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[미국특허] Membrane probing system 원문보기

IPC분류정보
국가/구분 United States(US) Patent 등록
국제특허분류(IPC7판)
  • H01R-043/16
출원번호 US-0036739 (2005-01-14)
등록번호 US-7266889 (2007-09-11)
발명자 / 주소
  • Gleason,Reed
  • Bayne,Michael A.
  • Smith,Kenneth
  • Lesher,Timothy
  • Koxxy,Martin
출원인 / 주소
  • Cascade Microtech, Inc.
대리인 / 주소
    Chernoff, Vilhauer, McClung & Stenzel
인용정보 피인용 횟수 : 12  인용 특허 : 423

초록

A substrate, preferably constructed of a ductile material and a tool having the desired shape of the resulting device for contacting contact pads on a test device is brought into contact with the substrate. The tool is preferably constructed of a material that is harder than the substrate so that a

대표청구항

What is claimed is: 1. A method of constructing a membrane probe comprising: (a) creating a depression in a substrate having a geometry substantially pyramidal in shape, wherein said substrate has a crystal grain and said depression has at least one substantially flat surface inclined relative to s

이 특허에 인용된 특허 (423) 인용/피인용 타임라인 분석

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  182. Reano, Ronald M.; Whitaker, John F.; Katehi, Linda P. B., Method and apparatus for simultaneous measurement of electric field and temperature using an electrooptic semiconductor probe.
  183. Ondricek, Douglas S.; Pedersen, David V., Method and apparatus for the transport and tracking of an electronic component.
  184. Eldridge Benjamin N. (Danville CA) Mathieu Gaetan L. (Livermore CA), Method and apparatus for wirebonding, for severing bond wires, and for forming balls on the ends of bond wires.
  185. Mathieu,Gaetan L., Method and system for compensating thermally induced motion of probe cards.
  186. Eldridge, Benjamin N.; Brandemuehl, Mark W.; Graef, Stefan; Parent, Yves, Method and system for designing a probe card.
  187. Eldridge, Benjamin N.; Juergen Zschiegner, Stefan Jan, Method and system for detecting an arc condition.
  188. Schreiber Christopher M. (Newport Beach CA) Feigenbaum Haim (Irvine CA), Method for electrodepositing corrosion barrier on isolated circuitry.
  189. Farnworth Warren M. (Nampa ID), Method for fabricating a penetration limited contact having a rough textured surface.
  190. Matsunaga,Noriaki; Shibata,Hideki; Hayasaka,Nobuo, Method for fabricating a probe pin for testing electrical characteristics of an apparatus.
  191. Miller, Charles A., Method for fabricating an IC interconnect system including an in-street integrated circuit wafer via.
  192. Lu, Nai-Cheng; Liao, Yu-Ting; Liu, Fu-Sung, Method for fabricating microelectronic fabrication electrical test apparatus electrical probe tip having pointed tips.
  193. Kouji Matsunaga JP; Hirobumi Inoue JP; Masao Tanehashi JP; Toru Taura JP; Masahiko Nikaidou JP; Yuuichi Yamagishi JP; Satoshi Hayakawa JP, Method for fabricating probe tip portion composed by coaxial cable.
  194. Elder Richard A. (Dallas TX) Wilson Arthur M. (Dallas TX) Bagen Susan V. (Dallas TX) Miller Juanita G. (Richardson TX), Method for fabrication of probe card for testing of semiconductor devices.
  195. Akram Salman (Boise ID) Farnworth Warren M. (Nampa ID) Wood Alan G. (Boise ID), Method for forming an interconnect having a penetration limited contact structure for establishing a temporary electrica.
  196. Kister, January, Method for making a probe apparatus for testing integrated circuits.
  197. Kister January, Method for making a probe preserving a uniform stress distribution under deflection.
  198. Leedy Glenn (1061 E. Mountain Dr. Santa Barbara CA 93108), Method for making an interconnection structure for integrated circuits.
  199. Henson, Roy, Method for manufacturing a multi-layer printed circuit board.
  200. Khandros Igor Y., Method for manufacturing raised electrical contact pattern of controlled geometry.
  201. Khandros, Igor Y., Method for manufacturing raised electrical contact pattern of controlled geometry.
  202. Khandros, Igor Y., Method for manufacturing raised electrical contact pattern of controlled geometry.
  203. Mautz Karl Emerson, Method for measuring a characteristic of a semiconductor wafer using cylindrical control.
  204. Ondricek, Douglas S.; Pedersen, David V., Method for mounting an electronic component.
  205. Fyfield, Margaret S., Method for probing a semiconductor wafer.
  206. Gleason, Reed; Bayne, Michael A.; Smith, Kenneth; Lesher, Timothy; Koxxy, Martin, Method for probing an electrical device having a layer of oxide thereon.
