[특허]Cooling apparatus

[미국특허] Cooling apparatus 원문보기

IPC분류정보
국가/구분	United States(US) Patent 등록
국제특허분류(IPC7판)	F28B-009/00
출원번호	US-0195500 (2005-08-01)
등록번호	US-7257956 (2007-08-21)
우선권정보	JP-2004-224857(2004-07-30)
발명자 / 주소	Shimada,Tetsuya Watabe,Katsuhiko
출원인 / 주소	ESPEC Corp.
대리인 / 주소	Jordan and Hamburg LLP
인용정보	피인용 횟수 : 11 인용 특허 : 10

초록 ▼

A cooling apparatus configured such that a cooling body provided with heat-dissipating plates is pressed against a device to which a socket of a burn-in board is attached, and air is provided by a blower such that the air passes between the heat-dissipating plates, and compressed air provided from a compressed air supply system is discharged by a nozzle so that it directly hits a portion of the cooling upper surface of the cooling body. By means of the cooling effects from these two types of air, a device generating a large amount of heat can be cooled with good temperature accuracy.

대표청구항 ▼

We claim: 1. A cooling apparatus for cooling a semiconductor device to a target temperature; said semiconductor device including a first surface, said first surface being planar, said semiconductor device passing electric current therethrough and generating heat so that a temperature thereof rises above said target temperature and a temperature of said first surface rises; said apparatus comprising: a cooling body comprising opposing first and second sides, said first side being a pressure-contact surface for pressing against said first surface and said second side being a cooled surface; said cooled surface including inner and outer surfaces, said inner surface corresponding to a portion of certain range including a center of said first surface; and a plurality of cooling members vertically disposed on said outer surface so that air passes through said cooling members; air supply means for supplying said air; and compressed air supply means for supplying by discharging compressed air with a sprayer, said compressed air being compressed by a compressor and cooled, so that said compressed air hits a portion of specific range including a position corresponding to said center. 2. The cooling apparatus of claim 1, comprising: temperature detection means for detecting a temperature of said semiconductor device; a compressed air flow rate adjustment means for adjusting a flow rate of said compressed air; and a control means for controlling said compressed air flow rate adjustment means so that said semiconductor device is cooled whereby said temperature detected by said temperature detection means becomes said target temperature. 3. The cooling apparatus of claim 2, comprising: an air flow rate adjustment means for adjusting a flow rate of air; and a second control means for controlling said air flow rate adjustment means so that when a difference between said detected temperature and said target temperature is equal to or higher than a prescribed value, said semiconductor device is cooled whereby said difference becomes said prescribed value; said control means controlling said compressed air flow rate adjustment means so that when said difference becomes less than said prescribed value, said semiconductor device is cooled whereby said temperature detected by said temperature detection means becomes said target temperature. 4. The cooling apparatus of claim 1, wherein said compressed air supply means mixes said compressed air and a heat transfer medium liquid so that said heat transfer medium liquid atomizes and is supplied by said compressed air.

이 특허에 인용된 특허 (10) 인용/피인용 타임라인 분석

Spinazzola, R. Stephen; Peltz, Dennis L., Computer rack heat extraction device.
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Spinazzola, R. Stephen; Peltz, Dennis L., Computer room air flow method and apparatus.
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Sharp,Anthony C.; Hudz,Andrew; Jeffery,Peter, Cooling airflow distribution device.
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Suzuki Masahiro (Kawasaki JPX) Fujisaki Akihiko (Kawasaki JPX) Ishimine Junichi (Kawasaki JPX), Cooling structure for integrated circuit element modules, electronic device and heat sink block.
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Fink, James, Data center cooling system.
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Gabuzda Paul G. (Laguna Beach CA) Terrell Sanford V. (Laguna Hills CA), Directed air management system for cooling multiple heat sinks.
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Song, Tae-Ho; Kim, Sung-Jin, Heat sink.
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Tsuchiya Toshihiro,JPX ; Tanaka Kouichi,JPX ; Hashimoto Kiromasa,JPX ; Morita Kouji,JPX ; Takaku Tsutomu,JPX, Process of polishing wafers.
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Sung Myeon-Chang,KRX, Temperature-Humidity controller for semiconductor equipment and controlling method thereof.
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Hisashi Masumura JP; Kouichi Tanaka JP; Fumio Suzuki JP; Kouzi Morita JP; Kouichi Okamura JP; Naotaka Toyama JP, Workpiece holder for polishing, method for producing the same, method for polishing workpiece, and polishing apparatus.
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이 특허를 인용한 특허 (11) 인용/피인용 타임라인 분석

Czamara, Michael P.; Morales, Osvaldo P.; Nalley, Thomas M., Air directing device for rack system.
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Czamara, Michael P.; Morales, Osvaldo P., Compressed air cooling system for data center.
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Morales, Osvaldo P., Cooling air stack for computer equipment.
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Morales, Osvaldo P., Cooling air stack for computer equipment.
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Czamara, Michael P.; Eichelberg, John W., Cooling electrical systems based on power measurements.
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Gardner, Brock Robert, Managing airflow supplied through soft ducts.
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Czamara, Michael P.; Morales, Osvaldo P.; Ross, Pete G., Rack system cooling with inclined computing devices.
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Czamara, Michael Phillip; Morales, Osvaldo P.; Ross, Peter George, Rack system cooling with inclined computing devices.
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Czamara, Michael P., Rack-mounted air directing device with scoop.
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Schrempp, Michael W.; Corddry, Matthew T.; Frink, Darin Lee; Ross, Peter G.; Morales, Osvaldo P., Rack-mounted computer system with shock-absorbing chassis.
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Springs, Charles Nakia; Lindsay, Joseph James; Gregory, Shelton George, System for supplying cooling air from sub-floor space.
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IPC	Description
A	생활필수품
A62	인명구조; 소방(사다리 E06C)
A62B	인명구조용의 기구, 장치 또는 방법(특히 의료용에 사용되는 밸브 A61M 39/00; 특히 물에서 쓰이는 인명구조 장치 또는 방법 B63C 9/00; 잠수장비 B63C 11/00; 특히 항공기에 쓰는 것, 예. 낙하산, 투출좌석 B64D; 특히 광산에서 쓰이는 구조장치 E21F 11/00)
A62B-1/08	.. 윈치 또는 풀리에 제동기구가 있는 것

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[미국특허] Cooling apparatus 원문보기