이 특허에 인용된 특허 (52) 인용/피인용 타임라인 분석

1. Buol Douglas A. (Dallas TX) Mize Dean N. (Garland TX) Pattschull John W. (Garland TX) Wallace Robert M. (Dallas TX), Apparatus for testing integrated circuits.

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2. Pasiecznik ; Jr. John (Malibu CA), Apparatus for testing integrated circuits.

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3. Yojima Masayuki,JPX ; Tsujide Tohru,JPX ; Nakaizumi Kazuo,JPX, Apparatus for testing semiconductor wafer.

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4. Loughmiller,Daniel R., Communication device for a logic circuit.

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5. Legal Dennis Andrew, Configurable probe card for automatic test equipment.

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6. Mok, Sammy; Chong, Fu Chiung, Construction structures and manufacturing processes for integrated circuit wafer probe card assemblies.

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7. Khandros Igor Y. ; Eldridge Benjamin N. ; Mathieu Gaetan L. ; Dozier Thomas H. ; Smith William D., Contact carriers (tiles) for populating larger substrates with spring contacts.

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8. Crowley Richard N. (Aloha OR), Driven guard probe card.

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9. Eldridge Benjamin N. ; Khandros Igor Y. ; Mathieu Gaetan L. ; Pedersen David V., Electronic components with terminals and spring contact elements extending from areas which are remote from the terminals.

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10. Mendenhall David W. (Greenville RI) Goff Jay T. (Cranston RI), Flex dot wafer probe.

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11. Leedy Glenn J. (1061 E. Mountain Dr. Santa Barbara CA 93108), Flexible tester surface for testing integrated circuits.

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12. Huppenthal Jon (Colorado Springs CO), Functional at speed test system for integrated circuits on undiced wafers.

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13. Miller Charles A., High bandwidth passive integrated circuit tester probe card assembly.

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14. Parrish Frank, High density printed circuit board.

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15. Bross Arthur (Poughkeepsie NY) Walsh Thomas J. (Poughkeepsie NY), High density probe.

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16. Whann Welton B. (San Diego CA) Elizondo Paul M. (Escondido CA), High density probe card.

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17. Kwon On-Kyong (Plano TX) Hashimoto Masashi (Garland TX) Malhi Satwinder (Garland TX), High performance test head and method of making.

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18. Shepherd Lloyd T. (Eau Claire WI) August Melvin C. (Chippewa Falls WI) Kruchowski James N. (Eau Claire WI), High power, high density interconnect apparatus for integrated circuits.

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19. Martel Anthony Paul ; McQuade Francis T., Impedance-matched interconnection device for connecting a vertical-pin integrated circuit probing device to integrated circuit test equipment.

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20. Kudla James M. ; Chang Luke, Interface test adapter for actively testing an integrated circuit chip package.

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21. Ong,Adrian E., Layout and use of bond pads and probe pads for testing of integrated circuits devices.

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22. Tervo, Paul A.; Cowan, Clarence E., Low-current pogo probe card.

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23. Leedy Glenn J. (1061 E. Mountain Dr. Santa Barbara CA 93108), Making and testing an integrated circuit using high density probe points.

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24. Eldridge Benjamin N. ; Grube Gary W. ; Khandros Igor Y. ; Mathieu Gaetan L., Making discrete power connections to a space transformer of a probe card assembly.

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25. Kasukabe Susumu (Yokohama JPX) Takagi Ryuichi (Tokyo JPX), Manufacturing method of a probe head for semiconductor LSI inspection apparatus.

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26. Palagonia Anthony Michael, Method for forming an interposer for making temporary contact with pads of a semiconductor chip.

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27. Belmont Andre,FRX ; Reynaud Vincent,FRX ; Daniau William,FRX, Method for making cards with multiple contact tips for testing semiconductor chips.

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28. Yanof Arnold W. (Tempe AZ) Dauksher William (Mesa AZ), Method for manufacturing a probe.

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29. DeHaven Robert Keith (Austin TX) Wenzel James F. (Austin TX), Method for manufacturing a stimulus wafer for use in a wafer-to-wafer testing system to test integrated circuits located.

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30. Lum Thomas F. (Austin TX) Wenzel James F. (Austin TX), Method for probing a semiconductor wafer.

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31. Luna L. Jack, Method of connecting a unit under test in a wireless test fixture.

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32. Grube, Gary W.; Khandros, Igor Y.; Eldridge, Benjamin N.; Mathieu, Gaetan L., Method of manufacturing a probe card.

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33. Grube, Gary W.; Khandros, Igor Y.; Eldridge, Benjamin N.; Mathieu, Gaetan L.; Lotfizadeh, Poya; Tseng, Chih-Chiang, Method of manufacturing a probe card.

