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Cabinet for computer devices with air distribution device 원문보기

IPC분류정보
국가/구분 United States(US) Patent 등록
국제특허분류(IPC7판)
  • H05K-005/00
출원번호 US-0181494 (2005-07-14)
발명자 / 주소
  • Bettridge,James M.
  • Ford,Thomas K.
  • Turek,James R.
출원인 / 주소
  • Power of 4, LLC
대리인 / 주소
    McDermott Will & Emery LLP
인용정보 피인용 횟수 : 47  인용 특허 : 81

초록

초록이 없습니다.

대표청구항

대표청구항이 없습니다.

이 특허에 인용된 특허 (81)

  1. Nakazato Hideaki,JPX ; Hayama Hirofumi,JPX ; Kishita Manabu,JPX ; Nakao Masaki,JPX, Air conditioning method in machine room having forced air-cooling equipment housed therein.
  2. Tajima Tsuneaki (Tokyo JPX) Matsuo Yohichi (Tokyo JPX), Air cooling equipment for electronic systems.
  3. Ester Charles E. (Glendale AZ), Air distribution system.
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  8. Haley Kevin (San Jose CA) Aghazadeh Mostafa (Chandler AZ) Xie Hong (Chandler AZ), Apparatus for dissipating heat in a hinged computing device.
  9. Chien Chuan-Fu,TWX, CPU cooling system.
  10. Parry Mark James,GBX ; Dyke Peter John,GBX, Cabinet with enhanced convection cooling.
  11. Johnson Greg P. ; Larsen Rick ; Boe Craig L., Chambered forced cooling system.
  12. Anderson Jared A. (Woodside CA) Van Gelder Robert V. (Berkeley CA) Yazolino Lauren F. (Oakland CA) Braun Jimmy E. (Orange CA), Circuit board mounting and cooling assembly.
  13. Yin Jim (Fremont CA), Circuit board mounting brackets with convective air flow apertures.
  14. Peters Max D. (Plymouth MN), Clean air cabinet.
  15. Thornburg Richard K. ; Lock Timothy A., Compact apparatus for cooling a plurality of circuit packs arranged with a cage.
  16. Lee Mario J. ; Eberhardt Anthony N. ; Eberhardt Eric R., Compact computer having a redundant air moving system and method thereof.
  17. Diemunsch Guy,FRX, Component cooling arrangement in electronic equipment with internal power supply.
  18. Hood ; III Charles D. ; Utz James, Computer and computer/docking assembly with improved internal cooling.
  19. Rolf A. Konstad, Computer assembly for cooling high powered microprocessors.
  20. Chun Hsiung Lin, Computer cabinet cooling system.
  21. Cree Roger W. (Stillwater MN), Computer cooling system.
  22. Jose Javier Macias ; Rogelio Hernandez Silva, Computer enclosure cooling unit.
  23. Macias Jose Javier ; Silva Rogelio Hernandez, Computer enclosure cooling unit.
  24. Hilpert Bernhard,DEX, Computer housing with cooling means.
  25. R. Stephen Spinazzola ; Dennis L. Peltz, Computer rack heat extraction device.
  26. R. Stephen Spinazzola ; Dennis L. Peltz, Computer rack heat extraction device.
  27. Spinazzola, R. Stephen; Peltz, Dennis L., Computer rack heat extraction device.
  28. Spinazzola, R. Stephen; Peltz, Dennis L., Computer room air flow method and apparatus.
  29. Ram S. Viswanath ; Hong Xie ; Robert Sankman, Computer utilizing refrigeration for cooling.
