IPC분류정보
국가/구분 |
United States(US) Patent
등록
|
국제특허분류(IPC7판) |
|
출원번호 |
US-0142232
(2005-06-02)
|
등록번호 |
US-7267320
(2007-09-11)
|
우선권정보 |
KR-10-2004-0043218(2004-06-11) |
발명자
/ 주소 |
|
출원인 / 주소 |
- Samsung Electronics Co., Ltd.
|
대리인 / 주소 |
|
인용정보 |
피인용 횟수 :
0 인용 특허 :
7 |
초록
▼
A mold apparatus having at least a pair of molds formed with a cavity, at least one pipe accommodator formed in the molds, at least one heat pipe mounted in the pipe accommodator, a heat-cool source part connected to the heat pipe the heat and cool the heat pipe, and a controller to control the heat
A mold apparatus having at least a pair of molds formed with a cavity, at least one pipe accommodator formed in the molds, at least one heat pipe mounted in the pipe accommodator, a heat-cool source part connected to the heat pipe the heat and cool the heat pipe, and a controller to control the heat-cool source part to selectively heat and cool the heat pipe. Thus a mold apparatus to reduce a molding cycle and improve the quality of a molded product's appearance is provided.
대표청구항
▼
What is claimed is: 1. A mold apparatus comprising: at least a pair of molds formed with a cavity; at least one pipe accommodator formed in the molds; at least one heat pipe mounted in the pipe accommodator; a heat-cool source part connected to the heat pipe, to heat and cool the heat pipe; and a c
What is claimed is: 1. A mold apparatus comprising: at least a pair of molds formed with a cavity; at least one pipe accommodator formed in the molds; at least one heat pipe mounted in the pipe accommodator; a heat-cool source part connected to the heat pipe, to heat and cool the heat pipe; and a controller to control the heat-cool source part to selectively heat and cool the heat pipe. 2. The mold apparatus according to 1, wherein the heat-cool source part may be connected to a side of the heat pipe. 3. The mold apparatus according to 2, wherein the controller controls the heat-cool source part to be selectively supplied with a heat source and a cool source. 4. The mold apparatus according to 3, wherein the heat-cool source part comprises at least one pump supplying and discharging the heat source and the cool source. 5. The mold apparatus according to 1, wherein the heat-cool source part comprises a heat source part and a cool source part respectively coupled to the heat pipe. 6. The mold apparatus according to 5, wherein the pipe accommodator passes through the molds, and the heat source part and the cool source part are respectively connected to opposite sides of the heat pipe passing through the pipe accommodator. 7. The mold apparatus according to 6, wherein the controller supplies the heat source to the heat source part and cuts off supplying of the cool source to the cool source part when the molds are heated, and the controller supplies the cool source to the cool source part and cuts off supplying of the heat source to the heat source part when the molds are cooled. 8. The mold apparatus according to 3, wherein the heat source comprises at least one of oil, water and steam, and the cool source comprises at least of one liquefied nitrogen gas, water and air. 9. The mold apparatus according to 1, wherein the heat-cool source part comprises a temperature sensor detecting temperature of the heat-cool source part. 10. The mold apparatus according to 1, wherein at least one mold is detachably provided, and the pipe accommodator is formed at a detaching surface of the mold to correspond to the shape of the cavity. 11. A mold apparatus comprising: a mold body having first and second mold parts in contact with each other and forming a cavity therebetween; at least one pipe accommodator formed in at least one of the first and second mold parts; a heat pipe accommodated in each of the pipe accommodators; and a heat-cool source member connected to each heat pipe to selectively provide a heat source and a cool source through the heat pipe to heat and cool the mold body. 12. The mold apparatus of claim 11, wherein the heat-cool source member comprises a controller to control the selectivity of providing the heat source and cool source to the heat pipe. 13. The mold apparatus of claim 11, wherein one of the first and second mold parts is a fixed mold and the other one of the first and second mold parts is a moving mold movable to be separated from the fixed mold. 14. The mold apparatus of claim 13, further comprising an injecting part to inject a melted resin into the mold body, the injecting part comprising a fixed mold supporter to support the fixed mold and a moving mold supporter to support the moving mold. 15. The mold apparatus of claim 12, wherein the heat-cool source member comprises a valve to modulate the amount of each of the heat source and the cool source. 16. The mold apparatus of claim 12, wherein the heat-cool source member further comprises a temperature sensor to sense a temperature of the heat-cool source part, and the controller controls the supply amount, supply time, discharging amount and discharging time of the heat source and cool source based on the temperature of the sensed and the cycle of a molding process. 17. The mold apparatus of claim 12, wherein the heat pipe extends through the mold body, and heat-cool source member comprises: a heat source member connected at one end of the heat pipe; and a cool source member connected at another end of the heat pipe. 18. The mold apparatus of claim 17, wherein each of the heat source member and the cool source member comprises a temperature sensor to sense a of the heat-cool source part, and the controller controls the supply amount, supply time, discharging amount and discharging time of the heat source and cool source based on the temperature of the sensed and the cycle of a molding process.
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