tochitani; Susumu, Ohneda; Shinnya, Kikugawa, Optical fiber for transmitting ultraviolet ray, optical fiber probe, and method of manufacturing the optical fiber probe.

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253. Henson, Roy, PC board having clustered blind vias.

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254. Richard S. Roy ; Charles A. Miller, Parallel testing of integrated circuit devices using cross-DUT and within-DUT comparisons.

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255. Grube Gary W. ; Khandros Igor Y. ; Mathieu Gaetan L., Partially-overcoated elongate contact structures.

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256. Knibbe Jan C. (Detroit MI) McPhee Willard J. (Bloomfield Hills MI), Piercing apparatus.

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257. Veenendaal Cornelis T. (Cornelius OR), Piezoelectric pressure sensing apparatus for integrated circuit testing stations.

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258. Mathieu, Gaetan L.; Eldridge, Benjamin N.; Grube, Gary W., Planarizer for a semiconductor contactor.

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259. Beaman Brian Samuel ; Fogel Keith Edward ; Lauro Paul Alfred ; Shih Da-Yuan, Pluggable chip scale package.

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260. Tsay Shi-chour (Taoyuan Hsien TWX) Ho Jen-hsin (Taoyuan Hsien TWX), Portable lock stitch sewing machine.

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261. Inoue Mitsuru (Utsunomiya JPX), Positioning stage device exposure apparatus and device manufacturing method utilizing the same.

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262. Eldridge, Benjamin N.; Miller, Charles A., Predictive, adaptive power supply for an integrated circuit under test.

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263. Yamaguchi Masao (Tokyo JPX), Probe apparatus.

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264. Yoshioka, Haruhiko, Probe apparatus.

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265. Takebuchi, Ryuichi, Probe apparatus and method of alignment for the same.

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266. Evans Arthur (Brookfield Center CT) Baker Joseph R. (New Milford CT) Lander Jack (Danbury CT), Probe assembly for testing integrated circuit devices.

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267. Ji, Joon-Su; Hwang, In-Seok; Lee, Doo-Seon; Kim, Byoung-Joo; Ro, Young-Kyo; Lee, Ho-Yeol, Probe card.

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268. Sugawara, Shinichi, Probe card.

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269. Sharif, Adam K., Probe card and probe needle for high frequency testing.

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270. Higgins H. Dan (323 E. Redfield Chandler AZ 85225), Probe card apparatus.

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271. Eldridge, Benjamin N.; Grube, Gary W.; Khandros, Igor Y.; Mathieu, Gaetan L., Probe card assembly.

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272. Eldridge, Benjamin Niles; Grube, Gary William; Khandros, Igor Yan; Mathieu, Gaetan L., Probe card assembly and kit, and methods of making same.

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273. Eldridge Benjamin N. ; Grube Gary W. ; Khandros Igor Y. ; Mathieu Gaetan L., Probe card assembly and kit, and methods of using same.

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274. Eldridge, Benjamin N.; Grube, Gary W.; Mathieu, Gaetan L., Probe card assembly for contacting a device with raised contact elements.

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275. Miller, Charles A., Probe card cooling assembly with direct cooling of active electronic components.

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276. Lou, Choon-Leong; Hsu, Mei-Shu, Probe card for electrical testing a chip in a wide temperature range.

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277. Kirby, Kyle K., Probe card for use with microelectronic components, and methods for making same.

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278. Okubo Kazumasa (Kanagawa JPX) Okubo Masao (Nishinomiya JPX) Yoshimitsu Yasuro (Takatsuki JPX) Sugaya Kiyoshi (Amagasaki JPX), Probe card in which contact pressure and relative position of each probe end are correctly maintained.

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279. Sporck, A. Nicholas; Shinde, Makarand S., Probe card with coplanar daughter card.

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280. Soejima Koji,JPX ; Senba Naoji,JPX, Probe card with plural probe tips on a unitary flexible tongue.

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281. Ikeda Towl (Kofu JPX), Probe device having micro-strip line structure.

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282. Pasiecznik ; Jr. John (Malibu CA), Probe for jesting an electrical circuit chip.

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283. Gleason, K. Reed; Lesher, Tim; Strid, Eric W.; Andrews, Mike; Martin, John; Dunklee, John; Hayden, Leonard; Safwat, Amr M. E., Probe for testing a device under test.

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284. Maeda, Yasuhiro; Takayanagi, Fumikazu, Probe module and a testing apparatus.

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285. Brown John ; Costello Matthew J. ; DosSantos Luciano P. ; Ruck Robin, Probe station adapter for backside emission inspection.

