A substrate delivery mechanism comprises a top ring, a substrate loader for loading a substrate, and a pusher mechanism, wherein the substrate loader comprises a top ring guide and the pusher mechanism comprises a top ring guide lifting table, in which the top ring guide and the top ring guide lifti
A substrate delivery mechanism comprises a top ring, a substrate loader for loading a substrate, and a pusher mechanism, wherein the substrate loader comprises a top ring guide and the pusher mechanism comprises a top ring guide lifting table, in which the top ring guide and the top ring guide lifting table together form a sealed space below the substrate held by the top ring in a condition where the substrate loader is moved up by the pusher mechanism, wherein the substrate is detached from the top ring by exhausting the sealed space while at the same time injecting a fluid from through-holes provided in a substrate holding surface of the top ring.
대표청구항▼
What is claimed is: 1. A substrate delivery method comprising: transferring a substrate, held by a substrate holder of a holder mechanism, from said substrate holder to a substrate loader of a pusher mechanism such that said substrate is received by said substrate loader, wherein when said substrat
What is claimed is: 1. A substrate delivery method comprising: transferring a substrate, held by a substrate holder of a holder mechanism, from said substrate holder to a substrate loader of a pusher mechanism such that said substrate is received by said substrate loader, wherein when said substrate is to be transferred from said substrate holder to said substrate loader, a substrate holder side of said substrate is put under positive pressure and a substrate loader side of said substrate is put under negative pressure. 2. The substrate delivery method according to claim 1, wherein said pusher mechanism includes an elevator for moving up and down said substrate loader. 3. The substrate delivery method according to claim 2, wherein said substrate loader side of said substrate is put under negative pressure by bringing said substrate loader into contact with said substrate and applying a negative pressure to through-holes formed in a substrate contact surface of said substrate loader. 4. The substrate delivery method according to claim 3, further comprising: after said substrate loader has received said substrate, applying a positive pressure to said through-holes formed in said substrate contact surface. 5. The substrate delivery method according to claim 4, further comprising: before said substrate is held by said substrate holder, or when said substrate holder side of said substrate is put under positive pressure, spraying a surfactant over said substrate contact surface and/or over a substrate holder side surface of said substrate. 6. The substrate delivery method according to claim 3, further comprising: before said substrate is held by said substrate holder, or when said substrate holder side of said substrate is put under positive pressure, spraying a surfactant over said substrate contact surface and/or over a substrate holder side surface of said substrate. 7. The substrate delivery method according to claim 2, wherein said substrate loader side of said substrate is put under negative pressure by exhausting a space defined within said pusher mechanism on said substrate loader side of said substrate. 8. The substrate delivery method according to claim 2, further comprising: before said substrate is held by said substrate holder, or when said substrate holder side of said substrate is put under positive pressure, spraying a surfactant over a substrate holder side surface of said substrate. 9. The substrate delivery method according to claim 1, wherein said substrate loader side of said substrate is put under negative pressure by bringing said substrate loader into contact with said substrate and applying a negative pressure to through-holes formed in a substrate contact surface of said substrate loader. 10. The substrate delivery method according to claim 9, further comprising: after said substrate loader has received said substrate, applying a positive pressure to said through-holes formed in said substrate contact surface. 11. The substrate delivery method according to claim 9, further comprising: before said substrate is held by said substrate holder, or when said substrate holder side of said substrate is put under positive pressure, spraying a surfactant over said substrate contact surface and/or over a substrate holder side surface of said substrate. 12. The substrate delivery method according to claim 1, wherein said substrate holder comprises an elastic membrane as a substrate holding surface, and said substrate is to be pressed against a polishing surface by fluid pressure via said elastic membrane. 13. The substrate delivery method according to claim 12, wherein said pusher mechanism includes an elevator for moving up and down said substrate loader. 14. The substrate delivery method according to claim 1, wherein said substrate loader side of said substrate is put under negative pressure by exhausting a space defined within said pusher mechanism on said substrate loader side of said substrate. 15. The substrate delivery method according to claim 1, further comprising: before said substrate is held by said substrate holder, or when said substrate holder side of said substrate is put under positive pressure, spraying a surfactant over a substrate holder side surface of said substrate. 16. A substrate delivery method comprising: transferring a substrate, held by a substrate holder of a holder mechanism, from said substrate holder to a substrate loader of a pusher mechanism, wherein when said substrate is to be transferred from said substrate holder to said substrate loader, a substrate holder side of said substrate is put under positive pressure to thereby transfer said substrate, and wherein, before said substrate is held by said substrate holder or when said substrate holder side of said substrate is put under positive pressure, a surfactant is applied over a substrate contact surface of said substrate loader and/or over a substrate holder side surface of said substrate. 17. The substrate delivery method according to claim 16, wherein said surfactant is applied over a substrate contact surface of said substrate loader and/or over a substrate holder side surface of said substrate by being sprayed over said substrate contact surface of said substrate loader and/or over said substrate holder side surface of said substrate. 18. The substrate delivery method according to claim 17, wherein said pusher mechanism includes an elevator for moving up and down said substrate loader. 19. A substrate delivery method comprising: when a sealed space defined below a substrate, held by a substrate holder of a holder mechanism, is exhausted, transferring said substrate from said substrate holder to a substrate loader of a pusher mechanism such that said substrate is received by said substrate loader. 20. The substrate delivery method according to claim 19, wherein said pusher mechanism includes an elevator for moving up and down said substrate loader.
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이 특허에 인용된 특허 (4)
Lin Bih-Tiao,TWX ; Yang Fu-Liang,TWX, Apparatus for polishing and cleaning a wafer.
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