  30. Antonuccio Robert S. ; Stewart Thomas E. ; Spano Joseph M. ; Palazola Mathew J. ; Izzicupo William A. ; Carney James M. ; Gonsalves Daniel D. ; Pugliese Mark R., Computer with high airflow and low acoustic noise.
  31. Nagashima Tetsuro,JPX, Cooling air duct and cooling apparatus.
  32. Sharp, Anthony C.; Hudz, Andrew; Jeffery, Peter, Cooling airflow distribution device.
  33. Yeh Ming Hsin,TWX, Cooling device for the CPU of computer.
  34. Mecredy ; III Henry E. ; Dunens Egons K., Cooling fan with heat pipe-defined fan housing portion.
  35. Okuyama Katsuo (Kawasaki JPX) Arai Susumu (Machida JPX) Ishiwata Masao (Yokohama JPX) Takada Hirotoshi (Kawasaki JPX), Cooling structure of electronic equipment rack.
  36. Dittus Karl Klaus ; Mansuria Mohanlal S. ; Crippen Martin Joseph ; Matteson Jason Aaron ; Webster ; Jr. Leo H., Cooling system for a computer system having dual fans and a movable baffle.
  37. Cheon Kioan, Cooling system for computer.
  38. Koike Norihiro (Tokyo JPX), Cooling system for cooling electronic apparatus.
  39. Bishop, Jerry; Nesler, Clay, Cooling system for electronic equipment cabinets.
  40. Donald J. Schumacher ; William C. Beckman, Data center cooling system.
  41. Gabuzda Paul G. (Laguna Beach CA) Terrell Sanford V. (Laguna Hills CA), Directed air management system for cooling multiple heat sinks.
  42. Hamid Lotfizadeh S., Disk drive test chamber.
  43. Stoller Harry R., Door mounted heat exchanger for outdoor equipment enclosure.
  44. Hsiao, Ming-Yang, Duct flow-type fan.
  45. French F. William ; Tilley Lisa D., Electronic cabinet door air mixing dam.
  46. Chiu George Liang-Tai ; Hougham Gareth Geoffrey ; Mok Lawrence Shungwei, Electronic component cooling using a heat transfer buffering capability.
  47. Kondo, Yoshihiro; Ohashi, Shigeo; Minamitani, Rintaro; Naganawa, Takashi; Yoshitomi, Yuji; Nakanishi, Masato; Sasaki, Yasuhiko; Nakagawa, Tsuyoshi; Suzuki, Osamu; Matsushita, Shinji; Yamada, Yasunori, Electronic equipment.
  48. Sugiyama Akira,JPX ; Hoshino Tsutomu,JPX ; Yoshida Shinichi,JPX ; Joeng Tan Tjang,JPX, Electronic equipment.
  49. Erlam David P. (Winchester GB2), Fan mounting.
  50. Cheon Kioan, Fanless cooling system for computer.
  51. Alexander Arthur Ray ; Porter ; deceased Warren W., Focused air cooling employing a dedicated chiller.
  52. Wang Michael (Taipei Hsien TWX), Heat sink assembly for a central processing unit of a computer.
  53. Peter Cuong Dac Ta ; Vernon P. Bollesen, Heat sink assembly having inner and outer heatsinks.
  54. Searls, Damion T.; Dishongh, Terrance J.; Jackson, James D., Heat sink for cooling an electronic component of a computer.
  55. Lo Wei Ta,TWX, Heat sink module with heat dissipating device.
  56. Hougham Gareth Geoffrey ; Mok Lawrence Shungwei, Heat transfer in electronic apparatus.
  57. Audette, David M.; Prochazka, Robert, Heated proofing cabinet.
  58. Giovanni Coglitore ; Nikolai Gallo ; Jack Randall, High density computer equipment storage system.
