초록 ▼

The invention provides a laser etching method for optical ablation working by irradiating a work article formed of an inorganic material with a laser light from a laser oscillator capable of emitting in succession light pulses of a large energy density in space and time with a pulse radiation time n

The invention provides a laser etching method for optical ablation working by irradiating a work article formed of an inorganic material with a laser light from a laser oscillator capable of emitting in succession light pulses of a large energy density in space and time with a pulse radiation time not exceeding 1 picosecond, wherein, in laser etching of the work article formed of the inorganic material by irradiation thereof with the laser light from the laser oscillator with a predetermined pattern and with a predetermined energy density, there is utilized means for preventing deposition of a work by-product around the etching position.

대표청구항 ▼

What is claimed is: 1. A laser etching method for optical ablation working by irradiating a work article formed by an inorganic material with a femtosecond laser light emitted in successive trains of light pulses, the laser etching method comprising: an etching step of laser etching the work articl

What is claimed is: 1. A laser etching method for optical ablation working by irradiating a work article formed by an inorganic material with a femtosecond laser light emitted in successive trains of light pulses, the laser etching method comprising: an etching step of laser etching the work article by irradiating the trains of light pulses from the femtosecond laser light to the work article; and a scattering step of scattering during an etching pause time, from an etching position of the work article, a plasma cloud of an atomic or molecular particle released from the work article by the optical ablation caused by the femtosecond laser light at the etching step, wherein the etching pause time is provided between two trains of light pulses for a predetermined duration that is longer than a period of irradiating the work article with the train of light pulses. 2. A laser etching method according to claim 1, wherein, in irradiating the trains of light pulses from the femtosecond laser light to the work article, etching is executed by scattering the plasma cloud from the etching position by executing intermittent irradiation to said work article with a time interval longer than an oscillation frequency of the pulsed laser. 3. A laser etching method according to claim 1, wherein, in irradiating said work article with the trains of light pulses from the femtosecond laser light, a gas flow is generated to scatter said plasma cloud from said etching position. 4. A laser etching method according to claim 3, wherein the gas flow in the etching position of said work article is in an air flow. 5. A laser etching method according to claim 3, wherein the gas flow in the etching position of said work article is a nitrogen flow. 6. A laser etching method according to claim 1, wherein in irradiating said work article with the trains of light pulses from the femtosecond laser light, etching is executed in a manner that said femtosecond laser light is irradiated in a state where said work article is positioned in a gas that has an atomic weight smaller than that of a nitrogen molecule. 7. A laser etching method according to claim 6, wherein said gas is helium gas. 8. A laser etching method according to claim 6, wherein said gas is hydrogen gas. 9. A laser etching method according to claim 1, wherein in irradiating said work article with the trains of light pulses from the femtosecond laser, etching is executed in a manner that said femtosecond laser light is irradiated in a state where said work article is positioned in a liquid which transmits said femtosecond laser light. 10. A laser etching method according to claim 9, wherein the liquid transmitting the trains of light pulses from the femtosecond laser light is water. 11. A laser etching method according to claim 1, wherein, in irradiating the trains of light pulses from the femtosecond laser light to said work article, etching is executed by irradiating the femtosecond laser light in a state where said work article is heated to 200° C. or higher to scatter said plasma cloud from said etching position. 12. A laser etching method according to claim 1, wherein, in irradiating the trains of light pulses from the femtosecond laser light to said work article, etching is executed by irradiating the femtosecond laser light in a state where said work article is provided in a gaseous atmosphere of a pressure not exceeding 10 Torr to scatter the plasma cloud from said etching position. 13. A laser etching method according to claim 1, wherein said inorganic material is a crystal covalent bond. 14. A laser etching method according to claim 1, wherein said inorganic material is crystal or amorphous silicon. 15. A laser etching method according to claim 1, wherein said inorganic material is a silicon compound.