  207. Ondricek, Douglas S.; Pederson, David V., Method for processing an integrated circuit including placing dice into a carrier and testing.
  208. Igor Y. Khandros ; Thomas H. Dozier ; Gary W. Grube ; Gaetan L. Mathieu, Method for shaping spring elements.
  209. Ralph G. Whitten ; Benjamin N. Eldridge, Method for testing signal paths between an integrated circuit wafer and a wafer tester.
  210. Cheng David (711 Hibernia Ct. Sunnyvale CA 94087), Method for transporting and testing wafers.
  211. Eldridge, Benjamin N., Method of assembling and testing an electronics module.
  212. Eldridge Benjamin N. ; Grube Gary W. ; Khandros Igor Y. ; Mathieu Gaetan L., Method of burning-in semiconductor devices.
  213. Miller, Charles A.; Long, John M., Method of designing, fabricating, testing and interconnecting an IC to external circuit nodes.
  214. Miller, Charles A.; Long, John M., Method of designing, fabricating, testing and interconnecting an IC to external circuit nodes.
  215. Mathieu, Gaetan L.; Eldridge, Benjamin N.; Wenzel, Stuart W., Method of fabricating shaped springs.
  216. Trobough Douglas W. (Beaverton OR), Method of forming a conductive contact bump on a flexible substrate and a flexible substrate.
  217. Beaman, Brian Samuel; Fogel, Keith Edward; Lauro, Paul Alfred; Norcott, Maurice Heathcote; Shih, Da-Yuan, Method of forming a structure for electronic devices contact locations.
  218. Beaman Brain S. (Hyde Park NY) Doany Fuad E. (Katonah NY) Fogel Keith E. (Bardonia NY) Hedrick ; Jr. James L. (Oakland CA) Lauro Paul A. (Nanuet NY) Norcott Maurice H. (Valley Cottage NY) Ritsko John, Method of forming a three dimensional high performance interconnection package.
  219. Ubbens Henricus D. U. (Eindhoven NLX) Langeveld Peer (Eindhoven NLX), Method of interconnecting conductors of different layers of a multilayer printed circuit board.
  220. Woith Blake F. (Orange CA) Pasiecznik ; Jr. John (Malibu CA) Crumly William R. (Anaheim CA) Betz Robert K. (Long Beach CA), Method of making a cast elastomer/membrane test probe assembly.
  221. Leedy Glenn J. (1061 E. Mountain Dr. Santa Barbara CA 93108), Method of making a flexible tester surface for testing integrated circuits.
  222. Chen Jimmy Kuo-Wei ; Eldridge Benjamin N. ; Dozier Thomas H. ; Yeh Junjye J. ; Herman Gayle J., Method of making a product with improved material properties by moderate heat-treatment of a metal incorporating a dilute additive.
  223. Mathieu Gaetan L. ; Eldridge Benjamin N. ; Grube Gary W., Method of making and using lithographic contact springs.
  224. Etsuji Suzuki JP; Akira Yonezawa JP; Toshio Okuno JP, Method of making conductive bump on wiring board.
  225. Eldridge Benjamin N. ; Grube Gary W. ; Khandros Igor Y. ; Mathieu Gaetan L., Method of making contact tip structures.
  226. Beaman Brian Samuel ; Fogel Keith Edward ; Lauro Paul Alfred ; Norcott Maurice H. ; Shih Da-Yuan ; Walker George Frederick, Method of making high density integral test probe.
  227. Mathieu, Gaetan L.; Eldridge, Benjamin N.; Grube, Gary W., Method of making lithographic contact springs.
  228. Benjamin N. Eldridge ; Gary W. Grube ; Igor Y. Khandros ; Gaetan L. Mathieu, Method of making microelectronic contact structures.
  229. Eldridge Benjamin N. ; Khandros Igor Y. ; Mathieu Gaetan L. ; Pedersen David V., Method of making microelectronic spring contact elements.
  230. Eldridge Benjamin N. ; Grube Gary W. ; Khandros Igor Y. ; Mathieu Gaetan L., Method of making temporary connections between electronic components.
  231. Grube, Gary W.; Khandros, Igor Y.; Eldridge, Benjamin N.; Mathieu, Gaetan L., Method of manufacturing a probe card.
  232. Grube, Gary W.; Khandros, Igor Y.; Eldridge, Benjamin N.; Mathieu, Gaetan L.; Lotfizadeh, Poya; Tseng, Chih-Chiang, Method of manufacturing a probe card.
  233. Chance Randal W. (Boise ID), Method of manufacturing edge connected semiconductor die.
  234. Khandros Igor Y. (Peekskil NY), Method of manufacturing electrical contacts, using a sacrificial member.
  235. Roberts Joseph A. (Grafton NH), Method of manufacturing printed circuits.
  236. Saijyo, Masakatsu; Kato, Toshiaki, Method of measuring contact resistance of probe and method of testing semiconductor device.
