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Cooling apparatus for an electronics subsystem employing a coolant flow drive apparatus between coolant flow paths 원문보기

IPC분류정보
국가/구분 United States(US) Patent 등록
국제특허분류(IPC7판)
  • H05K-007/20
  • F04B-017/00
출원번호 US-0008732 (2004-12-09)
등록번호 US-7274566 (2007-09-25)
발명자 / 주소
  • Campbell,Levi A.
  • Chu,Richard C.
  • Ellsworth, Jr.,Michael J.
  • Iyengar,Madhusudan K.
  • Schmidt,Roger R.
  • Simons,Robert E.
출원인 / 주소
  • International Business Machines Corporation
대리인 / 주소
    Heslin Rothenberg Farley & Mesiti, P.C.
인용정보 피인용 횟수 : 55  인용 특허 : 19

초록

A coolant flow drive apparatus is provided for facilitating removal of heat from a cooling structure coupled to a heat generating electronics component. The coolant flow drive apparatus includes a turbine in fluid communication with a primary coolant flowing within a primary coolant flow loop, and a

대표청구항

What is claimed is: 1. A coolant flow drive apparatus for a cooling system comprising: a turbine in fluid communication with a primary coolant flowing within a primary coolant flow path; a pump in fluid communication with a secondary coolant within a secondary coolant flow path, the secondary coola

이 특허에 인용된 특허 (19)

  1. Sanjay K. Roy, Active cold plate/heat sink.
  2. Campbell,Levi A.; Chu,Richard C.; Ellsworth, Jr.,Michael J.; Iyengar,Madhusudan K.; Schmidt,Roger R.; Simons,Robert E., Cooling apparatus and method for an electronics module employing an integrated heat exchange assembly.
  3. Miller David Jonathan,GBX ; Sams Ian James,GBX ; Holland Michael James,GBX ; Fields Simon David,GBX, Cooling system for use in cooling electronic equipment.
  4. Point Jacques (Annecy FRX) Joulia Pierre (Saint Jorioz FRX), Electrically-driven rotary pump.
  5. Chu, Richard C.; Ellsworth, Jr., Michael J.; Simons, Robert E.; Singh, Prabjit, Electronic device substrate assembly with impermeable barrier and method of making.
  6. Goodson,Kenneth E.; Chen,Chuan Hua; Huber,David E.; Jiang,Linan; Kenny,Thomas W.; Koo,Jae Mo; Laser,Daniel J.; Mikkelsen,James C.; Santiago,Juan G.; Wang,Evelyn Ning Yi; Zeng,Shulin; Zhang,Lian, Electroosmotic microchannel cooling system.
  7. Goodson,Kenneth E.; Chen,Chuan Hua; Huber,David E.; Jiang,Linan; Kenny,Thomas W.; Koo,Jae Mo; Laser,Daniel J.; Mikkelsen,James C.; Santiago,Juan G.; Wang,Evelyn Ning Yi; Zeng,Shulin; Zhang,Lian, Electroosmotic microchannel cooling system.
  8. Morrow, Ernest J.; Sellers, Sally M.; Knudsen, Gary D., Evaporative cooling of electrical components.
  9. Cray Seymour R. (Colorado Springs CO) Sherwood Gregory J. (Colorado Springs CO), Gas-liquid forced turbulence cooling.
  10. Batchelder John Samuel, Heat exchange apparatus.
  11. Aleksandar Vukovic CA; Tim A. Venus CA; Howard J. Rajala CA; Douglas B. Cross CA; Paul van Leeuwen CA; Kim Roberts CA, Liquid cooling of removable electronic modules based on low pressure applying biasing mechanisms.
  12. Goodson,Kenneth; Kenny,Thomas; Zhou,Peng; Upadhya,Girish; Munch,Mark; McMaster,Mark; Horn,James, Method and apparatus for achieving temperature uniformity and hot spot cooling in a heat producing device.
  13. Pautsch, Gregory W., Method and apparatus for cooling electronic components.
  14. Gregory S. Cole ; Robert P. Scaringe, Method and two-phase spray cooling apparatus.
  15. Patel, Chandrakant D.; Beitelmal, Abdlmonem H.; Bash, Cullen E., Method, apparatus, and system for cooling electronic components.
  16. Bernhardt Anthony F. (Berkeley CA), Microchannel cooling of face down bonded chips.
  17. Morrow, Ernest J.; Sellers, Sally M.; Knudsen, Gary D., Modular spray cooling system for electronic components.
  18. Edwards Michael Ray ; Morris Garron Koch ; Estes Kurt Arthur ; Pais Martin, Multi-mode, two-phase cooling module.
  19. Bash, Cullen E.; Patel, Chandrakant D., Variably configured sprayjet cooling system.