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286. Brian Samuel Beaman ; Keith Edward Fogel ; Paul Alfred Lauro ; Yun-Hsin Liao ; Daniel Peter Morris ; Da-Yuan Shih, Probe structure having a plurality of discrete insulated probe tips.

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287. Karavakis, Konstantine N.; Nguyen, Tom T., Probe structures using clamped substrates with compliant interconnectors.

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288. Boll Gregory George ; Boll Harry Joseph, Probe tip structure.

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289. Martens, Jon S., Probe tone S-parameter measurements.

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290. Brassell, Gilbert; Wickland, Terry J.; Popish, Darold M., Probe with integral vent, sampling port and filter element.

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291. Kobayashi, Masahito; Yoshioka, Haruhiko; Fujita, Takafumi, Prober.

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292. Sakagawa, Hideo; Watanabe, Takashi, Probing method and prober.

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293. Sun, Luen-Chian, Probing of device elements.

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294. Stevens, Mac, Process and apparatus for adjusting traces.

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295. Stevens, Mac; Parent, Yves, Process and apparatus for finding paths through a routing space.

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296. Hedrick Jeffrey Curtis ; Hedrick James Lupton ; Hilborn Jons Gunnar,CHX ; Liao Yun-Hsin ; Miller Robert Dennis ; Shih Da-Yuan, Process for making a foamed elastomeric polymer.

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297. Hedrick Jeffrey Curtis ; Hedrick James Lupton ; Hilborn Jons Gunnar,CHX ; Liao Yun-Hsin ; Miller Robert Dennis ; Shih Da-Yuan, Process for making a foamed elastometric polymer.

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298. Hedrick Jeffrey Curtis (Park Ridge NJ) Hedrick James Lupton (Pleasanton CA) Liao Yun-Hsin (W. Nyack NY) Miller Robert Dennis (San Jose CA) Shih Da-Yuan (Poughkeepsie NY), Process for making a foamed polymer.

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299. Yoshizawa Tetsuo (Yokohama JPX) Miyazaki Toyohide (Inashiki JPX) Kondo Hiroshi (Osaka JPX) Sakaki Takashi (Tokyo JPX) Terayama Yoshimi (Odawara JPX) Tamura Yoichi (Tokyo JPX) Okabayashi Takahiro (Tok, Process for preparing electrical connecting member.

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300. Ayala-Esquilin Juan (San Jose CA) Beaman Brian S. (Hyde Park NY) Haring Rudolf A. (Cortlandt Manor NY) Hedrick James L. (Pleasanton CA) Shih Da-Yuan (Poughkeepsie NY) Walker George F. (New York NY), Process of making pinless connector.

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301. Chang Sung Chul ; Khandros Igor Y. ; Smith William D., Process of mounting spring contacts to semiconductor devices.

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302. Chong Fu Chiung, Programmable high-density electronic device testing.

     상세보기
303. Plotnikov, Yuri Alexeyevich; Batzinger, Thomas James; Nath, Shridhar Champaknath; Dewangan, Sandeep Kumar; Lester, Carl Stephen; Herd, Kenneth Gordon; Rose, Curtis Wayne, Pulsed eddy current sensor probes and inspection methods.

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304. Igor Y. Khandros ; Gaetan L. Mathieu, Raised contact structures (solder columns).

     상세보기
305. Worledge, Daniel, Reduction of positional errors in a four point probe resistance measurement.

     상세보기
306. Eldridge, Benjamin N.; Grube, Gary W.; Khandros, Igor Y.; Mathieu, Gaetan L., Resilient contact structures for interconnecting electronic devices.

     상세보기
307. Khandros Igor Y. ; Mathieu Gaetar L., Resilient contact structures, electronic interconnection component, and method of mounting resilient contact structures to electronic components.

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308. Inuta Kazuo (Yokaichi JPX), Rotary board treating apparatus.

     상세보기
309. Yanagisawa Ken (Matsumoto JPX), Rotary drive positioning system for an indexing table.

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310. Sago Hiroyoshi (Kanagawa JPX) Mizuki Hideyuki (Kanagawa JPX) Kudo Katsuhiko (Kanagawa JPX), Rotary-cup coating apparatus.

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311. Teramachi Hiroshi (34-8 ; Higashitamagawa 2-chome Setagaya-ku ; Tokyo JPX), Rotational positioning device.

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312. Eslamy, Mohammad; Pedersen, David V; Cobb, Harry D., Segmented contactor.

