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Abrasive articles and methods for the manufacture and use of same 원문보기

IPC분류정보
국가/구분 United States(US) Patent 등록
국제특허분류(IPC7판)
  • B24B-049/00
  • B24B-051/00
  • B24B-005/00
  • B24B-029/00
출원번호 US-0115538 (2002-04-03)
발명자 / 주소
  • Palmgren,Gary M.
출원인 / 주소
  • 3M Innovative Properties Company
인용정보 피인용 횟수 : 1  인용 특허 : 31

초록

The invention provides an abrasive article, and methods for the use and the manufacture of the article. The abrasive article comprises an abrasive surface; and a performance index associated with the abrasive article, the index indicating an aspect of the abrasive performance of the article. In abra

대표청구항

What is claimed is: 1. A process for characterizing the performance of an abrasive article for abrading a workpiece, the workpiece comprising a first material and having an abradable surface, the process comprising: (a) providing an abrasive article having an abrasive surface; (b) providing a test

이 특허에 인용된 특허 (31)

  1. Scott R. Culler ; John J. Gagliardi ; Thomas W. Larkey ; Eric G. Larson ; Larry L. Martin ; Jeffrey W. Nelson, Abrasive article and method of making.
  2. Bruxvoort, Wesley J., Abrasive article suitable for modifying a semiconductor wafer.
  3. Helmin Harvey J. (Golden Valley MN), Abrasive articles comprising a grinding aid dispersed in a polymeric blend binder.
  4. Kummeth Charles R. ; Muilenburg Michael J. ; Forsberg Gary B. ; Streifel Robert J. ; Pendergrass ; Jr. Daniel B., Abrasive processing apparatus and method employing encoded abrasive product.
  5. Whyte ; Jr. Robert E. (Encinitas CA) Alcudia Ezra R. (San Diego CA), Apparatus and method for tape velocity and tension control in a capstanless magnetic tape transport.
  6. Huang Pao-Ter ; Cai Christopher Chunsheng ; Snyder ; Jr. Joseph P. ; Lecko John H. ; Janik Jaroslav ; Penkar Rajan Chandrakant ; Jackson Peter Douglas, Apparatus for measuring length of accumulated packages.
  7. Goers Brian D. ; Heuermann Troy W. ; Palmgren Gary M., Apparatus for rotative abrading applications.
  8. Lund Douglas E. (13304 Purple Sage Dallas TX 75240), Automatic chemical and mechanical polishing system for semiconductor wafers.
  9. Peterson Jeffrey S. (Hudson WI) Oseth Donald L. (West St. Paul MN), Coated abrasive article and a method of making same.
  10. Hahn Robert (26 Rice Ave. Northboro MA 01532), Computer-controlled grinding machine.
  11. Li Shijian ; Huey Sidney ; Emami Ramin ; Redeker Fritz ; White John, Conditioning fixed abrasive articles.
  12. Tolles Robert D. ; Shendon Norm ; Somekh Sasson ; Perlov Ilya ; Gantvarg Eugene ; Lee Harry Q., Continuous processing system for chemical mechanical polishing.
  13. Goers Brian D., Corrosion resistant abrasive article and method of making.
  14. Henneberger Stacy A. (Apple Valley MN) Hill Christopher L. (Woodbury WA) Molstad Richard W. (St. Paul MN) Olson Alan R. (Cottage Grove MN) Seeman Steven R. (Stillwater MN), Data cartridge with magnetic tape markers.
  15. Smith Roderick L. (Rockford IL), Grinding control methods and apparatus.
  16. Kogure Toshiharu (Narashino JPX), Grinding machine control system for intermittently measuring workpiece size.
  17. Meikle Scott G. (Boise ID), Method and apparatus for measuring a change in the thickness of polishing pads used in chemical-mechanical planarization.
  18. Moore Scott E., Method and apparatus for mechanical polishing.
  19. Wang, Gou-Jen; Tsai, Jhy-Cherng; Chen, Jau-Liang, Method for determining efficiently parameters in chemical-mechanical polishing (CMP).
  20. Mirsch Miroslav (Prague CSX) Rosberg Frantisek (Prague CSX) Ruzicka Miroslav (Prague CSX), Method of adaptive control of a recessing cycle on a grinding machine and apparatus therefor.
  21. Keller Kevin A. ; Whitman ; Jr. Gerald A., Method of determining performance characteristics of polishing pads.
  22. Olsen John H. (Vashon WA), Motion control with precomputation.
  23. Vishnu K. Agarwal ; Scott G. Meikle, Polishing pads and planarizing machines for mechanical or chemical-mechanical planarization of microelectronic-device substrate assemblies, and methods for making and using such pads and machines.
  24. Smith Roderick L. (2012 Greenfield La. Rockford IL 61107), Predictive high wheel speed grinding system.
  25. Liefke Johannes (Bensheim DEX) Nickel Bernd (Lorsch DEX) Pabst Josef (Heddesheim DEX) Fleer Otto (Bensheim DEX), Recognition system for tools insertable into dental treatment instruments.
  26. Evans Christopher James ; Parks Robert Edson, Renewable polishing lap.
  27. Ali Christopher A. (2109 Beaver Valley Rd. Beavercreek OH 45385) Ali Terry L. (2645 Pheasant Run La. Beavercreek OH 45434) Karlstrom Ralf (Nedranvgen 25 FIN-66840 Pensala FIX), Single sheet sandpaper delivery system and sandpaper sheet therefor.
  28. Pieper Jon R. (Lindstrom MN) Olson Richard M. (Stillwater MN) Mucci Michael V. (Hudson WI) Holmes Gary L. (Vadnais Heights MN) Heiti Robert V. (St. Paul MN), Structured abrasive article.
  29. Kao Shu-Hsin ; Chang Shou-sung ; Tzeng Huey M. ; Lee Gregory C. ; Simon Greg ; Lee Harry ; Weldon David E. ; Kwong Garry ; Lapson William F. ; Appel Gregory A. ; Mok Peter, Temperature regulation in a CMP process.
  30. Maxey Robert E. L. (North Huntington PA) Brecker James N. (Pittsburgh PA), Tool life monitoring and tracking apparatus.
  31. Tran Hung T. (Woodbury MN) Chavez ; Jr. George L. (Cottage Grove MN) Youngquist Robert J. (White Bear Lake MN), Track servo control method for data cartridge tape drives.

이 특허를 인용한 특허 (1)

  1. Chopra, Manoj; Gee, Glenn Paul; Lelong, Xavier Charles, System, method and apparatus for lapping workpieces with soluble abrasives.
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