이 특허를 인용한 특허 (55)

  1. David, Milnes P.; Domitrovits, Michael J.; Murphy, Joshua; Palmer, John V.; Rosato, Sal M., Air-moving assemblies with flywheels.
  2. David, Milnes P.; Domitrovits, Michael J.; Murphy, Joshua; Palmer, John V.; Rosato, Sal M., Air-moving assemblies with flywheels.
  3. Campbell, Levi A.; David, Milnes P.; Demetriou, Dustin W.; Domitrovits, Michael J.; Ellsworth, Jr., Michael J.; Palmer, John V.; Rosato, Sal M., Air-moving assembly with auxiliary turbine drive.
  4. VanGilder, James William; Healey, Christopher M.; Zhang, Xuanhang, Analysis of effect of transient events on temperature in a data center.
  5. Chester, Daniel; Hopton, Peter; Bent, Jason; Deakin, Keith, Cooled electronic system.
  6. Chester, Daniel; Hopton, Peter; Bent, Jason; Deakin, Keith, Cooled electronic system.
  7. Rasmussen, Neil; Bean, John H.; Uhrhan, Greg R.; Buell, Scott D., Cooling system and method.
  8. Rasmussen, Neil; Bean, Jr., John H.; Uhrhan, Greg R.; Buell, Scott D., Cooling system and method.
  9. Holahan, Maurice F.; Kline, Eric V.; Krystek, Paul N.; Rasmussen, Michael R.; Sinha, Arvind K.; Zins, Stephen M., Dual magnetically coupled rotor heat exchanger.
  10. Holahan, Maurice F.; Kline, Eric V.; Krystek, Paul N.; Rasmussen, Michael R.; Sinha, Arvind K.; Zins, Stephen M., Duplex flexible heat exchanger.
  11. Uchida,Hiroki; Taniguchi,Jun; Tokuhira,Hideshi; Ishinabe,Minoru; Ishiduka,Masanobu; Date,Hiroaki, Electronic apparatus.
  12. Tsai, Shui-Fa, Electronic device and liquid cooling heat dissipation device thereof.
  13. Graybill, David P.; Hoeft, Allan R.; Iyengar, Madhusudan K.; Porter, Donald W.; Romano, Enrico A.; Schmidt, Roger R.; Weber, Jr., Gerard V., Electronics rack with liquid-coolant-driven, electricity-generating system.
  14. Campbell, Levi A.; Chu, Richard C.; David, Milnes P.; Ellsworth, Jr., Michael J.; Iyengar, Madhusudan K.; Simons, Robert E., Flow boiling heat sink with vapor venting and condensing.
  15. Lyon, Geoff Sean, Fluid heat exchange systems.
  16. Lyon, Geoff Sean, Fluid heat exchange systems.
  17. Lyon, Geoff Sean, Fluid heat exchange systems.
  18. Lyon, Geoff Sean, Fluid heat exchanger configured to provide a split flow.
  19. Lyon, Geoff Sean, Fluid heat exchanger configured to provide a split flow.
  20. Campbell, Levi A.; Chu, Richard C.; David, Milnes P.; Ellsworth, Jr., Michael J.; Iyengar, Madhusudan K.; Simons, Robert E., Heat sink structure with a vapor-permeable membrane for two-phase cooling.
  21. Campbell, Levi A.; Chu, Richard C.; David, Milnes P.; Ellsworth, Jr., Michael J.; Iyengar, Madhusudan K.; Simons, Robert E., Heat sink structure with a vapor-permeable membrane for two-phase cooling.
  22. Campbell, Levi A.; Chu, Richard C.; David, Milnes P.; Ellsworth, Jr., Michael J.; Iyengar, Madhusudan K.; Simons, Robert E., Heat sink structure with a vapor-permeable membrane for two-phase cooling.
  23. Campbell, Levi A.; Chu, Richard C.; David, Milnes P.; Ellsworth, Jr., Michael J.; Iyengar, Madhusudan K.; Simons, Robert E., Heat sink structure with a vapor-permeable membrane for two-phase cooling.
  24. Campbell, Levi A.; Chu, Richard C.; David, Milnes P.; Ellsworth, Jr., Michael J.; Iyengar, Madhusudan K.; Simons, Robert E., Heat sink structure with a vapor-permeable membrane for two-phase cooling.
  25. Campbell, Levi A.; Chu, Richard C.; David, Milnes P.; Ellsworth, Jr., Michael J.; Iyengar, Madhusudan K.; Simons, Robert E., Heat sink structure with a vapor-permeable membrane for two-phase cooling.
