초록 ▼

A structure may be coupled to an adapter coupling two or more modules together. In some embodiments, the structure may direct air and/or dissipate heat from the modules into the air. The structures may direct air to components on a module that might receive less airflow without the structures. In s

A structure may be coupled to an adapter coupling two or more modules together. In some embodiments, the structure may direct air and/or dissipate heat from the modules into the air. The structures may direct air to components on a module that might receive less airflow without the structures. In some embodiments, the structure may be coupled to the adapter through a fastener (e.g., multiple structures may be manufactured with a plate, and the plate may be coupled to the adapter). In some embodiments, thermally conductive pathways may be used on the modules to conduct heat from components on the modules to a heat dissipating structure on the adapter.

대표청구항 ▼

What is claimed is: 1. An apparatus, comprising: a first circuit module coupled to a second circuit module by an adapter; and a first structure coupled to the adapter, wherein the first structure is configured to facilitate a dissipation of heat from at least a portion of the first module; wherein

What is claimed is: 1. An apparatus, comprising: a first circuit module coupled to a second circuit module by an adapter; and a first structure coupled to the adapter, wherein the first structure is configured to facilitate a dissipation of heat from at least a portion of the first module; wherein the first module comprises a thermally conductive pathway that conducts heat to an edge of the first module, wherein the adapter is configured to make physical contact with the thermally conductive pathway along the edge of the first module. 2. The apparatus of claim 1, wherein the first structure is configured to direct airflow in a first desired direction to facilitate a dissipation of heat from one or more components on the first module. 3. The apparatus of claim 2, further comprising a second structure coupled to the adapter, wherein the second structure is configured to direct airflow in a second desired direction different from the first desired direction. 4. The apparatus of claim 1, wherein the first structure is curved. 5. The apparatus of claim 1, wherein the first structure is configured to dissipate heat from the adapter into ambient air moving past the first structure. 6. The apparatus of claim 1, wherein the first structure is made of a thermally conductive material. 7. The apparatus of claim 1, wherein the first structure is configured to direct air towards a set of one or more components on the first module and to dissipate heat from the adapter into the air. 8. The apparatus of claim 7, further comprising at least one other structure coupled to the adapter, wherein the at least one other structure directs air toward a different set of one or more components on the first module. 9. The apparatus of claim 1, wherein the first module and the second module are each 3U modules. 10. The apparatus of claim 1, wherein the adapter couples the first module and second module to form an assembly that fits within a 6U slot of a chassis. 11. The apparatus of claim 1 further comprising a means for transporting heat from a heat sink to the thermally conductive pathway, wherein the heat sink is configured for coupling to a heat-generating component on the first module. 12. The apparatus of claim 1, wherein the adapter is configured to conduct heat from the thermally conductive pathway to the first structure, wherein the first structure is configured to dissipate the heat into the ambient air. 13. An apparatus for coupling a first module to a second module, wherein the first module and the second module each comprises: a front face; a back face, opposite to the front face, wherein the back face comprises one or more connectors for coupling to a chassis; a first lateral edge, comprising a first keep-out region which extends at least a portion of the distance from the front face to the back face; a second lateral edge opposite to the first lateral edge, comprising a second keep-out region which extends at least a portion of the distance from the front face to the back face; wherein each of the first module and the second module has a first size; the apparatus comprising: a first plate; a second plate; and one or more coupling elements operable to couple the first plate to the second plate; a set of structures coupled to the first plate, wherein the set of structures are configured to facilitate a dissipation of heat from at least a portion of the first module; wherein the first plate and the second plate each comprises a first lateral edge, and a second lateral edge opposite to the first lateral edge; wherein, in coupling the first plate to the second plate, the one or more coupling elements are operable to clamp the first keep-out region of the first module between the second lateral edge of the first plate and the second lateral edge of the second plate, and to clamp the second keep-out region of the second module between the first lateral edge of the first plate and the first lateral edge of the second plate, thereby coupling the first module to the second module to form a combined module of a second size; and wherein the combined module is operable to be inserted into a slot in the chassis, wherein the chassis comprises one or more slots each operable to receive a module of said second size; wherein the first module comprises a thermally conductive pathway that is configured to conduct heat to an edge of the first module, wherein the first plate is configured to make physical contact with the thermally conductive pathway. 14. The apparatus of claim 13, wherein the set of structures are configured to direct airflow in a set of one or more desired directions to facilitate the dissipation of heat from one or more components on the first module. 15. The apparatus of claim 13, wherein one or more of the structures of said set of structures are curved. 16. The apparatus of claim 13, wherein the set of structures are configured to dissipate heat from the first plate into the air. 17. The apparatus of claim 13, wherein the set of structures are made of a thermally conductive material. 18. The apparatus of claim 13 further comprising a means for transporting heat from a heat sink to the thermally conductive pathway, wherein the heat sink is configured for coupling to a heat-generating component on the first module. 