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313. Schaeffer, Ralph; Crump, Brett, Selectively configurable microelectronic probes.

     상세보기
314. Huff Richard E. (Belmont CA) Matta Farid (Mountain View CA), Self-leveling membrane probe.

     상세보기
315. Hirano Toshiki,JPX ; Kimura Atsuo,JPX ; Mori Shinichiro,JPX, Semi-conductor chip test probe and process for manufacturing the probe.

     상세보기
316. Masuoka, Sadaaki, Semiconductor device including gate insulation films having different thicknesses.

     상세보기
317. Khandros Igor Y. ; Mathieu Gaetar L., Semiconductor devices with integral contact structures.

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318. Benjamin N. Eldridge, Semiconductor fuse covering.

     상세보기
319. Dogaru, Teodor; Smith, Stuart T., Sensors and probes for mapping electromagnetic fields.

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320. Afshari Bahram (Menlo Park CA) Matta Farid (Mountain View CA) Hanlon Lawrence (Menlo Park CA), Shearing stress interconnection apparatus and method.

     상세보기
321. Tajima Kenji (Kanagawa JPX) Takahashi Motoaki (Kanagawa JPX) Watanabe Hideo (Kanagawa JPX) Shoji Takashi (Kanagawa JPX) Arai Noboru (Kanagawa JPX), Sheet film package and device for loading sheet films.

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322. Sinclair, William Y., Shielded integrated circuit probe.

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323. Edward J. Hager ; Rondal K. Harmon, Jr., Single tip Kelvin probe.

     상세보기
324. Dozier ; II Thomas H. ; Eldridge Benjamin N. ; Grube Gary W. ; Khandros Igor Y. ; Mathieu Gaetan L. ; Pedersen David V. ; Stadt Michael A., Sockets for "springed" semiconductor devices.

     상세보기
325. Dozier ; II Thomas H. ; Eldridge Benjamin N. ; Grube Gary W. ; Khandros Igor Y. ; Mathieu Gaetan L. ; Pedersen David V. ; Stadt Michael A., Sockets for "springed" semiconductor devices.

     상세보기
326. Dozier, II, Thomas H.; Eldridge, Benjamin N.; Grube, Gary W.; Khandros, Igor Y.; Mathieu, Gaetan L.; Pedersen, David V.; Stadt, Michael A., Sockets for "springed" semiconductor devices.

     상세보기
327. Dozier, II, Thomas H.; Eldridge, Benjamin N.; Grube, Gary W.; Khandros, Igor Y.; Mathieu, Gaetan L.; Pederson, David V.; Stadt, Michael A., Sockets for "springed" semiconductor devices.

     상세보기
328. Dozier ; II Thomas H. ; Eldridge Benjamin N. ; Grube Gary W. ; Khandros Igor Y. ; Mathieu Gaetan L., Sockets for electronic components and methods of connecting to electronic components.

     상세보기
329. Drake Robert E. (Somers NY) Faris Sadeg M. (Pleasantville NY) Patt Roy M. (Walden NY) Shen Zhi-Yuan (Ossining NY), Soft probe for providing high speed on-wafer connections to a circuit.

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330. Dozier ; II Thomas H. ; Khandros Igor Y., Solder preforms.

     상세보기
331. Munson, Eric Jon; Offerdahl, Thomas James; Schieber, Loren Joseph, Solid-state nuclear magnetic resonance probe.

     상세보기
332. Benjamin N. Eldridge ; Igor Y. Khandros ; David V. Pedersen ; Ralph G. Whitten, Special contact points for accessing internal circuitry of an integrated circuit.

     상세보기
333. Eldridge, Benjamin N.; Khandros, Igor Y.; Pedersen, David V.; Whitten, Ralph G., Special contact points for accessing internal circuitry of an integrated circuit.

     상세보기
334. Eldridge, Benjamin N.; Khandros, Igor Y.; Pedersen, David V.; Whitten, Ralph G., Special contact points for accessing internal circuitry of an integrated circuit.

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335. Eldridge, Benjamin N.; Khandros, Igor Y.; Pedersen, David V.; Whitten, Ralph G., Special contact points for accessing internal circuitry of an integrated circuit.

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336. Mathieu, Gaetan L.; Eldridge, Benjamin N.; Grube, Gary W.; Larder, Richard A., Spring interconnect structures.

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337. Hemmie Dale L. (Burlington IA) Evans Robert M. (Hightstown NJ), Stacked dual dipole MMDS feed.

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338. Eldridge, Benjamin N., Stacked semiconductor device assembly with microelectronic spring contacts.

