Copper molybdenum electroless deposition process and materials
원문보기
IPC분류정보
국가/구분
United States(US) Patent
등록
국제특허분류(IPC7판)
C23C-018/48
C23C-018/16
출원번호
US-0750716
(2004-01-02)
발명자
/ 주소
Shacham Diamand,Yossi
Sverdlov,Yelena
출원인 / 주소
Ramot At Tel Aviv University Ltd.
대리인 / 주소
Abelman, Frayne & Schwab
인용정보
피인용 횟수 :
1인용 특허 :
7
초록▼
Materials and methods are described for electroless deposition of copper molybdenum. An aqueous bath composition for the electroless deposition of copper molybdenum includes; a soluble source of copper ions, a soluble source of molybdenum ions, and a reducing agent comprising boron, wherein the c
Materials and methods are described for electroless deposition of copper molybdenum. An aqueous bath composition for the electroless deposition of copper molybdenum includes; a soluble source of copper ions, a soluble source of molybdenum ions, and a reducing agent comprising boron, wherein the composition is adapted to electrolessly produce a copper molybdenum deposit.
대표청구항▼
The invention claimed is: 1. An aqueous bath composition for the electroless deposition of copper molybdenum, comprising, in addition to water: a soluble source of copper ions; a soluble source of molybdenum ions; and a reducing agent comprising boron; wherein said composition is adapted to electro
The invention claimed is: 1. An aqueous bath composition for the electroless deposition of copper molybdenum, comprising, in addition to water: a soluble source of copper ions; a soluble source of molybdenum ions; and a reducing agent comprising boron; wherein said composition is adapted to electrolessly produce a copper molybdenum deposit having a resistivity of less than 30 microohm. cm, and wherein said soluble source of molybdenum ions comprises molybdic acid monohydrate (H2MoO4.H2O). 2. A composition according to claim 1, wherein said copper molybdenum deposit has a resistivity of less than 10 microohm.cm. 3. A composition according to claim 1, wherein said composition is substantially devoid of alkali metals and alkaline earth metals. 4. A composition according to claim 1, wherein said soluble source of copper ions comprises copper sulfate. 5. A composition according to claim 4, wherein said copper sulfate comprises copper sulfate pentahydrate (CuSO4.5H2 O) at a concentration of 2-10 g/l. 6. A composition according to claim 5, wherein said copper sulfate pentahydrate is at a concentration of 3-5 g/l. 7. A composition according to claim 1, wherein said molybdic acid monohydrate is present in said composition at a concentration of 0-5 g/l. 8. A composition according to claim 7, wherein said molybdic acid monohydrate is present at a concentration of 1.5-3 g/l. 9. A composition according to claim 1, wherein the reducing agent is selected from the group consisting of sodium borohydride, potassium borohydride, borane pyridine complex and a borazane selected from the group consisting of dimethylamineborane (DMAB), borane triethylamine (TEAB), DMAB-complex and TEAB-complex. 10. A composition according to claim 9, wherein said borazane is of the formula RxNHy.BH(x+y), wherein x is an integer between 0 and 3, wherein y is an integer between 0 and 3, and wherein R is an organic group selected from the group consisting of methyl and ethyl. 11. A composition according to claim 9, wherein the reducing agent comprises dimethylamineborane. 12. A composition according to claim 11, wherein the reducing agent comprises a dimethylamineborane.complex. 13. A composition according to claim 12, wherein said dimethylamineborane complex is present at a concentration of 5-20 g/l. 14. A composition according to claim 13, wherein said dimethylamineborane complex is present at a concentration of 7-12 g/l. 15. A composition according to claim 10, further comprising tetra-methyl ammonium hydroxide (TMAH) at a concentration of 50-100 g/l. 16. A composition according to claim 1, further comprising ammonium hydroxide. 17. A composition according to claim 16, wherein said ammonium hydroxide is at a concentration of less than 20 ml/l. 18. A composition according to claim 1, wherein the pH is between 8-12. 19. A composition according to claim 18, wherein the pH is between 9-11. 20. A composition according to claim 1, wherein said composition is adapted to produce a copper molybdenum deposit having at least one of the following properties: (i) a change in reliability as defined by mean-time-to-failure during electro-migration testing of more than a factor of ten; (ii) a void density of less than 0.5/cm2; (iii) a grain boundary diffusion coefficient of less than 10-8.3. e-1.25 ev/kT; (iv) a grain boundary diffusion coefficient, Do of 10-8.3 cm/s; and (v) a distribution of grain sizes having a standard deviation of less than 3 nm. 21. A composition according to claim 1, wherein said composition is adapted to electrolessly deposit copper molybdenum at a temperature of less than 60° C. 22. A composition according to claim 21, wherein said composition is adapted to electrolessly deposit copper molybdenum at a temperature of between 40° C. to about 50° C. 23. A composition according to claim 1, further comprising a surfactant. 