  237. Eldridge Benjamin N. ; Grube Gary W. ; Khandros Igor Y ; Mathieu Gaetan L., Method of modifying the thickness of a plating on a member by creating a temperature gradient on the member, applications for employing such a method, and structures resulting from such a method.
  238. Khandros Igor Y., Method of mounting free-standing resilient electrical contact structures to electronic components.
  239. Eldridge Benjamin N. ; Grube Gary W. ; Khandros Igor Y. ; Mathieu Gaetan L., Method of mounting resilient contact structures to semiconductor devices.
  240. Eldridge Benjamin N. ; Grube Gary W. ; Khandros Igor Y. ; Mathieu Gaetan L., Method of planarizing tips of probe elements of a probe card assembly.
  241. Watanabe Takashi,JPX ; Yoshida Minako,JPX, Method of producing micro contact structure and contact probe using same.
  242. Eldridge Benjamin N. ; Mathieu Gaetan L., Method of severing bond wires and forming balls at their ends.
  243. Khandros Igor Y. ; Mathieu Gaetan L., Method of stacking electronic components.
  244. Eldridge Benjamin N. ; Grube Gary W. ; Khandros Igor Y. ; Mathieu Gaetan L., Method of temporarily, then permanently, connecting to a semiconductor device.
  245. Eldridge Benjamin N. ; Grube Gary W. ; Khandros Igor Y. ; Mathieu Gaetan L., Method of testing semiconductor.
  246. Budnaitis John J. ; Leong Jimmy, Method of wafer level burn-in.
  247. Gaetan L. Mathieu ; Benjamin N. Eldridge ; Gary W. Grube, Methods for making spring interconnect structures.
  248. Dozier, II, Thomas H.; Eldridge, Benjamin N.; Grube, Gary W.; Khandros, Igor Y.; Mathieu, Gaetan L., Methods of removably mounting electronic components to a circuit board, and sockets formed by the methods.
  249. Cherian,Gabe, Micro probe.
  250. Palagonia Anthony Michael ; Pikna Paul Joseph ; Maddix John Thomas, Micro probe assembly and method of fabrication.
  251. Carver Thomas E. (Mountain View CA), Microcasting of microminiature tips.
  252. Eldridge, Benjamin N.; Grube, Gary W.; Khandros, Igor Y.; Mathieu, Gaetan L., Microelectronic contact structures, and methods of making same.
  253. Eldridge, Benjamin N.; Grube, Gary W.; Khandros, Igor Y.; Mathieu, Gaetan L., Microelectronic contact structures, and methods of making same.
  254. Benjamin N. Eldridge ; Gary W. Grube ; Igor Y. Khandros ; Gaetan L. Mathieu, Microelectronic spring contact element and electronic component having a plurality of spring contact elements.
  255. Eldridge, Benjamin N.; Khandros, Igor Y.; Mathieu, Gaetan L.; Pedersen, David V., Microelectronic spring contact elements.
  256. Grube, Gary W.; Mathieu, Gaetan L., Microelectronic spring contact repair.
  257. Grube, Gary W., Microelectronic spring with additional protruding member.
  258. Akram Salman ; Hembree David R. ; Wood Alan G., Micromachined probe card having compliant contact members for testing semiconductor wafers.
  259. Swapp Mavin (Mesa AZ), Micromachined semiconductor probe card.
  260. Gleason K. Reed (Portland OR) Jones Keith E. (Beaverton OR) Strid Eric W. (Portland OR), Microwave wafer probe having replaceable probe tip.
  261. Majidi-Ahy Gholamreza (Sunnyvale CA) Bloom David M. (Portola Valley CA), Millimeter-wave active probe.
  262. Majidi-Ahy Gholamreza (Sunnyvale CA) Bloom David M. (Portola Valley CA), Millimeter-wave active probe system.
  263. Kister, January, Modular probe apparatus.
  264. Cheng, Shih-Jye; Liu, An-Hong; Wang, Yeong-Her; Chao, Yeong-Ching; Lee, Yao-Jung, Modularized probe head.
  265. January Kister ; Jean-Michel Jurin FR; Isabelle George FR, Modulated space transformer for high density buckling beam probe and method for making the same.
  266. Eldridge Benjamin N. ; Grube Gary W. ; Khandros Igor Y. ; Mathieu Gaetan L., Mounting spring elements on semiconductor devices.
  267. Smolley Robert (Porteughese Bend CA), Multi-element circuit construction.
  268. Leong Tony P. ; North Edward S. ; Herbst Richard Linsley, Multi-wavelength laser system, probe station and laser cutter system using the same.
  269. Leong Tony P. ; North Edward S. ; Herbst Richard Linsley, Multi-wavelength variable attenuator and half wave plate.
  270. Mitchell, Scott W.; Rincon, Reynaldo M.; Broz, Jerry; Laugier, Gerard, Multiple contact vertical probe solution enabling Kelvin connection benefits for conductive bump probing.