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339. Khandros Igor Y. ; Pedersen David V., Stacking semiconductor devices, particularly memory chips.

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340. Beaman Brian Samuel ; Fogel Keith Edward ; Lauro Paul Alfred ; Shih Da-Yuan, Structures and processes to create a desired probetip contact geometry on a wafer test probe.

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341. Miller, Charles A., System for calibrating timing of an integrated circuit wafer tester.

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342. Long, John, System for measuring signal path resistance for an integrated circuit tester interconnect structure.

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343. Thiessen, William F., Temperature compensated vertical pin probing device.

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344. Eldridge, Benjamin N.; Khandros, Igor Y.; Pedersen, David V.; Whitten, Ralph G., Test assembly including a test die for testing a semiconductor product die.

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345. Eldridge, Benjamin N.; Wenzel, Stuart W., Test head assembly for electronic components with plurality of contoured microelectronic spring contacts.

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346. Evans Arthur (Brookfield Center CT) Baker Joseph R. (New Milford CT) Rising Robert P. (Trumbull CT), Test probe assembly for testing integrated circuit devices.

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347. Lee, Sang-Bin; Kliman, Gerald Burt; Mall, Waheed Tony, Test probe for electrical devices having low or no wedge depression.

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348. Beaman Brian Samuel ; Fogel Keith Edward ; Lauro Paul Alfred ; Norcott Maurice Heathcote ; Shih Da-Yuan ; Walker George Frederick, Test probe for high density integrated circuits, methods of fabrication thereof and methods of use thereof.

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349. Beaman Brian S. (Hyde Park NY) Fogel Keith E. (Bardonia NY) Lauro Paul A. (Nanuet NY) Norcott Maurice H. (Valley Cottage NY) Shih Da-Yuan (Poughkeepsie NY) Walker George F. (New York NY), Test probe having elongated conductor embedded in an elostomeric material which is mounted on a space transformer.

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350. Miller, Charles A., Test signal distribution system for IC tester.

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351. Miller, Charles A., Tester channel to multiple IC terminals.

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352. Byrnes Herbert P. (Poughkeepsie NY) Halbout Jean-Marc (Larchmont NY) Scheuermann Michael R. (Katonah NY) Shapiro Eugene (Stamford CT), Thin interface pellicle for dense arrays of electrical interconnects.

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353. Beaman Brian S. (Hyde Park NY) Doany Fuad E. (Katonah NY) Fogel Keith E. (Bardonia NY) Hedrick ; Jr. James L. (Oakland CA) Lauro Paul A. (Nanuet NY) Norcott Maurice H. (Valley Cottage NY) Ritsko John, Three dimensional high performance interconnection package.

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354. Barr, Andrew Harvey; Logan, Gary, Tip and tip assembly for a signal probe.

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355. Matsunaga Kouji,JPX ; Inoue Hirobumi,JPX ; Tanehashi Masao,JPX ; Taura Toru,JPX ; Nikaidou Masahiko,JPX ; Yamagishi Yuuichi,JPX ; Hayakawa Satoshi,JPX, Tip portion structure of high-frequency probe and method for fabrication probe tip portion composed by coaxial cable.

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356. Ference Thomas G. ; Howell Wayne J., Ultra fine probe contacts.

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357. McTigue, Michael Thomas, Voltage probe.

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358. Lockwood Larry R. (McMinnville OR) Gleason Kimberly R. (Portland OR) Strid Eric W. (Portland OR), Wafer probe.

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359. Strid Eric W. (Portland OR) Gleason Kimberly R. (Portland OR), Wafer probe.

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360. Sang Emmanuel (Portland OR) Estabrook Gary L. (Vancouver WA), Wafer probe head.

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361. Hollman, Kenneth F., Wafer probe station.

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362. Barsotti Christina C. (Vancouver WA) Schamel Alfred H. (West Linn OR), Wafer probe with transparent loading member.

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363. Khandros Igor Y. ; Pedersen David V., Wafer-level burn-in and test.

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364. Khandros, Igor Y.; Pedersen, David V., Wafer-level burn-in and test.

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365. Khandros, Igor Y.; Pedersen, David V., Wafer-level burn-in and test.

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366. Eldridge Benjamin N. ; Grube Gary W. ; Khandros Igor Y. ; Mathieu Gaetan L., Wafer-level test and burn-in, and semiconductor process.

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367. Martin, John T., Waveguide with adjustable backshort.

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368. Patrick G. Kim ; Donald L. Smith ; Andrew S. Alimonda, Wear-resistant spring contacts.

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