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Methods and systems for auxiliary cooling of electrical device housings are provided. In one embodiment, an electronics device enclosure system is provided. The system comprises a housing, wherein the housing encloses one or more electronic devices; a backplane situated within the housing wherein at

Methods and systems for auxiliary cooling of electrical device housings are provided. In one embodiment, an electronics device enclosure system is provided. The system comprises a housing, wherein the housing encloses one or more electronic devices; a backplane situated within the housing wherein at least one of the one or more electronic devices are coupled to the backplane; and an auxiliary cooling system coupled to the backplane and adapted to receive electrical power from one or more power sources, wherein the auxiliary cooling system comprises one or both of a thermoelectric cooling module and a fan, and wherein the auxiliary cooling system is adapted to increase the heat transfer from the one or more electronic devices to an environment external to the housing.

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What is claimed is: 1. An electronics device enclosure system, the system comprising: a housing, wherein the housing encloses one or more electronic devices; a backplane situated within the housing wherein at least one of the one or more electronic devices are coupled to the backplane; and an auxil

What is claimed is: 1. An electronics device enclosure system, the system comprising: a housing, wherein the housing encloses one or more electronic devices; a backplane situated within the housing wherein at least one of the one or more electronic devices are coupled to the backplane; and an auxiliary cooling system coupled to the backplane and adapted to receive electrical power from one or more power sources, wherein the auxiliary cooling system comprises one or both of a thermoelectric cooling module and a fan, and wherein the auxiliary cooling system is adapted to increase the heat transfer from the one or more electronic devices to an environment external to the housing; and wherein the backplane is adapted to couple with telecommunication circuit repeater cards. 2. The system of claim 1, wherein one or more of the electronic devices and the auxiliary cooling system is coupled to the one or more power sources through at least one span cable. 3. The system of claim 2, further comprising: a network node external to the housing and coupled to the backplane by the at least one span cable, wherein the one or more power sources are located within the network node. 4. The system of claim 3, wherein the network node is one of a central office and a remote terminal. 5. The system of claim 3, wherein the auxiliary cooling system further comprises a protocol synthesizer that mimics a remote repeater and is adapted to receive power from the network node. 6. The system of claim 5, wherein the protocol synthesizer is adapted to provide one or more of: support for embedded operations channels (EOC) for maintenance and provisioning purposes; support for defining a unique address for the auxiliary cooling system such that one or more messages on an end-to-end EOC are distinguishable between any of one or more repeaters and the auxiliary cooling system; loop power through to one or both of a repeater housed in a separate housing and an auxiliary cooling system housed in a separate housing; DC continuity indication for shorts; power shut off when a non-compatible component is recognized; support for disabling loop power enabling when a fault is detected by the auxiliary cooling system and re-enabling loop power enabling when the fault is cleared; and support for a tone-through feature to allow tracing through the auxiliary cooling system when the auxiliary cooling system is not powered. 7. The system of claim 1, wherein the one or more power sources comprise one or more of a battery and a DC power source. 8. The system of claim 1, wherein the auxiliary cooling system further comprises: a card adapted to couple with the backplane; protection circuitry connected to the card and adapted to protect the auxiliary cooling system from at least one of short circuits, over-current, over-voltage, and polarity reversal; and at least one power converter connected to the card and adapted to convert power from the one or more power sources into a voltage usable to operate one or both of the thermoelectric cooling module and the fan. 9. The system of claim 8, wherein the auxiliary cooling system further comprises a temperature switch adapted to operate one or both of the thermoelectric cooling module and the fan based on the ambient temperature inside the housing. 10. The system of claim 1, wherein the one or more electronic devices comprise one or more telecommunication circuit repeater cards. 11. The system of claim 1, further comprising: a heat transfer device adapted to transfer heat produced by at least one of the one or more electronic devices to one or both of a wall of the housing and a heat transfer path to the environment external to the housing; wherein the thermoelectric cooling module is coupled to the heat transfer device and adapted to pump heat produced by the at least one of the one or more electronic devices into the heat transfer device. 12. The system of claim 1, further comprising: a first heat transfer device adapted to transfer heat produced by at least one of the one or more electronic devices to the thermoelectric cooling module; wherein the thermoelectric cooling module is coupled to the first heat transfer device and adapted to pump heat from the first heat transfer device to one or both of a wall of the housing and a heat transfer path adapted transfer heat to the environment external to the housing. 13. The system of claim 1, further comprising: a heat sink mounted to a hot junction side of the thermoelectric cooling module, wherein a cold junction side of the thermoelectric cooling module is mounted to receive heat generated by at least one of the one or more electronic devices, and wherein the thermoelectric cooling module pumps heat produced by the at least one of the one or more electronic devices to the heat sink. 14. The system of claim 1, further comprising: a heat sink mounted to a cold junction side of the thermoelectric cooling module, wherein the heat sink receives heat generated by the one or more electronic devices, wherein a hot junction side of the thermoelectric cooling module is mounted to the wall of the housing, and wherein the thermoelectric cooling module pumps heat received by the heat sink to one or more of the wall of the housing and a heat transfer path to the environment external to the housing. 