  271. Miller, Charles A., Multiple die interconnect system.
  272. Yasunaga Soichiro (Kawasaki JPX), Multiple function type D/A converter.
  273. Greub Hans J. (Troy NY) Garuts Valdis E. (Beaverton OR), Multiple lead probe for integrated circuits in wafer form.
  274. Altmann, Stephan Maximilian; H?rber, Johann Karl Heinrich, Multiple local probe measuring device and method.
  275. Hwang,David, Multiple two axis floating probe block assembly using split probe block.
  276. Rincon,Reynaldo M.; Arnold,Richard W., Multiple-chip probe and universal tester contact assemblage.
  277. Pasiecznik ; Jr. John (Malibu CA), Multiport membrane probe for full-wafer testing.
  278. Hasegawa, Kenichi; Saguchi, Toshihiro, NMR probe.
  279. Lim, Yit Aun; Maas, Werner E., NMR probe circuit for generating close frequency resonances.
  280. Ryken, Jr., Marvin L.; Davis, Albert F., Near field probe.
  281. Mitsuoka,Yasuyuki; Chiba,Norio; Kasama,Nobuyuki; Niwa,Takashi; Nakajima,Kunio, Near-field optical probe.
  282. Jun, Tae-Un, Needle assembly of probe card.
  283. Yu, Hyun-Sik; Choi, Ji-Man; Shin, In-Dae, Needle fixture of a probe card in semiconductor inspection equipment and needle fixing method thereof.
  284. Wang,Changting; Plotnikov,Yuri Alexeyevich; Nath,Shridhar Champaknath; McKnight,William Stewart; Gambrell,Gigi Olive, Omnidirectional eddy current probe and inspection system.
  285. Hideo, Hosono; Masahiro, Hirano; Masanori, Oto; Gen, Tochitani; Susumu, Ohneda; Shinnya, Kikugawa, Optical fiber for transmitting ultraviolet ray, optical fiber probe, and method of manufacturing the optical fiber probe.
  286. Johannessen,Kjetil, Optical probe for wafer testing.
  287. Henson, Roy, PC board having clustered blind vias.
  288. Richard S. Roy ; Charles A. Miller, Parallel testing of integrated circuit devices using cross-DUT and within-DUT comparisons.
  289. Grube Gary W. ; Khandros Igor Y. ; Mathieu Gaetan L., Partially-overcoated elongate contact structures.
  290. Knibbe Jan C. (Detroit MI) McPhee Willard J. (Bloomfield Hills MI), Piercing apparatus.
  291. Veenendaal Cornelis T. (Cornelius OR), Piezoelectric pressure sensing apparatus for integrated circuit testing stations.
  292. Hung Yann (Rochester NY) Regan Michael T. (Fairport NY) Staudenmayer William J. (Pittsford NY), Pigments and photoconductive elements sensitive to infrared radiation.
  293. Mathieu, Gaetan L.; Eldridge, Benjamin N.; Grube, Gary W., Planarizer for a semiconductor contactor.
  294. Beaman Brian Samuel ; Fogel Keith Edward ; Lauro Paul Alfred ; Shih Da-Yuan, Pluggable chip scale package.
  295. Inoue Mitsuru (Utsunomiya JPX), Positioning stage device exposure apparatus and device manufacturing method utilizing the same.
  296. Eldridge, Benjamin N.; Miller, Charles A., Predictive, adaptive power supply for an integrated circuit under test.
  297. Yamaguchi Masao (Tokyo JPX), Probe apparatus.
  298. Yoshioka, Haruhiko, Probe apparatus.
  299. Takebuchi, Ryuichi, Probe apparatus and method of alignment for the same.
  300. January Kister, Probe apparatus having removable beam probes.
  301. Evans Arthur (Brookfield Center CT) Baker Joseph R. (New Milford CT) Lander Jack (Danbury CT), Probe assembly for testing integrated circuit devices.
  302. January Kister, Probe assembly having floatable buckling beam probes and apparatus for abrading the same.
  303. Ji, Joon-Su; Hwang, In-Seok; Lee, Doo-Seon; Kim, Byoung-Joo; Ro, Young-Kyo; Lee, Ho-Yeol, Probe card.
  304. Sugawara, Shinichi, Probe card.
  305. Sharif, Adam K., Probe card and probe needle for high frequency testing.
  306. Higgins H. Dan (323 E. Redfield Chandler AZ 85225), Probe card apparatus.
  307. Eldridge, Benjamin N.; Grube, Gary W.; Khandros, Igor Y.; Mathieu, Gaetan L., Probe card assembly.
  308. Eldridge, Benjamin Niles; Grube, Gary William; Khandros, Igor Yan; Mathieu, Gaetan L., Probe card assembly and kit, and methods of making same.
