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A wiring substrate can include a substrate material, which can have a first surface and a second surface. A plurality of first electrically conductive elements can be disposed on the first surface, and a plurality of second electrically conductive elements can be disposed on the second surface. Ones

A wiring substrate can include a substrate material, which can have a first surface and a second surface. A plurality of first electrically conductive elements can be disposed on the first surface, and a plurality of second electrically conductive elements can be disposed on the second surface. Ones of the first conductive elements can be electrically connected through the substrate material to ones of the second conductive elements. A mechanism can be located in a first region, which can be a center region, of the second surface of the substrate material. The mechanism can be configured to engage a control member. First activation of the control member can apply an adjustable pulling force to the first region, and second activation of the control member can apply an adjustable pushing force to the first region. The mechanism can be or can include a threaded stud, and the control member can be or can include a threaded nut configured to engage the threaded stud.

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What is claimed is: 1. A wiring substrate comprising: a substrate material comprising a first surface and a second surface; a plurality of first electrically conductive elements disposed on said first surface; a plurality of second electrically conductive elements disposed on said second surface, w

What is claimed is: 1. A wiring substrate comprising: a substrate material comprising a first surface and a second surface; a plurality of first electrically conductive elements disposed on said first surface; a plurality of second electrically conductive elements disposed on said second surface, wherein ones of said first conductive elements are electrically connected through said substrate material to ones of said second conductive elements; and means, disposed on a first region of said second surface of said substrate material, for engaging a control member whereby first activation of said control member applies an adjustable pulling force to said first region and second activation of said control member applies an adjustable pushing force to said first region, wherein said first region is located generally in a center of said second surface of said substrate material. 2. The wiring substrate of claim 1, wherein said control member comprises a threaded connector and an actuating nut, and wherein said means comprises a threaded bore configured to engage said threaded connector. 3. The wiring substrate of claim 1, wherein said control member comprises a connector with a threaded bore and an actuating nut, and wherein said means comprises threading configured to engage said threaded bore. 4. The wiring substrate of claim 1, wherein said substrate material further comprises a second region on said second surface of said substrate material, wherein said second region is configured to receive an adjustable pushing force or pulling force applied to said second region. 5. The wiring substrate of claim 1, wherein said substrate material further comprises a plurality of second regions on said second surface of said substrate material, wherein each of said second regions is configured to receive an adjustable pushing force or pulling force applied thereto. 6. The wiring substrate of claim 5, wherein said second regions are located peripherally on said second surface of said substrate material. 7. The wiring substrate of claim 1, wherein said plurality of first conductive elements are disposed on said first surface of said substrate material at a first pitch, and said plurality of second conductive elements are disposed on said second surface of said substrate material at a second pitch, wherein said first pitch is different than said second pitch. 8. The wiring substrate of claim 7, wherein said first pitch is finer than said second pitch. 9. The wiring substrate of claim 1, wherein said second contact elements are pads. 10. The wiring substrate of claim 9, wherein said first contact elements are elongate, springable contact elements. 11. The wiring substrate of claim 1, wherein said substrate material is a single block structure. 12. The wiring substrate of claim 1, wherein: said means comprises a threaded stud, and said control member is configured to thread onto said threaded stud; said first activation of said control member comprises rotating said control member about said threaded stud in a first direction; and said second activation of said control member comprises rotating said control member about said threaded stud in a second direction opposite said first direction. 13. A method of making a wiring substrate, said method comprising: providing a substrate material comprising: a first surface and a second surface, a plurality of first electrically conductive elements disposed on said first surface, and a plurality of second electrically conductive elements disposed on said second surface, wherein ones of said first conductive elements are electrically connected through said substrate material to ones of said second conductive elements; and configuring an extension extending from a first region of said second surface of said substrate material to engage a control member for applying an adjustable pulling force to said first region by first activation of said control member and an adjustable pushing force to said first region by second activation of said control member, wherein said first region is located generally in a center of said second surface of said substrate material. 