15. An auxiliary cooling system for a housing enclosing one or more electronic devices, the system comprising: a card adapted to couple with a backplane situated within the housing, wherein at least one of the one or more electronic devices are coupled to the backplane; and one or both of a thermoelectric cooling module and a fan, wherein one or both of the thermoelectric cooling module and the fan are adapted to receive electrical power from one or more power sources; wherein one or both of the thermoelectric cooling module and the fan are adapted to increase the heat transfer from the one or more electronic devices to an environment external to the housing; and wherein the one or more electronic devices comprise one or more telecommunication circuit repeater cards. 16. The system of claim 15, wherein the auxiliary cooling system further comprises: protection circuitry connected to the card and adapted to protect the auxiliary cooling system from at least one of short circuits, over-current, over-voltage, and polarity reversal; and at least one power converter connected to the card and adapted to convert power from the one or more power sources into a voltage usable to operate one or both of the thermoelectric cooling module and the fan. 17. The system of claim 16, wherein the auxiliary cooling system further comprises a temperature switch adapted to operate one or both of the thermoelectric cooling module and the fan based on the ambient temperature inside the housing. 18. The system of claim 15, wherein the one or more power sources comprise one or more of a battery and a DC power source. 19. The system of claim 15, further comprising: a heat sink mounted to a hot junction side of the thermoelectric cooling module, wherein a cold junction side of the thermoelectric cooling module is mounted to receive heat generated by at least one of the one or more electronic devices, and wherein the thermoelectric cooling module is adapted to pump heat produced by the at least one of the one or more electronic devices to the heat sink. 20. The system of claim 15, further comprising: a heat sink mounted to a cold junction side of the thermoelectric cooling module, wherein the heat sink is adapted to receive heat generated by the one or more electronic devices, wherein a hot junction side of the thermoelectric cooling module is adapted for mounting to a wall of the housing, and wherein the thermoelectric cooling module is adapted to pump heat received by the heat sink to one or both of the wall of the housing and a heat transfer path to the environment external to the housing. 21. The system of claim 15, wherein the thermoelectric cooling module is adapted to pump heat produced by at least one of the one or more electronic devices to a heat transfer device. 22. The system of claim 15, wherein the thermoelectric cooling module is adapted to pump heat produced by at least one of the one or more electronic devices from a heat transfer device to one or both of a wall of the housing and a heat transfer path to the environment external to the housing. 23. A method to provide auxiliary cooling to a housing enclosing one or more electronic devices, the method comprising: receiving power from one or more power sources with an auxiliary cooling system within a housing, wherein the housing encloses one or more electronic devices, and wherein the auxiliary cooling system comprises one or both of a fan and a thermoelectric cooling module; and operating one or both of the fan and the thermoelectric cooling module to transfer heat away from the one or more electronic devices; and wherein the auxiliary cooling system includes circuitry that mimics a remote repeater, and wherein the circuitry provides for one or more of: supporting embedded operations channels (EOC) for maintenance and provisioning purposes; supporting a definition of a unique address for the auxiliary cooling system such that the messages on an end-to-end EOC are distinguished between one or more repeaters and the auxiliary cooling system; passing a loop power to one or both of a repeater housed in a separate housing and an auxiliary cooling system housed in the separate housing; a DC continuity indication for shorts; shutting off power when a non-compatible component is recognized; supporting a capability to disable loop power enabling when a fault is detected by the auxiliary cooling system and re-enabling loop power enabling when the fault is cleared; and supporting a tone-through feature to allow tracing through the auxiliary cooling system when the auxiliary cooling system is not powered. 24. The method of claim 23, further comprising one or both of: circulating air within the housing; and pumping heat generated by at least one of the one or more electronic devices away from the at least one of the one or more electronic devices and towards the wall of the housing using the thermoelectric cooling module. 25. The method of claim 24, wherein pumping heat generated by at least one of the one or more electronic devices comprises pumping heat produced by at least one of the one or more electronic devices through a heat transfer device to one or both of a wall of the housing and a heat transfer path to the environment external to the housing. 26. The method of claim 24, wherein pumping heat generated by at least one of the one or more electronic devices comprises pumping heat produced by at least one of the one or more electronic devices from a cold junction side of the thermoelectric cooling module to a heat sink mounted to a hot junction side of the thermoelectric cooling module. 27. The method of claim 23, further comprising: protecting the auxiliary cooling system from at least one of short circuits, over-current, over-voltage, and polarity reversal. 28. The method of claim 23, further comprising: converting power from the one or more power sources into a voltage usable to operate one or both of the thermoelectric cooling module and the fan. 29. The method of claim 23, further comprising: switching power to one or both of the fan and the thermoelectric cooling module based on a temperature within the housing. 30. The method of claim 23, wherein providing electric power further comprises: coupling the backplane to a network node external to the housing through at least one span cable, wherein the one or more power sources are located within the network node. 31. The method of claim 23, further comprising: pumping heat received by a heat sink mounted to a cold junction side of the thermoelectric cooling module to a wall of the housing, wherein a hot junction side of the thermoelectric cooling module is mounted to the wall of the housing.