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Separable electrical interconnect with anisotropic conductive elastomer for translating footprint 원문보기

IPC분류정보
국가/구분 United States(US) Patent 등록
국제특허분류(IPC7판)
  • H01R-012/00
출원번호 US-0457849 (2006-07-17)
발명자 / 주소
  • Weiss,Roger E.
출원인 / 주소
  • Paricon Technologies Corporation
대리인 / 주소
    Mirick, O'Connell, DeMallie & Lougee, LLP
인용정보 피인용 횟수 : 64  인용 특허 : 20

초록

초록이 없습니다.

대표청구항

대표청구항이 없습니다.

이 특허에 인용된 특허 (20)

  1. Kabadi Ashok N., Direct BGA socket.
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  2. Glatts ; III George F., Elastomeric connector.
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  3. Neidlein,Hermann, Electric connecting device.
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  4. Gil Fisher IL; Eyal Gargir IL; Roni Mor IL; Oded Savarov IL, Electrical connecting device.
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  5. Lamp Richard W. (Mendham NJ), Electrical connector employing conductive rectilinear elements.
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  6. Bright Edward J. (Middletown PA) Consoli John J. (Harrisburg PA) Taylor Attalee S. (Palmyra PA), Electrical socket for TAB IC\s.
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  7. Lambert William R. (Mendham NJ) Lu Neng-Hsing (Berkeley Heights NJ) Rust Ray D. (Berkeley Heights NJ), Fabrication of CPI layers.
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  8. Kimura Kiyoshi (Chiba JPX), Inspection apparatus for printed wiring board.
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  9. Sakairi,Makoto, Land grid array connector and package mount structure.
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  10. Sinsheimer Roger ; Temer Vladan ; Teglia Dave, Membrane-supported contactor for semiconductor test.
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  11. Matthew McCarthy ; Everett Simons, Method and device for increasing elastomeric interconnection robustness.
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  12. Murakami Tomoo,JPX, Method for producing a semiconductor device.
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  13. Allen Timothy P. ; Gillespie David ; Miller Robert J. ; Steinbach Gunter, Object position detection system and method.
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  14. Anilkumar Chinuprasad Bhatt ; William Louis Brodsky ; Benson Chan, Printed circuit board to module mounting and interconnecting structure and method.
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  15. Higashida Takaaki,JPX ; Kumagai Koichi,JPX ; Matsuo Takahiro,JPX, Semiconductor element-mounting board and semiconductor device.
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  16. McMillan John R. ; Maslakow William H. ; Abelanet Marc A., Socket assembly for integrated circuit chip carrier package.
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  17. Jin Sungho (Millington NJ) McCormack Mark T. (Summit NJ), Solder medium for circuit interconnection.
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  18. Rafiqul Hussain, System level test socket.
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  19. Beaman Brian S. (Hyde Park NY) Doany Fuad E. (Katonah NY) Fogel Keith E. (Bardonia NY) Hedrick ; Jr. James L. (Oakland CA) Lauro Paul A. (Nanuet NY) Norcott Maurice H. (Valley Cottage NY) Ritsko John, Three dimensional high performance interconnection package.
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  20. Ishii,Jun; Kanagawa,Hitoki; Funada,Yasuhito, Wired circuit board.
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  1. Rathburn, James, Area array semiconductor device package interconnect structure with optional package-to-package or flexible circuit to package connection.
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  2. Robinson, Karen Elizabeth; Gong, Nan-Wei; Karagozler, Mustafa Emre; Poupyrev, Ivan, Attaching electronic components to interactive textiles.
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  3. Robinson, Karen Elizabeth; Gong, Nan-Wei; Karagozler, Mustafa Emre; Poupyrev, Ivan, Attaching electronic components to interactive textiles.
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  4. Dickover, Scott W.; Kerrigan, Brian M.; Meserth, Timothy A., Backside initiated uniform heat sink loading.
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  5. Rathburn, James, Bumped semiconductor wafer or die level electrical interconnect.
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  6. Rathburn, James, Compliant conductive nano-particle electrical interconnect.
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  7. Rathburn, James, Compliant printed circuit area array semiconductor device package.
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  8. Rathburn, James, Compliant printed circuit semiconductor package.
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  9. Rathburn, James, Compliant printed circuit semiconductor tester interface.
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  10. Rathburn, James, Compliant printed circuit socket diagnostic tool.
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  11. Rathburn, James, Compliant printed circuit wafer level semiconductor package.
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  12. Rathburn, James, Compliant printed circuit wafer probe diagnostic tool.
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  13. Rathburn, James, Compliant printed flexible circuit.
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  14. Rathburn, James, Compliant wafer level probe assembly.
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  15. Rathburn, James, Composite polymer-metal electrical contacts.
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  16. Karagozler, Mustafa Emre; Raja, Hakim; Poupyrev, Ivan; Colin, Youenn; Chion, Jimmy; Yurchenco, James R., Connectors for connecting electronics embedded in garments to external devices.
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  17. Degner, Brett W.; Tice, Gregory, Consolidated thermal module.
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  18. Rathburn, James, Copper pillar full metal via electrical circuit structure.
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  24. Nobile, John; Roth, George; Marran, David; Mileski, William, Electronic connector having a clamping member urging a flow cell toward an electrical circuitry with an electrically conductive membrane disposed in between.
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  25. Lilje, Joshua Norman, Electronic device with gasket sealing receptacle for tongue.
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  26. Rathburn, James, Fusion bonded liquid crystal polymer circuit structure.
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  27. Poupyrev, Ivan; Schwesig, Carsten; Schulze, Jack; Arnall, Timo; Bishop, Durrell Grant Bevington, Gesture detection and interactions.
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  29. Rathburn, James, High performance electrical circuit structure.
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  30. Rathburn, James, High performance surface mount electrical interconnect.
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  33. Rathburn, James, High performance surface mount electrical interconnect with external biased normal force loading.
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  34. Rathburn, James, High speed circuit assembly with integral terminal and mating bias loading electrical connector assembly.
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  35. Rathburn, James, Hybrid printed circuit assembly with low density main core and embedded high density circuit regions.
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  36. Karagozler, Mustafa Emre; Poupyrev, Ivan; Schwesig, Carsten C.; Raja, Hakim K.; Gong, Nan-Wei; Fukuhara, Shiho; Robinson, Karen Elizabeth, Interactive object with multiple electronics modules.
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  38. Rathburn, James J., Low profile electrical interconnect with fusion bonded contact retention and solder wick reduction.
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  39. Rathburn, James J., Mechanical contact retention within an electrical connector.
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  40. Rathburn, James, Metalized pad to electrical contact interface.
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  42. Rathburn, James, Method of making a compliant printed circuit peripheral lead semiconductor package.
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  43. Rathburn, James, Method of making a compliant printed circuit peripheral lead semiconductor test socket.
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  44. Rathburn, James J., Method of making an electrical connector having electrodeposited terminals.
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  45. Rathburn, Jim, Method of making an electronic interconnect.
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  53. Rathburn, James, Selective metalization of electrical connector or socket housing.
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  54. Rathburn, Jim, Selective metalization of electrical connector or socket housing.
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  60. Eckberg, Eric A.; Good, Michael S.; Pfeifer, Mark D., System and method for cooling a module.
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  63. Poupyrev, Ivan, Two-layer interactive textiles.
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