  309. Eldridge Benjamin N. ; Grube Gary W. ; Khandros Igor Y. ; Mathieu Gaetan L., Probe card assembly and kit, and methods of using same.
  310. Eldridge, Benjamin N.; Grube, Gary W.; Mathieu, Gaetan L., Probe card assembly for contacting a device with raised contact elements.
  311. Miller, Charles A., Probe card cooling assembly with direct cooling of active electronic components.
  312. Lou, Choon-Leong; Hsu, Mei-Shu, Probe card for electrical testing a chip in a wide temperature range.
  313. Yoon,Soo, Probe card for testing semiconductor device.
  314. Kirby, Kyle K., Probe card for use with microelectronic components, and methods for making same.
  315. Okubo Kazumasa (Kanagawa JPX) Okubo Masao (Nishinomiya JPX) Yoshimitsu Yasuro (Takatsuki JPX) Sugaya Kiyoshi (Amagasaki JPX), Probe card in which contact pressure and relative position of each probe end are correctly maintained.
  316. Sporck, A. Nicholas; Shinde, Makarand S., Probe card with coplanar daughter card.
  317. Soejima Koji,JPX ; Senba Naoji,JPX, Probe card with plural probe tips on a unitary flexible tongue.
  318. Fink,Steven T.; Windhorn,Thomas H., Probe cartridge assembly and multi-probe assembly.
  319. Aldaz, Robert Edward; Khoury, Theodore A., Probe contract system having planarity adjustment mechanism.
  320. Matsumoto,Toshiko; Nakashige,Ryo; Nozaki,Yasuyuki; Ueno,Shingo; Tamura,Takuro, Probe designing apparatus and probe designing method.
  321. Ikeda Towl (Kofu JPX), Probe device having micro-strip line structure.
  322. Pasiecznik ; Jr. John (Malibu CA), Probe for jesting an electrical circuit chip.
  323. Gleason, K. Reed; Lesher, Tim; Strid, Eric W.; Andrews, Mike; Martin, John; Dunklee, John; Hayden, Leonard; Safwat, Amr M. E., Probe for testing a device under test.
  324. Chaya,Hiromi; Hayashi,Takahisa; Komatsu,Shigekazu, Probe mark reading device and probe mark reading method.
  325. Maeda, Yasuhiro; Takayanagi, Fumikazu, Probe module and a testing apparatus.
  326. Okumura,Katsuya; Furuya,Kunihiro, Probe pins zero-point detecting method, and prober.
  327. Brown John ; Costello Matthew J. ; DosSantos Luciano P. ; Ruck Robin, Probe station adapter for backside emission inspection.
  328. Brian Samuel Beaman ; Keith Edward Fogel ; Paul Alfred Lauro ; Yun-Hsin Liao ; Daniel Peter Morris ; Da-Yuan Shih, Probe structure having a plurality of discrete insulated probe tips.
  329. Karavakis, Konstantine N.; Nguyen, Tom T., Probe structures using clamped substrates with compliant interconnectors.
  330. Boll Gregory George ; Boll Harry Joseph, Probe tip structure.
  331. Martens, Jon S., Probe tone S-parameter measurements.
  332. Brassell, Gilbert; Wickland, Terry J.; Popish, Darold M., Probe with integral vent, sampling port and filter element.
  333. Kobayashi, Masahito; Yoshioka, Haruhiko; Fujita, Takafumi, Prober.
  334. Kasukabe, Susumu; Hasebe, Akio, Probing device and manufacturing method thereof, as well as testing apparatus and manufacturing method of semiconductor with use thereof.
  335. Sakagawa, Hideo; Watanabe, Takashi, Probing method and prober.
  336. Kobayashi,Masahito; Ishii,Kazunari, Probing method and probing apparatus.
  337. Sun, Luen-Chian, Probing of device elements.
  338. Stevens, Mac, Process and apparatus for adjusting traces.
  339. Stevens, Mac; Parent, Yves, Process and apparatus for finding paths through a routing space.
  340. Hedrick Jeffrey Curtis ; Hedrick James Lupton ; Hilborn Jons Gunnar,CHX ; Liao Yun-Hsin ; Miller Robert Dennis ; Shih Da-Yuan, Process for making a foamed elastomeric polymer.
  341. Hedrick Jeffrey Curtis ; Hedrick James Lupton ; Hilborn Jons Gunnar,CHX ; Liao Yun-Hsin ; Miller Robert Dennis ; Shih Da-Yuan, Process for making a foamed elastometric polymer.
  342. Hedrick Jeffrey Curtis (Park Ridge NJ) Hedrick James Lupton (Pleasanton CA) Liao Yun-Hsin (W. Nyack NY) Miller Robert Dennis (San Jose CA) Shih Da-Yuan (Poughkeepsie NY), Process for making a foamed polymer.