  26. Campbell, Levi A.; Chu, Richard C.; David, Milnes P.; Ellsworth, Jr., Michael J.; Iyengar, Madhusudan K.; Simons, Robert E., Heat sink structure with a vapor-permeable membrane for two-phase cooling.
  27. Campbell, Levi A.; Chu, Richard C.; David, Milnes P.; Ellsworth, Jr., Michael J.; Iyengar, Madusudan K.; Simons, Robert E., Heat sink structure with a vapor-permeable membrane for two-phase cooling.
  28. Chang, Yao-Ting, Hydropower generating system.
  29. Wexler, Peter, In-row air containment and cooling system and method.
  30. Liu,Tay Jian; Tung,Chao Nien; Hou,Chuen Shu, Integrated liquid cooling system.
  31. Lyon, Geoff Sean; Holden, Mike; Gierl, Brydon, Manifolded heat exchangers and related systems.
  32. Tutunoglu, Ozan, Method and apparatus for cooling.
  33. Tutunoglu, Ozan; Bean, Jr., John H., Method and apparatus for cooling.
  34. Tutunoglu, Ozan; Lingrey, David James, Method and apparatus for cooling.
  35. Tutunoglu, Ozan; Bean, Jr., John H., Method of operating a cooling system having one or more cooling units.
  36. Lai, Cheng-Tien; Zhou, Zhi-Yong; Ding, Qiao-Li, Miniature liquid cooling device having an integral pump.
  37. Lai, Cheng-Tien; Zhou, Zhi-Yong; Ding, Qiao-Li, Miniature liquid cooling device having an integral pump.
  38. Lyon, Geoff Sean; Holden, Mike; Gierl, Brydon, Modular heat-transfer systems.
  39. Bean, Jr., John H., Modular ice storage for uninterruptible chilled water.
  40. Bean, Jr., John H., Modular ice storage for uninterruptible chilled water.
  41. Khanna, Vijayeshwar D.; McVicker, Gerard; Sri-Jayantha, Sri M., Pump structures integral to a fluid filled heat transfer apparatus.
  42. Lyon, Geoff Sean; Holden, Mike, Sensors, communication techniques, and related systems.
  43. Shrivastava, Saurabh K.; VanGilder, James W., System and method for arranging equipment in a data center.
  44. VanGilder, James William, System and method for prediction of temperature values in an electronics system.
  45. Healey, Christopher M.; Zhang, Xuanhang, System and method for sequential placement of cooling resources within data center layouts.
  46. Sawczak, Stephen D.; Komlenic, Todd; Adams, Michael, Systems and methods for computer equipment management.
  47. Sawczak, Stephen D.; Komlenic, Todd; Adams, Michael, Systems and methods for computer equipment management.
  48. Sawczak, Stephen D.; Komlenic, Todd; Adams, Michael, Systems and methods for computer equipment management.
  49. Sawczak, Stephen D.; Komlenic, Todd; Adams, Michael, Systems and methods for computer equipment management.
  50. Zimmerman, Charles Wayne, Two piece impeller centrifugal pump.
  51. Campbell, Levi A.; Chu, Richard C.; David, Milnes P.; Ellsworth, Jr., Michael J.; Iyengar, Madhusudan K.; Simons, Robert E., Valve controlled, node-level vapor condensation for two-phase heat sink(s).
  52. Campbell, Levi A.; Chu, Richard C.; David, Milnes P.; Ellsworth, Jr., Michael J.; Iyengar, Madhusudan K.; Simons, Robert E., Valve controlled, node-level vapor condensation for two-phase heat sink(s).
  53. Campbell, Levi A.; Chu, Richard C.; David, Milnes P.; Ellsworth, Jr., Michael J.; Iyengar, Madhusudan K.; Simons, Robert E., Valve controlled, node-level vapor condensation for two-phase heat sink(s).
  54. Campbell, Levi A.; Chu, Richard C.; David, Milnes P.; Ellsworth, Jr., Michael J.; Iyengar, Madusudan K.; Simons, Robert E., Valve controlled, node-level vapor condensation for two-phase heat sink(s).
  55. Chiang, Kuei-Fung, Water cooled heat dissipation module for electronic device.
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