19. An adapter configured for coupling a first circuit module to a second module, the adapter comprising: a first plate; a second plate; and a means for coupling the first plate to the second plate; wherein the first plate includes one or more heat pipes, wherein the one or more heat pipes are configured for coupling to a cooling system, wherein the one or more heat pipes are configured to absorb heat from the first plate and to deliver the heat to the cooling system. 20. An adapter configured for coupling a first circuit module to a second module, the adapter comprising: a first plate; a second plate; and a means for coupling the first plate to the second plate; wherein the adapter includes a cooling channel having an input port for the entrance of a fluid coolant and an output port for the exit of the fluid coolant. 21. An apparatus, comprising: a first circuit module coupled to a second circuit module by an adapter; and a first structure coupled to the adapter, wherein the first structure is configured to facilitate a dissipation of heat from at least a portion of the first module; wherein the second module comprises a thermally conductive pathway that conducts heat to an edge of the second module, wherein the adapter is configured to make physical contact with the thermally conductive pathway of the second module along the edge of the second module. 22. The apparatus of claim 21 further comprising a means for transporting heat from a heat sink to the thermally conductive pathway, wherein the heat sink is configured for coupling to a heat-generating component on the second module. 23. An apparatus, comprising: a first circuit module coupled to a second circuit module by an adapter; a plate and a set of structures, wherein the set of structures are coupled to the plate, wherein the plate is configured for coupling to the adapter in a manner that establishes a thermally conductive contact, wherein at least a first structure of the set of structures is configured to facilitate a dissipation of heat from at least a portion of the first module. 24. An apparatus for coupling a first module to a second module, wherein the first module and the second module each comprises: a front face; a back face, opposite to the front face, wherein the back face comprises one or more connectors for coupling to a chassis; a first lateral edge, comprising a first keep-out region which extends at least a portion of the distance from the front face to the back face; a second lateral edge opposite to the first lateral edge, comprising a second keep-out region which extends at least a portion of the distance from the front face to the back face; wherein each of the first module and the second module has a first size; the apparatus comprising: a first plate; a second plate; and one or more coupling elements operable to couple the first plate to the second plate; a set of structures coupled to the first plate, wherein the set of structures are configured to facilitate a dissipation of heat from at least a portion of the first module; wherein the first plate and the second plate each comprises a first lateral edge, and a second lateral edge opposite to the first lateral edge; wherein, in coupling the first plate to the second plate, the one or more coupling elements are operable to clamp the first keep-out region of the first module between the second lateral edge of the first plate and the second lateral edge of the second plate, and to clamp the second keep-out region of the second module between the first lateral edge of the first plate and the first lateral edge of the second plate, thereby coupling the first module to the second module to form a combined module of a second size; and wherein the combined module is operable to be inserted into a slot in the chassis, wherein the chassis comprises one or more slots each operable to receive a module of said second size; wherein the second module comprises a thermally conductive pathway that is configured to conduct heat to an edge of the second module, wherein the first plate is configured to make physical contact with the thermally conductive pathway of the second module. 25. The apparatus of claim 24 further comprising a means for transporting heat from a heat sink to the thermally conductive pathway, wherein the heat sink is configured for coupling to a heat-generating component on the second module. 26. An apparatus for coupling a first module to a second module, wherein the first module and the second module each comprises: a front face; a back face, opposite to the front face, wherein the back face comprises one or more connectors for coupling to a chassis; a first lateral edge, comprising a first keep-out region which extends at least a portion of the distance from the front face to the back face; a second lateral edge opposite to the first lateral edge, comprising a second keep-out region which extends at least a portion of the distance from the front face to the back face; wherein each of the first module and the second module has a first size; the apparatus comprising: a first plate; a second plate; and one or more coupling elements operable to couple the first plate to the second plate; a third plate and a set of structures, wherein the set of structures couple to the third plate, wherein the third plate is configured for coupling to the first plate in a manner that establishes a thermally conductive contact, wherein the set of structures are configured to facilitate a dissipation of heat from at least a portion of the first module; wherein the first plate and the second plate each comprises a first lateral edge, and a second lateral edge opposite to the first lateral edge; wherein, in coupling the first plate to the second plate, the one or more coupling elements are operable to clamp the first keep-out region of the first module between the second lateral edge of the first plate and the second lateral edge of the second plate, and to clamp the second keep-out region of the second module between the first lateral edge of the first plate and the first lateral edge of the second plate, thereby coupling the first module to the second module to form a combined module of a second size; and wherein the combined module is operable to be inserted into a slot in the chassis, wherein the chassis comprises one or more slots each operable to receive a module of said second size.