  343. Yoshizawa Tetsuo (Yokohama JPX) Miyazaki Toyohide (Inashiki JPX) Kondo Hiroshi (Osaka JPX) Sakaki Takashi (Tokyo JPX) Terayama Yoshimi (Odawara JPX) Tamura Yoichi (Tokyo JPX) Okabayashi Takahiro (Tok, Process for preparing electrical connecting member.
  344. Ayala-Esquilin Juan (San Jose CA) Beaman Brian S. (Hyde Park NY) Haring Rudolf A. (Cortlandt Manor NY) Hedrick James L. (Pleasanton CA) Shih Da-Yuan (Poughkeepsie NY) Walker George F. (New York NY), Process of making pinless connector.
  345. Chang Sung Chul ; Khandros Igor Y. ; Smith William D., Process of mounting spring contacts to semiconductor devices.
  346. Chong Fu Chiung, Programmable high-density electronic device testing.
  347. Plotnikov, Yuri Alexeyevich; Batzinger, Thomas James; Nath, Shridhar Champaknath; Dewangan, Sandeep Kumar; Lester, Carl Stephen; Herd, Kenneth Gordon; Rose, Curtis Wayne, Pulsed eddy current sensor probes and inspection methods.
  348. Hopkins,Michael; Heynen,Paul, Radio frequency Langmuir probe.
  349. Igor Y. Khandros ; Gaetan L. Mathieu, Raised contact structures (solder columns).
  350. Worledge, Daniel, Reduction of positional errors in a four point probe resistance measurement.
  351. Eldridge, Benjamin N.; Grube, Gary W.; Khandros, Igor Y.; Mathieu, Gaetan L., Resilient contact structures for interconnecting electronic devices.
  352. Khandros Igor Y. ; Mathieu Gaetar L., Resilient contact structures, electronic interconnection component, and method of mounting resilient contact structures to electronic components.
  353. Inuta Kazuo (Yokaichi JPX), Rotary board treating apparatus.
  354. Yanagisawa Ken (Matsumoto JPX), Rotary drive positioning system for an indexing table.
  355. Sago Hiroyoshi (Kanagawa JPX) Mizuki Hideyuki (Kanagawa JPX) Kudo Katsuhiko (Kanagawa JPX), Rotary-cup coating apparatus.
  356. Teramachi Hiroshi (34-8 ; Higashitamagawa 2-chome Setagaya-ku ; Tokyo JPX), Rotational positioning device.
  357. Eslamy, Mohammad; Pedersen, David V; Cobb, Harry D., Segmented contactor.
  358. Schaeffer, Ralph; Crump, Brett, Selectively configurable microelectronic probes.
  359. Huff Richard E. (Belmont CA) Matta Farid (Mountain View CA), Self-leveling membrane probe.
  360. Hirano Toshiki,JPX ; Kimura Atsuo,JPX ; Mori Shinichiro,JPX, Semi-conductor chip test probe and process for manufacturing the probe.
  361. Kang,Tae Jin; Lee,Woon Bok, Semiconductor device for reducing the number of probing pad used during wafer test and method for testing the same.
  362. Masuoka, Sadaaki, Semiconductor device including gate insulation films having different thicknesses.
  363. Khandros Igor Y. ; Mathieu Gaetar L., Semiconductor devices with integral contact structures.
  364. Benjamin N. Eldridge, Semiconductor fuse covering.
  365. Dogaru, Teodor; Smith, Stuart T., Sensors and probes for mapping electromagnetic fields.
  366. Afshari Bahram (Menlo Park CA) Matta Farid (Mountain View CA) Hanlon Lawrence (Menlo Park CA), Shearing stress interconnection apparatus and method.
  367. Tajima Kenji (Kanagawa JPX) Takahashi Motoaki (Kanagawa JPX) Watanabe Hideo (Kanagawa JPX) Shoji Takashi (Kanagawa JPX) Arai Noboru (Kanagawa JPX), Sheet film package and device for loading sheet films.
  368. Sinclair, William Y., Shielded integrated circuit probe.
  369. Edward J. Hager ; Rondal K. Harmon, Jr., Single tip Kelvin probe.
  370. Dozier ; II Thomas H. ; Eldridge Benjamin N. ; Grube Gary W. ; Khandros Igor Y. ; Mathieu Gaetan L. ; Pedersen David V. ; Stadt Michael A., Sockets for "springed" semiconductor devices.
  371. Dozier ; II Thomas H. ; Eldridge Benjamin N. ; Grube Gary W. ; Khandros Igor Y. ; Mathieu Gaetan L. ; Pedersen David V. ; Stadt Michael A., Sockets for "springed" semiconductor devices.
  372. Dozier, II, Thomas H.; Eldridge, Benjamin N.; Grube, Gary W.; Khandros, Igor Y.; Mathieu, Gaetan L.; Pedersen, David V.; Stadt, Michael A., Sockets for "springed" semiconductor devices.