24. A composition according to claim 23, wherein said surfactant comprises at least one of Polyoxyethylene Alkyl Phenol Phosphate Ester and C14H22O(C2H4O) n having an average number of ethylene oxide units per molecule of 9-10. 25. An aqueous bath composition for the electroless deposition of copper molybdenum, comprising, in addition to water: a soluble source of copper ions; a soluble source of molybdenum ions; a soluble source of citrate ions; and a reducing agent comprising boron; and wherein said composition is adapted to electrolessly produce a copper molybdenum deposit having a resistivity of less than 300 microohm.cm, and wherein said source of molybdenum comprises molybdic acid monohydrate(H2MoO4.H2O). 26. A composition according to claim 25, wherein said soluble source of citrate ions comprises sodium citrate. 27. A composition according to claim 25, wherein said copper molybdenum deposit has a resistivity of less than 100 microohm.cm. 28. A composition according to claim 25, wherein said composition is substantially devoid of alkali metals and alkaline earth metals. 29. A composition according to claim 24, wherein said soluble source of copper ions comprises copper sulfate. 30. A composition according to claim 29, wherein said copper sulfate comprises copper sulfate pentahydrate (CuSO4.5H2 O) at a concentration of 2-10 g/l. 31. A composition according to claim 30, wherein said copper sulfate pentahydrate is at a concentration of 3-5 g/l. 32. A composition according to claim 25, wherein said molybdic acid monohydrate is present in said composition at a concentration of 0-5 g/l. 33. A composition according to claim 32, wherein said molybdic acid monohydrate is present at a concentration of 1.5-3 g/l. 34. A composition according to claim 25, wherein the reducing agent is selected from the group consisting of dimethylamineborane (DMAB), sodium hydroborate, potassium hydroborate, sodium borohydride, potassium borohydride, a borazane, and borane pyridine complex. 35. A composition according to claim 34, wherein said borazane is of the formula RxNHy.BH(x+y), wherein x is an integer between 0 and 3, wherein y is an integer between 0 and 3, and wherein R is an organic group selected from the group consisting of methyl and ethyl. 36. A composition according to claim 25, wherein the reducing agent comprises dimethylamineborane. 37. A composition according to claim 36, wherein the reducing agent comprises a dimethylamineborane complex. 38. A composition according to claim 37, wherein said dimethylamineborane complex is present at a concentration of 5-20 g/l. 39. A composition according to claim 37, wherein said dimethylamineborane complex is present at a concentration of 7-12 g/l. 40. A composition according to claim 25, further comprising tetra-methyl ammonium hydroxide (TMAH) at a concentration of 50-100 g/l. 41. A composition according to claim 25, further comprising ammonium hydroxide. 42. A composition according to claim 41, wherein said ammonium hydroxide is at a concentration of less than 20 ml/l. 43. A composition according to claim 25, wherein the pH is between 8-12. 44. A composition according to claim 43, wherein the pH is between 9-11. 45. A composition according to claim 25, wherein said composition is adapted to produce a copper molybdenum deposit having at least one of the following properties: (i) a change in reliability as defined by mean-time-to-failure during electro-migration testing of more than a factor of ten; (ii) a void density of less than 0.5/cm2; (iii) a grain boundary diffusion coefficient of less than 10-8.3. e-1.25 ev/kT; (iv) a grain boundary diffusion coefficient, Do of 10-8.3 cm/s; and (v) a distribution of grain sizes having a standard deviation of less than 3 nm. 46. A composition according to claim 25, wherein said composition is adapted to electrolessly deposit copper molybdenum at a temperature of less than 60° C. 47. A composition according to claim 46, wherein said composition is adapted to electrolessly deposit copper molybdenum at a temperature of between 40° C. to about 50° C. 48. A composition according to claim 25, further comprising a surfactant. 49. A composition according to claim 48, wherein said surfactant comprises at least one of Polyoxyethylene Alkyl Phenol Phosphate Ester and C14H22O(C2H4O) n having an average number of ethylene oxide units per molecule of 9-10.
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이 특허에 인용된 특허 (7)
Sricharoenchaikit Prasit (Millis) Calabrese Gary S. (North Andover) Gulla Michael (Millis MA), Controlled electroless plating.
Kukanskis Peter E. (Watertown CT) Grunwald John J. (New Haven CT) Ferrier Donald R. (Thomaston CT) Sawoska David A. (Woodbury CT), Electroless copper composition solution using a hypophosphite reducing agent.
Dubin Valery M. (Cupertino CA) Schacham-Diamand Yosi (Ithaca NY) Zhao Bin (Irvine CA) Vasudev Prahalad K. (Austin TX) Ting Chiu H. (Saratoga CA), Use of cobalt tungsten phosphide as a barrier material for copper metallization.
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