  59. Hokanson Karl ; Carlson Douglas M. ; Berg William, High performance gas cooling system and method.
  60. Fox Leslie (Boxboro MA) Wade Paul C. (Shirley MA), Hybird cooling system for electronic components.
  61. Chrysler Gregory M. ; Chu Richard C., Hybrid cooling system for electronics module.
  62. Solomon Raymond (Penn Valley CA), Integrated refrigerated computer module.
  63. Matsushima Hitoshi (Ryugasaki JPX) Komatu Toshihiro (Ibaraki JPX) Kondou Yoshihiro (Hadano JPX) Hatada Toshio (Tsuchiura JPX) Iwai Susumu (Hadano JPX) Honma Tetsuro (Hadano JPX) Iino Toshiki (Ibaraki, Jet cooling apparatus for cooling electronic equipment and computer having the same mounted thereon.
  64. Donahoe Daniel N. ; Gill Michael T., Liquid cooled computer apparatus and associated methods.
  65. Casebolt, Matthew P., Low profile highly accessible computer enclosure with plenum for cooling high power processors.
  66. Sthl Lennart (Stallarholmen SEX) Karstrom Anders (Bandhagen SEX), Method and device for cooling in closed spaces.
  67. Patel, Chandrakant D.; Beitelmal, Abdlmonem H.; Bash, Cullen E., Method, apparatus, and system for cooling electronic components.
  68. Hare Jeffrey J. ; Harris Willard S. ; Hickey Jody A. ; Schmidt Roger R. ; Seminaro Edward J. ; Chrysler Gregory M. ; Chu Richard C. ; Goth Gary F. ; Simons Robert E., Modular refrigeration system.
  69. Cunningham James J. (Hamilton Square NJ) Muzikant Boris (Pipersville PA) Reznik Solomon (North Wales PA), Panel mounted cooling system.
  70. Smith Grant M., Parallel cooling of high power devices in a serially cooled evironment.
  71. Benck Jeffrey W. (Boca Raton FL) Mansuria Mohanlal S. (Coral Springs FL) Miller Michael S. (Delray Beach FL) Musa Richard D. (Boca Raton FL) Trumbo Brian A. (Boynton Beach FL), Personal computer with tandem air flow dual fans and baffle directed air cooling.
  72. Hastings Robert J. (Kingwood TX) Varghese Paily T. (Tomball TX), Rack-mounted computer apparatus.
  73. Johnson, Richard J.; Pfleging, Robert C.; Anderson, Timothy J.; Kroupa, Daniel C., Rack-mounted equipment cooling.
  74. Kammersqard Dana W. (Vista CA) Colson ; Jr. Angus R. (Jamul CA) Cook Steven B. (Vista CA), Rackmount for computer and mass storage enclosure.
  75. Storck, Jr., Gary A.; Weigel, Wesley W.; Ray, Jay D., Raised floor air handling unit.
  76. Patel, Chandrakant D.; Bash, Cullen E.; Beitelmal, Abdlmonem H., Smart cooling of data centers.
  77. Paradis, Gabriel, System for cooling computer components housed within a computer casing.
  78. Allman Richard K., Thermally-coupled heat dissipation apparatus for electronic devices.
  79. Schwenk Hans-Martin,DEX ; Kempf Heinz,DEX ; Takats Peter,DEX, Ventilated housing.
  80. Ford, Daniel A.; Kaufman, James H.; Melroy, Owen R.; Miner, Cameron S.; Roche, Kevin P., Visual heat sink for computers and method of use.
  81. Faries ; Jr. Durward I. ; Heymann Bruce R. ; Blankenship Calvin, Warming system and method for heating various items utilized in surgical procedures.

