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Airflow control baffle 원문보기

IPC분류정보
국가/구분 United States(US) Patent 등록
국제특허분류(IPC7판)
  • H05K-007/20
출원번호 US-0115559 (2005-04-27)
등록번호 US-7262964 (2007-08-28)
발명자 / 주소
  • Barsun,Stephan K.
출원인 / 주소
  • Hewlett Packard Development Company, L.P.
인용정보 피인용 횟수 : 17  인용 특허 : 34

초록

An apparatus includes a printed circuit board having a first space, a member movably coupled to the printed circuit board and a baffle carried by the member. The baffle is configured to move to an extended position, which is maintained in the absence of a component in the space, to a retracted posit

대표청구항

What is claimed is: 1. An apparatus comprising: a printed circuit board having a first space; a member configured to be coupled to the printed circuit board; and a first baffle carried by the member, wherein the baffle is configured to move from an extended position, which is maintained in the abse

이 특허에 인용된 특허 (34)

  1. Clinard,Kristopher Michael, Adjustable power supply housing with compensating air baffle.
  2. Christopher Gregory Malone ; Stephan Karl Barsun ; Thomas J. Augustin, Air-flow balancing card guide frame.
  3. Talbot Gerald ; Beale Michael ; Reynolds Michael, Apparatus and method for mounting a processor circuit board on a system mother board.
  4. John R. Sterner, Apparatus to enhance cooling of electronic device.
  5. McKeen Wilbert John,CAX ; Rhodes Steven James,CAX, Baffle arrangement for an airflow balance system.
  6. Richard B. Salmonson ; David Paul Gruber ; Stephen A. Bowen, Baffle system for air cooled computer assembly.
  7. C. Michael Hayward ; Richard N. Rehlander, Card guide including air deflector means.
  8. Banton, Randall G.; Blanchet, Don W.; Bardo, Jason E.; Gust, Mike W.; Zuidema, Paul N., Card-cage with integrated control and shaping of flow resistance curve for multiple plenum chambers.
  9. Harmon Ronald A. (Hudson MA) Urrata Giovanni (Wakefield MA), Clip for clamping heat sink module to electronic module.
  10. Gandre Jerry ; Schmitt Ty, Combination heat sink and air duct for cooling processors with a series air flow.
  11. Volz Keith L. (Jamestown NC) Deak Frederick R. (Kernersville NC) Johnson David C. (Winston-Salem NC) Bates Warren A. (Winston-Salem NC) Renn Robert M. (Pfafftown NC), Combination heat sink and housing for flexible electrical connector used in an electrical or electronic assembly.
  12. Osborn Jay K. ; Stolz Howard W. ; Willis Clifford B., Computer system having a highly efficient forced air cooling subsystem.
  13. Suzuki, Masahiro; Ishimine, Junichi; Kawashima, Hisashi; Takemura, Keizo; Seyama, Kiyotaka, Cooling device for mounting module.
  14. Jurgen Schulz-Harder DE, Cooling system.
  15. Cosley Michael R. ; Garcia Marvin P. ; Mueller Don C., Cooling system for electronic components in an equipment enclosure.
  16. Dauksher, Walter J., Device for enhancing the local cooling of electronic packages subject to laminar air flow.
  17. Chikusa,Takashi; Hori,Masanori; Tachibana,Toshio; Maki,Takehiro; Honma,Hirotaka, Disk array device.
  18. Nelson Daryl James, Ducted opposing bonded fin heat sink blower multi-microprocessor cooling system.
  19. Knauth Berthold A. (Daytona Beach FL), Fluid flow regulating systems.
  20. W. John Bilski ; Matthew D. Nissley ; Erik Mallett, Heat management system.
  21. Lee Yong N. (1010 W. Lonnquist Blvd. Mt. Prospect IL 60056), Heat sink apparatus.
  22. Geva, Ehood; Erez, Shmuel, Heat sink for automatic assembling.
  23. Smithers Matthew C. (Lewisville TX), Heat sink mounting apparatus.
  24. Jeffries John ; Dewey Doug, Heat sink retention apparatus and method for computer systems.
  25. Perdue David W. (Anderson SC), Heat source cooling apparatus and method utilizing mechanism for dividing a flow of cooling fluid.
  26. Guilliard,Dietmar, Hood for a filter ventilator.
  27. Dodson, Douglas A., Housing with directed-flow cooling for computer.
  28. Chen, Richard S., Modular air flow distribution system.
  29. Harris Michael P. (San Diego CA), Modular segment adapted to provide a passively cooled housing for heat generating electronic modules.
  30. Elko Gary W. (Summit NJ) Howard Paul (Hinsdale IL) Quinlan Daniel A. (Andover MA), Option slot filler board.
  31. Daskalakis George ; Brown Stephen, Processor support assembly.
  32. Stone Robert J. (Boulder CO), Ruggedized computer assembly providing accessibility and adaptability to, and effective cooling of, electronic component.
  33. Wu, Jeff, Server having an air flow guide device.
  34. Ater Dan,ILX ; Avitan Eli,ILX, Ventilation and cooling control system for modular platforms.

이 특허를 인용한 특허 (17)

  1. Tsai, Ho-Chin; Tsai, Lung-Sheng; Chou, Yi-Lung; Chen, Li-Ping, Air conducting device.
  2. Wei, Chao-Ke, Air duct and electronic device having the same.
  3. Kohn, Stephane; Lieven, Herve, Air-cooled electronic equipment and device for cooling an electronic component.
  4. Hamilton, Jeffrey R.; Staley, Mark J.; Tang, Jimmy X.; Voytko, Troy S.; Wong, Jack P., Compute chassis having a lid that secures and removes air baffles.
  5. Lee, Sheng-Hung; Yin, Xiu-Zhong; Chen, Li-Ping, Computer enclosure with airflow-guiding device.
  6. Beall, Christopher Strickland; Frink, Darin Lee; Bryan, David Edward, Computer system with bypass air plenum.
  7. Heydari, Ali; Park, Seung Hoon; Michael, Amir Meir, Cooling servers in a data center using fans external to servers.
  8. Parkkonen, Pertti; Kohonen, Petri, Device-frame for telecommunication devices.
  9. Kusamoto,Jyoji; Nakajima,Yuji, Electronic apparatus.
  10. Wu, Wen-Chin; Chang, Chi-Sung; Chen, Ming-Chih; Hsieh, Sung-Yu, Electronic apparatus having an airflow regulating device.
  11. Franz, John P; Bargerhuff, Richard A.; Selvidge, David A., Flexible airflow baffle for an electronic system.
  12. Tong, Ryan C., Graphics processing unit stiffening frame.
  13. Chen, Xiao-Zhu; Liu, Lei, Heat dissipation device utilizing fan duct.
  14. Chang, Cheng-Lung, Heat sink assembly, portable electronic device using same and wireless modem using the heat sink assembly.
  15. Magarelli, Marco, Server cooling by airflow throttling.
  16. Ghadiri Moghaddam, Davood; LePoudre, Philip Paul; Gerber, Manfred, Systems and methods for managing conditions in enclosed space.
  17. Gilliland,Don A.; Huettner,Cary M.; Wurth,Dennis J., Thermal management apparatus and method for printed circuit boards.
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