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Ball grid array contacts with spring action 원문보기

IPC분류정보
국가/구분 United States(US) Patent 등록
국제특허분류(IPC7판)
  • H01L-021/00
출원번호 US-0022137 (2004-12-23)
발명자 / 주소
  • Ngo,Hung Viet
출원인 / 주소
  • FCI Americas Technology, Inc.
대리인 / 주소
    Woodcock Washburn LLP
인용정보 피인용 횟수 : 4  인용 특허 : 90

초록

초록이 없습니다.

대표청구항

대표청구항이 없습니다.

이 특허에 인용된 특허 (90)

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  46. Timothy B. Billman, Grounding scheme for a high speed backplane connector system.
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  47. Olson Stanley W., High density connector having a ball type of contact surface.
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  49. Larry M. Crofoot ; John T. Venaleck, High density interconnect system and method.
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  50. Morlion Danny L. C.,BEX ; van Zanten Ab,NLX, High density interstitial connector system.
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  51. Janko Bozidar (Portland OR), High density probe.
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  52. Harwath Frank A., High performance card edge connector.
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  57. Yaegashi Hirokatsu (Tokyo JPX) Fumikura Tadahiro (Tokyo JPX), High-speed transmission electrical connector.
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  58. Pretchel David A. (Madison OH) Venaleck John T. (Madison OH), Integrally molded card edge cable termination assembly, contact, machine and method.
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  59. Nelson, Richard A.; Humbert, Gary; Sweeney, Kathleen A.; Avery, Hazelton P.; McGowan, Daniel B.; Fromm, Galen F., Interstitial ground assembly for connector.
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  60. Elco Richard A. ; Fusselman David F., Low cross and impedance controlled electric connector.
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  61. Elco Richard A., Low cross talk and impedance controlled electrical cable assembly.
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  62. Elco Richard A. ; Fusselman David F., Low cross talk and impedance controlled electrical connector.
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  63. Ishizuka Shigeo (Shizuoka JPX) Kuzuno Katsutoshi (Shizuoka JPX) Sakurai Kazuaki (Shizuoka JPX), Low insertion-force terminal.
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  66. Lakritz, Mark N.; Ordonez, Jose; Tubiola, Peter J., Method for forming elongated solder connections between a semiconductor device and a supporting substrate.
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  67. Chiou Song-Rong,TWX ; Huang Nan-Tsung,TWX ; Tsai Hui-Tze,TWX, Method for insert molding a contact module.
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  68. Chao-Hsu Chen TW; Ming-Wu Lee TW; Kun-Tsan Wu TW, Method for manufacturing a high density connector.
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  69. Shimada Hiroaki,JPX ; Yasojima Koji,JPX ; Takeuchi Shigeyuki,JPX, Method for manufacturing insert-resin-molded product.
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  70. Reed Carl G. (Clemmons NC), Method for producing contact shorting bar insert for modular jack assembly.
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  78. Bertoncini Daniel B. ; Stoner Stuart C. ; Doutrich Ray C., Shielded header.
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  80. Cachina, Joseph; Seidler, Jack; Zanolli, James R., Solder-bearing contacts and method of manufacture thereof and use in a solder ball grid array connector.
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  81. Chroneos ; Jr. Robert J. ; Ekhlassi Hamid, Surface mount connector with pins in vias.
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  82. Kassa, Kenneth E.; Pandey, Vinayak, Surface mount socket contact providing uniform solder ball loading and method.
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  83. Taylor Attalee S., Surface mount socket for an electronic package, and contact for use therewith.
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  84. Richard Scott Kline, Terminal module having open side for enhanced electrical performance.
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  85. Li, Che-Yu; Fan, Zhineng; Van, Linh, Test and burn-in connector.
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  86. Cobaugh Robert F. (Elizabethtown PA) Lynch James E. (Harrisburg PA) Taylor Attalee S. (Palmyra PA), Trifurcated card edge terminal.
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  87. Yun, Sang Jae, Wafer formed with CSP device and test socket of BGA device.
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  88. Anhalt John W. (Orange CA), Zero insertion force connector.
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  89. Sinclair William Y. (Frenchtown NJ), Zero insertion force connector.
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  90. Wang Hsing-Sheng (Chungli TWX), Zero insertion force socket.
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이 특허를 인용한 특허 (4)

  1. Hsiao,Shih Wei; Chen,Ming Yue, Electrical connector with movable contact.
    상세보기
  2. Daily,Christopher G.; Johnescu,Douglas M.; Kolivoski,Christopher J.; Stoner,Stuart C., Electrical connector with stepped housing.
    상세보기
  3. Thompson, John P., Straddle mount electrical connector with fusible elements.
    상세보기
  4. Minich, Steven E., Surface mount connectors.
    상세보기

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