이 특허를 인용한 특허 (47)

  1. Doll, Wade J.; Kelley, Douglas P., Air conditioning systems for computer systems and associated methods.
  2. Lewis, II, Richard Evans; Proulx, Joseph Charles, Air directing device.
  3. Mallia, Michael; Fulton, James, Cabinet for electronic equipment.
  4. Gooch, Rodger J, Closed data center containment system and associated methods.
  5. Tsakanikas, Panagiotis, Computer apparatus and method having dual air chambers.
  6. Tsakanikas, Panagiotis, Computer apparatus and method having dual air chambers.
  7. Doll, Wade J., Computer cabinets having progressive air velocity cooling systems and associated methods of manufacture and use.
  8. Doll, Wade J., Computer cabinets having progressive air velocity cooling systems and associated methods of manufacture and use.
  9. Archibald, Matthew R.; Buterbaugh, Jerrod K., Computer chassis cooling sidecar.
  10. Miyahira,Frank, Computer equipment temperature control system and methods for operating the same.
  11. Vorreiter, Loren, Configurable telecommunication equipment chassis.
  12. Campbell,Levi A.; Chu,Richard C.; Ellsworth, Jr.,Michael J.; Iyengar,Madhusudan K.; Schmidt,Roger R.; Simons,Robert E., Cooled electronics system and method employing air-to-liquid heat exchange and bifurcated air flow.
  13. Campbell,Levi A.; Chu,Richard C.; Ellsworth, Jr.,Michael J.; Iyengar,Madhusudan K.; Schmidt,Roger R.; Simons,Robert E., Cooled electronics system employing air-to-liquid heat exchange and bifurcated air flow.
  14. Siracki, Glenn T.; Rosswurm, Kim James; Riley, Patrick J.; Keegan, Jeremy J., Cooling duct attachment and sealing for a motor drive.
  15. Harder, Daniel; Leonard, Charles F., Cooling enclosure for maintaining commercial-off-the-shelf (COTS) equipment in vehicles.
  16. Yatskov, Alexander I., Cooling systems and heat exchangers for cooling computer components.
  17. Yatskov, Alexander I., Cooling systems and heat exchangers for cooling computer components.
  18. Yatskov, Alexander I., Cooling systems and heat exchangers for cooling computer components.
  19. Yatskov, Alexander I., Cooling systems and heat exchangers for cooling computer components.
  20. Love, II, Grayling A.; Knight, Paul A.; Knaggs, David; Hilbert, Greg, Data center rack door.
  21. North, Travis; Bornfield, Steven; Rodriguez, Samuel, Data processing equipment structure.
  22. Krietzman, William; Lewis, II, Richard Evans, Door closer mechanism for hot/cold aisle air containment room.
  23. Wu, Tateh; Richardson, Marcus K.; Chae, Kyongsoo; Horstman, Raymond H.; Schalla, James P., Dual-function food tray support tubes for a galley cart.
  24. Haugh, Julianne F.; Jennings, Jeffrey Bart, Dynamic cooling system for electronic device with air flow path changes.
  25. Lewis, II, Richard Evans; Krietzman, William Drew, Electronic equipment enclosure.
  26. Pons, Philippe; Salles, Pierre, Electronics structure comprising at least one barrier impermeable to fine particles.
  27. Mallia, Paul; O'Sullivan, Michael, Fluid cooled cabinet for electronic equipment.
  28. Krietzman, William Drew, Header panel assembly for preventing air circulation above electronic equipment enclosure.
  29. Krietzman, William; Garza, Jr., Jose Arturo; Lewis, II, Richard Evans, Header panel assembly for preventing air circulation above electronic equipment enclosure.
  30. Krietzman, William; Garza, Jr., Jose Arturo; Lewis, II, Richard Evans, Header panel assembly for preventing air circulation above electronic equipment enclosure.
  31. Weiss, Bruce W., Heat sink cooling arrangement for multiple power electronic circuits.
  32. Weiss, Bruce W., Heat sink cooling arrangement for multiple power electronic circuits.
  33. Archibald, Matthew R.; Buterbaugh, Jerrod K., Hot or cold aisle computer chassis.
  34. Hayashi, Nobutake, Information processing device and manufacturing method of the information processing device.
  35. Hoffmann, Christopher J.; Barber, Jim; Snell, Rodney, Mobile broadband communications system, such as a deployable self-contained portable system.
  36. Archibald, Matthew R.; Buterbaugh, Jerrod K., Modeling movement of air under a floor of a data center.
  37. Sivertsen, Clas G., Modular computer enclosure with bracket system and rotatable plates.
  38. Siracki, Glenn T.; Riley, Patrick J., Motor drive cooling duct system and method.
  39. Doll, Wade J., Multi-stage air movers for cooling computer systems and for other uses.
  40. Geelen, Pieter; Jones, Rory; Jurgens, Sven-Erik, Navigation device and method for driving break warning.
  41. Graczyk, Frank J.; Ramey, Samuel C.; Fleming, James N.; Herbst, Paul M.; McGrath, Michael J.; Wentworth, Joseph D.; Eaton, Alva B., Passive cooling systems for network cabinet.
  42. Leigh, Kevin B; Megason, George D; Sherrod, David W, Plenums for removable modules.
  43. Hodes, Marc; Lyons, Alan Michael; Scofield, William Harold, Recirculating gas rack cooling architecture.
  44. Bailey, Mark; Schmitt, Ty, System and method for directing exhaust from a modular data center.
  45. Kelley, Douglas P.; Doll, Wade J.; Yatskov, Alexander I., Systems and associated methods for controllably cooling computer components.
  46. Kelley, Douglas P.; Doll, Wade J.; Yatskov, Alexander I., Systems and associated methods for controllably cooling computer components.
  47. Fleming, James N.; Goldsberry, Timothy; Shurhay, Mark; Hibner, Max W., Thermal ducting system.
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