  373. Dozier, II, Thomas H.; Eldridge, Benjamin N.; Grube, Gary W.; Khandros, Igor Y.; Mathieu, Gaetan L.; Pederson, David V.; Stadt, Michael A., Sockets for "springed" semiconductor devices.
  374. Dozier ; II Thomas H. ; Eldridge Benjamin N. ; Grube Gary W. ; Khandros Igor Y. ; Mathieu Gaetan L., Sockets for electronic components and methods of connecting to electronic components.
  375. Drake Robert E. (Somers NY) Faris Sadeg M. (Pleasantville NY) Patt Roy M. (Walden NY) Shen Zhi-Yuan (Ossining NY), Soft probe for providing high speed on-wafer connections to a circuit.
  376. Dozier ; II Thomas H. ; Khandros Igor Y., Solder preforms.
  377. Munson, Eric Jon; Offerdahl, Thomas James; Schieber, Loren Joseph, Solid-state nuclear magnetic resonance probe.
  378. Benjamin N. Eldridge ; Igor Y. Khandros ; David V. Pedersen ; Ralph G. Whitten, Special contact points for accessing internal circuitry of an integrated circuit.
  379. Eldridge, Benjamin N.; Khandros, Igor Y.; Pedersen, David V.; Whitten, Ralph G., Special contact points for accessing internal circuitry of an integrated circuit.
  380. Eldridge, Benjamin N.; Khandros, Igor Y.; Pedersen, David V.; Whitten, Ralph G., Special contact points for accessing internal circuitry of an integrated circuit.
  381. Eldridge, Benjamin N.; Khandros, Igor Y.; Pedersen, David V.; Whitten, Ralph G., Special contact points for accessing internal circuitry of an integrated circuit.
  382. Mathieu, Gaetan L.; Eldridge, Benjamin N.; Grube, Gary W.; Larder, Richard A., Spring interconnect structures.
  383. Hemmie Dale L. (Burlington IA) Evans Robert M. (Hightstown NJ), Stacked dual dipole MMDS feed.
  384. Eldridge, Benjamin N., Stacked semiconductor device assembly with microelectronic spring contacts.
  385. Khandros Igor Y. ; Pedersen David V., Stacking semiconductor devices, particularly memory chips.
  386. Beaman Brian Samuel ; Fogel Keith Edward ; Lauro Paul Alfred ; Shih Da-Yuan, Structures and processes to create a desired probetip contact geometry on a wafer test probe.
  387. Miller, Charles A., System for calibrating timing of an integrated circuit wafer tester.
  388. Long, John, System for measuring signal path resistance for an integrated circuit tester interconnect structure.
  389. Das,Gobinda; Motika,Franco, TFI probe I/O wrap test method.
  390. Thiessen, William F., Temperature compensated vertical pin probing device.
  391. Eldridge, Benjamin N.; Khandros, Igor Y.; Pedersen, David V.; Whitten, Ralph G., Test assembly including a test die for testing a semiconductor product die.
  392. Eldridge, Benjamin N.; Khandros, Igor Y.; Pedersen, David V.; Whitten, Ralph G., Test assembly including a test die for testing a semiconductor product die.
  393. Eldridge, Benjamin N.; Wenzel, Stuart W., Test head assembly for electronic components with plurality of contoured microelectronic spring contacts.
  394. Evans Arthur (Brookfield Center CT) Baker Joseph R. (New Milford CT) Rising Robert P. (Trumbull CT), Test probe assembly for testing integrated circuit devices.
  395. Lee, Sang-Bin; Kliman, Gerald Burt; Mall, Waheed Tony, Test probe for electrical devices having low or no wedge depression.
  396. Beaman Brian Samuel ; Fogel Keith Edward ; Lauro Paul Alfred ; Norcott Maurice Heathcote ; Shih Da-Yuan ; Walker George Frederick, Test probe for high density integrated circuits, methods of fabrication thereof and methods of use thereof.
  397. Beaman Brian S. (Hyde Park NY) Fogel Keith E. (Bardonia NY) Lauro Paul A. (Nanuet NY) Norcott Maurice H. (Valley Cottage NY) Shih Da-Yuan (Poughkeepsie NY) Walker George F. (New York NY), Test probe having elongated conductor embedded in an elostomeric material which is mounted on a space transformer.
  398. Miller, Charles A., Test signal distribution system for IC tester.
  399. Miller, Charles A., Tester channel to multiple IC terminals.
  400. Byrnes Herbert P. (Poughkeepsie NY) Halbout Jean-Marc (Larchmont NY) Scheuermann Michael R. (Katonah NY) Shapiro Eugene (Stamford CT), Thin interface pellicle for dense arrays of electrical interconnects.