14. The method of claim 11, wherein said control member comprises a threaded connector and an actuating nut, and wherein said extension comprises a threaded bore configured to engage said threaded connector. 15. The method of claim 11, wherein said control member comprises a connector with a threaded bore and an actuating nut, and said extension comprises threading configured to engage said threaded bore. 16. The method of claim 11, wherein said substrate material further comprises a second region on said second surface of said substrate material, wherein said second region is configured to receive an adjustable pushing force or pulling force applied to said second region. 17. The method of claim 13, wherein said substrate material further comprises a plurality of second regions on said second surface of said substrate material, wherein each of said second regions is configured to receive an adjustable pushing force or pulling force applied thereto. 18. The method of claim 17, wherein said second regions are peripherally located on said second surface of said substrate material. 19. The method of claim 13, wherein said plurality of first conductive elements are disposed on said first surface of said substrate material at a first pitch, and said plurality of second conductive elements are disposed on said second surface of said substrate material at a second pitch, wherein said first pitch is different than said second pitch. 20. The method of claim 19, wherein said first pitch is finer than said second pitch. 21. The method of claim 13, wherein said second contact elements are pads. 22. The method of claim 21, wherein said first contact elements are elongate, springable contact elements. 23. The method of claim 13, wherein said substrate material is a single block structure. 24. The method of claim 13, wherein: said extension comprises a threaded stud, and said control member is configured to thread onto said threaded stud; said first activation of said control member comprises rotating said control member about said threaded stud in a first direction; and said second activation of said control member comprises rotating said control member about said threaded stud in a second direction opposite said first direction. 25. A wiring substrate comprising: a substrate material comprising a first surface and a second surface; a plurality of first electrically conductive elements disposed on said first surface; a plurality of second electrically conductive elements disposed on said second surface, wherein ones of said first conductive elements are electrically connected through said substrate material to ones of said second conductive elements; and a threaded stud extending from a first region of said second surface of said substrate material, wherein said first region is located generally in a center of said second surface of said substrate material. 26. The wiring substrate of claim 25, wherein said stud is configured to engage a control member for applying one of an adjustable pulling force or an adjustable pushing force to said first region. 27. The wiring substrate of claim 26, wherein said control member comprises a threaded connector and an actuating nut, and wherein said threading of said stud is disposed within a bore in said stud, and said threading of said stud is configured to engage said threading of said connector. 28. The wiring substrate of claim 26, wherein said control member comprises a connector with a threaded bore and an actuating nut, and wherein said threading of said stud is configured to engage said threaded bore. 29. The wiring substrate of claim 26, wherein said substrate material further comprises a second region on said second surface of said substrate material, wherein said second region is configured to receive an adjustable pushing force or pulling force applied to said second region. 30. The wiring substrate of claim 26, wherein said substrate material further comprises a plurality of second regions on said second surface of said substrate material, and wherein each of said second regions is configured to receive an adjustable pushing force or pulling force applied thereto. 31. The wiring substrate of claim 30, wherein said second regions are located peripherally on said second surface of said substrate material. 32. The wiring substrate of claim 26, wherein said plurality of first conductive elements are disposed on said first surface of said substrate material at a first pitch, and said plurality of second conductive elements are disposed on said second surface of said substrate material at a second pitch, wherein said first pitch is different than said second pitch. 33. The wiring substrate of claim 32, wherein said first pitch is finer than said second pitch. 34. The wiring substrate of claim 26, wherein said extension is integrally formed with said substrate material. 35. The wiring substrate of claim 26, wherein said extension is attached to said substrate material. 36. The wiring substrate of claim 25, wherein said substrate material is a single block structure. 37. The wiring substrate of claim 25, wherein: said stud is configured to engage a control member, first activation of said control member applies an adjustable pulling force to said first region, and second activation of said control member applies an adjustable pushing force to said first region. 38. The wiring substrate of claim 37, wherein: said first activation of said control member comprises rotating said control member about said stud in a first direction; and said second activation of said control member comprises rotating said control member about said stud in a second direction opposite said first direction.