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34. Eldridge Benjamin N. ; Grube Gary W. ; Khandros Igor Y. ; Mathieu Gaetan L., Method of planarizing tips of probe elements of a probe card assembly.

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35. Watanabe Takashi,JPX ; Yoshida Minako,JPX, Method of producing micro contact structure and contact probe using same.

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36. Maddix John Thomas ; Palagonia Anthony Michael ; Pikna Paul Joseph ; Vallett David Paul, Micro probe ring assembly and method of fabrication.

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37. Sugihara Osamu (Nagasaka JPX), Microprobe provided circuit substrate and method for producing the same.

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38. Park, Sung-Joo; So, Byung-Se; Lee, Jung-Joon, Module having test architecture for facilitating the testing of ball grid array packages, and test method using the same.

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39. Jones Mark R. ; Khoury Theodore A., Packaging and interconnection of contact structure.

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40. Driller Hubert (Schmitten DEX) Mang Paul (Schmitten DEX), Printed circuit board testing device with foil adapter.

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41. McQuade Francis T. (Watertown CT) Lander Jack (Danbury CT), Probe assembly for testing integrated circuits.

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42. Higgins H. Dan (323 E. Redfield Chandler AZ 85225), Probe card apparatus.

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43. Higgins H. Dan ; Pandey Rajiv ; Armendariz Norman J. ; Bates R. Dennis, Probe card assembly for high density integrated circuits.

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44. Shinde,Makarand S.; Larder,Richard A.; Cooper,Timothy E.; Shenoy,Ravindra V.; Eldridge,Benjamin N., Probe card configuration for low mechanical flexural strength electrical routing substrates.

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45. Liu Jui-Hsiang (Chandler AZ) Olsen Dennis R. (Scottsdale AZ), Probe card for testing unencapsulated semiconductor devices.

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46. Nakata Yoshiro,JPX, Probe card for wafer-level measurement, multilayer ceramic wiring board, and fabricating methods therefor.

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47. Miley David M., Probe ring having electrical components affixed thereto and related apparatus and processes.

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48. Kasukabe, Susumu; Hasebe, Akio, Probing device and manufacturing method thereof, as well as testing apparatus and manufacturing method of semiconductor with use thereof.

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49. Novak, Istvan; St. Cyr, Valerie A., System and method for testing integrated passive components in a printed circuit board.

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50. Sigler Michael R. (Colorado Springs CO), System for locating probe tips on an integrated circuit probe card and method therefor.

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51. Beaman Brian Samuel ; Fogel Keith Edward ; Lauro Paul Alfred ; Norcott Maurice Heathcote ; Shih Da-Yuan ; Walker George Frederick, Test probe for high density integrated circuits, methods of fabrication thereof and methods of use thereof.

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52. Aigo Seiichiro (3-15-13 Negishi ; Daito-Ku Tokyo JPX), Unitary probe assembly.

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이 특허를 인용한 특허 (11) 인용/피인용 타임라인 분석

1. Grube,Gary W.; Khandros,Igor Y.; Eldridge,Benjamin N.; Mathieu,Gaetan L.; Lotfizadeh,Poya; Tseng,Chih Chiang, Composite wiring structure having a wiring block and an insulating layer with electrical connections to probes.

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2. Breinlinger, Keith J., Electrical guard structures for protecting a signal trace from electrical interference.

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3. Lin,Yu Hsu; Yeh,Shang Tsang; Li,Chuang Bing, Method for improving via's impedance.

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4. Nakatani, Goro; Sakuragi, Masahiro; Niino, Koichi, Method for manufacturing probe card, probe card, method for manufacturing semiconductor device, and method for forming probe.

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5. Kuo, Yung-Hsin; Lin, Yuan-Li; Huang, Po-Yi, Probe card.

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6. Nakatani, Goro; Sakuragi, Masahiro; Niino, Koichi, Probe card.

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7. Hsu, Chen Jung; Tseng, Chao Cheng, Probing apparatus for semiconductor devices.

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8. Eldridge, Benjamin N.; Reynolds, Carl V.; Saeki, Takao; Urakawa, Yoichi, Probing apparatus with guarded signal traces.

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9. Eldridge, Benjamin N.; Reynolds, Carl V.; Saeki, Takao; Urakawa, Yoichi, Probing apparatus with guarded signal traces.

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10. Sellathamby, Christopher V.; Slupsky, Steven; Moore, Brian, Testing of electronic circuits using an active probe integrated circuit.

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11. Hsu, Ming-Cheng, Universal probe card PCB design.

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