  401. Beaman Brian S. (Hyde Park NY) Doany Fuad E. (Katonah NY) Fogel Keith E. (Bardonia NY) Hedrick ; Jr. James L. (Oakland CA) Lauro Paul A. (Nanuet NY) Norcott Maurice H. (Valley Cottage NY) Ritsko John, Three dimensional high performance interconnection package.
  402. Barr, Andrew Harvey; Logan, Gary, Tip and tip assembly for a signal probe.
  403. Matsunaga Kouji,JPX ; Inoue Hirobumi,JPX ; Tanehashi Masao,JPX ; Taura Toru,JPX ; Nikaidou Masahiko,JPX ; Yamagishi Yuuichi,JPX ; Hayakawa Satoshi,JPX, Tip portion structure of high-frequency probe and method for fabrication probe tip portion composed by coaxial cable.
  404. Jacobs,Lawrence W.; Campbell,Julie A., Transmission line input structure test probe.
  405. Faz Albert (San Antonio TX) Coronado Rodolfo U. (San Antonio TX), Turntable for rotating a wafer carrier.
  406. Ference Thomas G. ; Howell Wayne J., Ultra fine probe contacts.
  407. Capps,Charles P.; Johnson,Brian W.; Gloudemans,Jeffrey M.; Lane,John A., Ultra-broadband differential voltage probes.
  408. McTigue, Michael Thomas, Voltage probe.
  409. Lockwood Larry R. (McMinnville OR) Gleason Kimberly R. (Portland OR) Strid Eric W. (Portland OR), Wafer probe.
  410. Strid Eric W. (Portland OR) Gleason Kimberly R. (Portland OR), Wafer probe.
  411. Sang Emmanuel (Portland OR) Estabrook Gary L. (Vancouver WA), Wafer probe head.
  412. Hollman, Kenneth F., Wafer probe station.
  413. Harwood,Warren K.; Tervo,Paul A.; Koxxy,Martin J., Wafer probe station having environment control enclosure.
  414. Barsotti Christina C. (Vancouver WA) Schamel Alfred H. (West Linn OR), Wafer probe with transparent loading member.
  415. Khandros Igor Y. ; Pedersen David V., Wafer-level burn-in and test.
  416. Khandros, Igor Y.; Pedersen, David V., Wafer-level burn-in and test.
  417. Khandros, Igor Y.; Pedersen, David V., Wafer-level burn-in and test.
  418. Eldridge Benjamin N. ; Grube Gary W. ; Khandros Igor Y. ; Mathieu Gaetan L., Wafer-level test and burn-in, and semiconductor process.
  419. Blackwood,Jeffrey, Wafer-mounted micro-probing platform.
  420. Martin, John T., Waveguide with adjustable backshort.
  421. Satomura,Hiroaki; Fujita,Shinya; Ukita,Junichi; Watanabe,Katsuhiko, Wavelength dispersion probing system.
  422. Patrick G. Kim ; Donald L. Smith ; Andrew S. Alimonda, Wear-resistant spring contacts.
  423. Howland, Jr.,William H.; Hillard,Robert J.; Hung,Steven Chi Shin, Work function controlled probe for measuring properties of a semiconductor wafer and method of use thereof.

이 특허를 인용한 특허 (12) 인용/피인용 타임라인 분석

  1. Lewinnek, David Walter; Sinsheimer, Roger Allen; Valiente, Luis Antonio; DiPalo, Craig Anthony, Interconnect for transmitting signals between a device and a tester.
  2. Gleason, K. Reed; Bayne, Michael A.; Smith, Kenneth; Lesher, Timothy; Koxxy, Martin, Membrane probing method using improved contact.
  3. Gleason, Reed; Bayne, Michael A.; Smith, Kenneth; Lesher, Timothy; Koxxy, Martin, Membrane probing method using improved contact.
  4. Gleason, K. Reed; Smith, Kenneth R.; Bayne, Mike, Membrane probing structure with laterally scrubbing contacts.
  5. Gleason, Reed; Bayne, Michael A.; Smith, Kenneth; Lesher, Timothy; Koxxy, Martin, Membrane probing system.
  6. Gleason, K. Reed; Smith, Kenneth R.; Bayne, Mike, Membrane probing system with local contact scrub.
  7. Gleason, K. Reed; Smith, Kenneth R.; Bayne, Mike, Membrane probing system with local contact scrub.
  8. Smith, Kenneth R., Method of replacing an existing contact of a wafer probing assembly.
  9. Smith, Kenneth R.; Hayward, Roger, Probing apparatus with impedance optimized interface.
  10. Smith, Kenneth R., Replaceable coupon for a probing apparatus.
  11. Sinsheimer, Roger Allen, Structure for transmitting signals in an application space between a device under test and test electronics.
  12. Suto, Anthony J.; Wrinn, Joseph Francis; Toscano, John P.; Arena, John Joseph, Test fixture.

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