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A method and apparatus for making reliable miniature semiconductor packages having a reduced height and footprint is provided. The package includes a semiconductor chip having an active surface and a non-active surface and one or more contacts positioned adjacent the semiconductor chip. Electrical

A method and apparatus for making reliable miniature semiconductor packages having a reduced height and footprint is provided. The package includes a semiconductor chip having an active surface and a non-active surface and one or more contacts positioned adjacent the semiconductor chip. Electrical connections are formed between the contacts and the semiconductor chip. An adhesive tape provided adjacent the non-active surface of the semiconductor chip and the one or more contacts positioned adjacent the semiconductor chip. An adhesive material provided between the non-active surface of the chip and the adhesive tape.

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We claim: 1. An apparatus, comprising: a semiconductor chip having an active surface and a non-active surface; a plurality of contacts positioned adjacent the semiconductor chip, the plurality of contacts each having a first end of varying lengths respectively, the varying lets of the plurality of

We claim: 1. An apparatus, comprising: a semiconductor chip having an active surface and a non-active surface; a plurality of contacts positioned adjacent the semiconductor chip, the plurality of contacts each having a first end of varying lengths respectively, the varying lets of the plurality of contacts provided under the semiconductor chip for providing a support surface for the semiconductor chip, the plurality of contacts entirely supporting the semiconductor chip without the use of a die attach pad; electrical connections between the contacts and the semiconductor chip; an adhesive tape provided adjacent the non-active surface of the semiconductor chip and the one or more contacts positioned adjacent the semiconductor chip; and an adhesive material provided between and in direct contact with the non-active surface of the chip and the adhesive tape. 2. The apparatus of claim 1, wherein the adhesive material is a non-conductive epoxy. 3. The apparatus of claim 1, wherein the adhesive material is a conductive epoxy. 4. The apparatus if claim 3, wherein the conductive epoxy contains a silver resin. 5. The apparatus of claim 1, wherein the adhesive material is a double-stick tape applied to the non-active surface of the semiconductor device. 6. The apparatus of claim 1, wherein the semiconductor chip rests upon the first end of the plurality of contacts. 7. The apparatus of claim 6, wherein the adhesive material is a non-conductive tape positioned between the semiconductor chip and the one or more contacts. 8. The apparatus of claim 1, further comprising an encapsulant material to encapsulate the semiconductor chip and one or more contacts. 9. The apparatus of claim 1, wherein the contacts are leads. 10. The apparatus of claim 9, wherein the semiconductor chip is supported on the leads. 11. The apparatus of claim 9, wherein the leads are bottom etched. 12. The apparatus of claim 9, wherein the leads are top etched. 13. An apparatus, comprising: one or more leads, the one or more leads each having a first end of varying lengths respectively; a semiconductor chip having an active surface and a non-active surface, the non-active surface of the semiconductor chip being supported by the varying lengths of the first end of the one or more leads respectively, the semiconductor chip being entirely supported on the one or more leads without a die attach pad; a non-conductive material positioned between and directly in contact with both the non-active surface of the semiconductor chip and the one or more leads; and an adhesive tape on the non-conductive material, the adhesive tape acting to adhere the semiconductor chin onto the one or more leads. 14. The apparatus of claim 13, wherein the adhesive material is a non-conductive epoxy. 15. The apparatus of clam 13, wherein the adhesive material is a conductive epoxy.