이 특허에 인용된 특허 (53) 인용/피인용 타임라인 분석

1. Malladi Deviprasad (Campbell CA) Hanson Lee Frederick (Cupertino CA) Kahahane Jean (Redwood City CA), Apparatus for testing flip chip or wire bond integrated circuits.

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2. Grabbe Dimitry G. (Middletown PA), Area array connector.

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3. Fijten Roger Johannes Jacobus,NLX ; Van Dijk Petrus Richardus Martinus,NLX, Arrangement for resilient contacting.

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4. Morris Terrel L., Bifurcated contact with a connecting member at the tip of the contact that provides redundant contact points.

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5. Toda Akitoshi (Kunitachi JPX) Tadokoro Kaoru (Hachioji JPX) Nagata Yasuji (Hachioji JPX) Shinohara Etsuo (Hachioji JPX) Enomoto Yoshimitsu (Tokyo JPX) Takayama Michio (Tatsuno JPX) Ohta Ryo (Ina JPX), Cantilever for a scanning probe microscope and a method of manufacturing the same.

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6. Mizuta Masaharu,JPX, Cantilever type probe needle for probe card and method of fabrication and control thereof.

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7. Khandros Igor Y. ; Mathieu Gaetan L., Composite interconnection element for microelectronic components, and method of making same.

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8. Matsumoto Kunio (Yokohama JPX) Oshima Muneo (Yokohama JPX) Sakaguchi Suguru (Chigasaki JPX), Connecting structure for electronic part and method of manufacturing the same.

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9. Matsuoka Noriyuki (Yokohama JPX), Contact in electric part socket.

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10. Khoury Theodore A. ; Frame James W., Contact structure and production method thereof.

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11. Khoury Theodore A., Contact structure formed by microfabrication process.

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12. Junichi Hagihara JP; Shinji Iino JP, Contactor and production method for contractor.

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13. Seymour Douglas G. (Warren PA), Electrical contact.

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14. Khandros Igor Y. ; Eldridge Benjamin N. ; Mathieu Gaetan L., Fabricating interconnects and tips using sacrificial substrates.

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15. Beaman Brian Samuel ; Fogel Keith Edward ; Lauro Paul Alfred ; Norcott Maurice Heathcote ; Shih Da-Yuan, High density cantilevered probe for electronic devices.

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16. Grabbe Dimitry G. (Middletown PA), High density electrical connector system.

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17. Babuka, Robert; Piechota, John L.; Poch, Leonard J., High density planar interconnected integrated circuit package.

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18. Jones Mark R. ; Khoury Theodore A., High performance integrated circuit chip package.

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19. Ozawa Kazuhisa (Kawagoe JPX) Harada Hiroaki (Kawagoe JPX), IC socket and its contact pin.

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20. Eldridge, Benjamin N.; Mathieu, Gaetan, Interconnect assemblies and methods.

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21. Mallik Debendra (Chandler AZ) Bhattacharyya Bidyut K. (Chandler AZ), Lead grid array integrated circuit.

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22. Mathieu Gaetan L. ; Eldridge Benjamin N. ; Grube Gary W., Lithographic contact elements.

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23. Belmont Andre,FRX ; Reynaud Vincent,FRX ; Daniau William,FRX, Method for making cards with multiple contact tips for testing semiconductor chips.

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24. Yanof Arnold W. (Tempe AZ) Dauksher William (Mesa AZ), Method for manufacturing a probe.

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25. Khandros, Igor Y., Method for manufacturing raised electrical contact pattern of controlled geometry.

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26. Burrows Paul E. ; Forrest Stephen R. ; Bulovic Vladimir ; Tian Peifang ; Brown Julie, Method for patterning light emitting devices incorporating a movable mask.

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27. Lum Thomas F. (Austin TX) Wenzel James F. (Austin TX), Method for probing a semiconductor wafer.

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28. Eldridge Benjamin N. ; Khandros Igor Y. ; Mathieu Gaetan L. ; Pedersen David V., Method of making microelectronic spring contact elements.

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29. Eldridge Benjamin N. ; Grube Gary W. ; Khandros Igor Y. ; Mathieu Gaetan L., Method of mounting resilient contact structures to semiconductor devices.

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30. Quate Calvin F. (Stanford CA) Minne Stephen Charles (Danville IL), Method of performing lithography using cantilever array.

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31. Eldridge Benjamin N. ; Grube Gary W. ; Khandros Igor Y. ; Mathieu Gaetan L., Method of planarizing tips of probe elements of a probe card assembly.

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32. Watanabe Takashi,JPX ; Yoshida Minako,JPX, Micro contact pin structure with a piezoelectric element and probe card using the same.

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33. Palagonia Anthony Michael ; Pikna Paul Joseph ; Maddix John Thomas, Micro probe assembly and method of fabrication.

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34. Maddix John Thomas ; Palagonia Anthony Michael ; Pikna Paul Joseph ; Vallett David Paul, Micro probe ring assembly and method of fabrication.

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35. Rothenberger Richard E. (5 State Dr. Harrisburg PA 17112), Micro-power connector.

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36. Fjelstad Joseph (Sunnyvale CA) Smith John W. (Palo Alto CA) Distefano Thomas H. (Monte Sereno CA) Zaccardi James (Sunnyvale CA) Walton A. Christian (Belmont CA), Microelectronic contacts with asperities and methods of making same.

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37. Jones Mark R. ; Khoury Theodore A., Packaging and interconnection of contact structure.

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38. Smith Donald L. (Palo Alto CA) Alimonda Andrew S. (Los Altos CA), Photolithographically patterned spring contact.

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39. Smith Donald L. ; Thornton Robert L. ; Chua Christopher L. ; Fork David K., Photolithographically patterned spring contact and apparatus and methods for electrically contacting devices.

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40. Soejima Koji,JPX ; Senba Naoji,JPX, Probe card and method of forming a probe card.

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41. Theodore A. Khoury ; Mark R. Jones ; R. Keith Lee, Probe contactor and production method thereof.

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42. Fujita Kazuhide (Osaka JPX), Probe structure for measuring electric characteristics of a semiconductor element.

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43. Nakano Shoukichi (Kawasaki JPX), Prober for semiconductor integrated circuit element wafer.

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44. Kiyoshi Takekoshi JP, Probing card.

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45. Alexander H. Slocum ; R. Scott Ziegenhagen, Robust, small scale electrical contactor.

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46. Faraci Anthony B. ; Zaccardi James B. ; DiStefano Thomas H. ; Smith John W., Socket for engaging bump leads on a microelectronic device and methods therefor.

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47. Knowles Robert Gordon (Litchfield CT), Solderless electrical contact.

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48. White William J. (Chelmsford MA) Ortolf James M. (Acton MA), Spring finger interconnect for IC chip carrier.

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49. David Kirtland Fork ; Jackson Ho ; Rachel King-ha Lau ; JengPing Lu, Spring structure with self-aligned release material.

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50. Grabbe Dimitry G. (Middletown PA) Korsunsky Iosif (Harrisburg PA) Ringler Daniel R. (Elizabethville PA), Surface mount electrical connector.

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51. Beaman Brian Samuel ; Fogel Keith Edward ; Lauro Paul Alfred ; Norcott Maurice Heathcote ; Shih Da-Yuan ; Walker George Frederick, Test probe for high density integrated circuits, methods of fabrication thereof and methods of use thereof.

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52. Marcus Robert B. ; Kadija Igor V. ; Aharonov Robert Reuven, Ultra-miniature electrical contacts and method of manufacture.

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53. Khandros Igor Y. ; Pedersen David V., Wafer-level burn-in and test.

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이 특허를 인용한 특허 (11) 인용/피인용 타임라인 분석

1. Kurita, Tomohisa, Contact member.

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2. Yang, Soon-Woong; Kim, Young-Gyun, Contact terminal for printed circuit board.

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3. Yang, Soon-Woong; Kim, Young-Gyun, Contact terminal for printed circuit board.

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4. Fan, Chih-Peng; Cheng, Yin-Hwa; Hsieh, Ching-Ho; Su, Ling-Kai; Hsueh, Yung-Hao, Electrical connector.

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5. Eldridge, Benjamin N.; Wenzel, Stuart W., Electronic components with plurality of contoured microelectronic spring contacts.

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6. Mason, Jeffery W.; Alden, III, Wayne Stewart; Yue, Chuan, Flexible connector and methods of manufacture.

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7. Miller, Charles A., High performance probe system.

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8. Miller, Charles A., High performance probe system.

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9. Miller,Charles A., High performance probe system.

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10. Jeon, Myoungsoo; Taylor, Attalee Snarr; Hornung, Craig Warren, Land grid array interconnect.

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11. Eldridge, Benjamin N.; Wenzel, Stuart W., Lithographic type microelectronic spring structures with improved contours.

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