Cooling apparatus for an electronics subsystem employing a coolant flow drive apparatus between coolant flow paths
원문보기
IPC분류정보
국가/구분
United States(US) Patent
등록
국제특허분류(IPC7판)
H05K-007/20
F04B-017/00
출원번호
US-0008732
(2004-12-09)
등록번호
US-7274566
(2007-09-25)
발명자
/ 주소
Campbell,Levi A.
Chu,Richard C.
Ellsworth, Jr.,Michael J.
Iyengar,Madhusudan K.
Schmidt,Roger R.
Simons,Robert E.
출원인 / 주소
International Business Machines Corporation
대리인 / 주소
Heslin Rothenberg Farley & Mesiti, P.C.
인용정보
피인용 횟수 :
55인용 특허 :
19
초록▼
A coolant flow drive apparatus is provided for facilitating removal of heat from a cooling structure coupled to a heat generating electronics component. The coolant flow drive apparatus includes a turbine in fluid communication with a primary coolant flowing within a primary coolant flow loop, and a
A coolant flow drive apparatus is provided for facilitating removal of heat from a cooling structure coupled to a heat generating electronics component. The coolant flow drive apparatus includes a turbine in fluid communication with a primary coolant flowing within a primary coolant flow loop, and a pump in fluid communication with a secondary coolant within a secondary coolant flow path. The secondary fluid flow path is separate from the primary coolant flow path. The flow drive apparatus further includes a magnetic coupling between the turbine and the pump, wherein the turbine drives the pump through the magnetic coupling to pump secondary coolant through the secondary coolant flow path.
대표청구항▼
What is claimed is: 1. A coolant flow drive apparatus for a cooling system comprising: a turbine in fluid communication with a primary coolant flowing within a primary coolant flow path; a pump in fluid communication with a secondary coolant within a secondary coolant flow path, the secondary coola
What is claimed is: 1. A coolant flow drive apparatus for a cooling system comprising: a turbine in fluid communication with a primary coolant flowing within a primary coolant flow path; a pump in fluid communication with a secondary coolant within a secondary coolant flow path, the secondary coolant flow path being separate from the primary coolant flow path; and a magnetic coupling between the turbine and the pump, wherein the turbine drives the pump through the magnetic coupling, to pump secondary coolant through the secondary coolant flow path. 2. The coolant flow drive apparatus of claim 1, further comprising a center chassis separating the turbine in fluid communication with the primary coolant and the pump in fluid communication with the secondary coolant, wherein the center chassis comprises a seal-less, non-magnetic structure. 3. The coolant flow drive apparatus of claim 2, wherein the center chassis further comprises a solid region across which the magnetic coupling occurs between the turbine and the pump. 4. The coolant flow drive apparatus of claim 3, wherein the turbine further comprises a turbine impeller and the pump further comprises a pump impeller and wherein the magnetic coupling comprises first permanent magnets associated with the turbine impeller and second permanent magnets associated with the pump impeller. 5. The coolant flow drive apparatus of claim 1, wherein the turbine comprises a hydraulic radial flow turbine and the pump comprises a centrifugal pump. 6. The coolant flow drive apparatus of claim 1, wherein the primary coolant and the secondary coolant differ by at least one characteristic, the at least one characteristic comprising at least one of: coolant purity; coolant pressure; coolant flow rate; coolant phase change temperature; and coolant chemistry. 7. A cooling apparatus comprising: a primary coolant flow path and a separate, secondary coolant flow path, the secondary coolant flow path facilitating removal of heat to the primary coolant flow path from a cooling structure coupled to a heat generating electronics component; and a coolant flow drive apparatus coupled between the primary coolant flow path and the secondary coolant flow path, the coolant flow drive apparatus maintaining isolation of primary coolant in the primary coolant flow path and secondary coolant in the secondary coolant flow path, and transferring fluid flow energy from primary coolant flowing within the primary coolant flow path to the secondary coolant to pump the secondary coolant through the secondary coolant flow path. 8. The cooling apparatus of claim 7, wherein the coolant flow drive apparatus comprises: a turbine in fluid communication with primary coolant flowing within the primary coolant flow path; a pump in fluid communication with secondary coolant within the secondary coolant flow path; and a magnetic coupling between the turbine and the pump, wherein the turbine drives the pump through the magnetic coupling to pump secondary coolant through the secondary coolant flow path. 9. The cooling apparatus of claim 8, wherein the coolant flow drive apparatus further comprises a center chassis separating the turbine in fluid communication with the primary coolant and the pump in fluid communication with the secondary coolant, the center chassis comprising a seal-less, non-magnetic structure. 10. The cooling apparatus of claim 9, wherein the center chassis further comprises a solid region across which the magnetic coupling occurs between the turbine and the pump. 11. The cooling apparatus of claim 10, wherein the magnetic coupling further comprises first permanent magnets associated with an impeller of the turbine, and second permanent magnets associated with an impeller of the pump, the first permanent magnets and the second permanent magnets magnetically coupling across the solid region of the center chassis. 12. The cooling apparatus of claim 8, wherein the turbine comprises a hydraulic radial flow turbine, and the pump comprises a centrifugal pump. 13. The cooling apparatus of claim 7, wherein the primary coolant and the secondary coolant differ by at least one characteristic, the at least one characteristic comprising at least one of: coolant purity; coolant pressure; coolant flow rate; coolant phase change temperature; and coolant chemistry. 14. The cooling apparatus of claim 7, wherein the cooling structure comprises a micro-scaled cooling structure. 15. A cooled electronics system comprising: at least one electronics rack comprising a plurality of electronics subsystems; and a cooling apparatus for at least one electronics subsystem of the plurality of electronics subsystems, the cooling apparatus comprising: a primary coolant flow path and a separate, secondary coolant flow path, the secondary coolant flow path facilitating removal of heat to the primary coolant flow path from a cooling structure coupled to a heat generating electronics component within the at least one electronics subsystem; and a coolant flow drive apparatus coupled between the primary coolant flow path and the secondary coolant flow path, the coolant flow drive apparatus maintaining isolation of primary coolant in the primary coolant flow path and secondary coolant in the secondary coolant flow path, and transferring fluid flow energy from primary coolant flowing within the primary coolant flow path to the secondary coolant to pump the secondary coolant through the secondary coolant flow path. 16. The cooled electronics system of claim 15, wherein the cooling structure comprises a micro-scaled cooling structure coupled to the heat generating electronics component. 17. The cooled electronics system of claim 15, wherein the coolant flow drive apparatus comprises: a turbine in fluid communication with primary coolant flowing within the primary coolant flow path; a pump in fluid communication with secondary coolant within the secondary fluid flow path; and a magnetic coupling between the turbine and the pump, wherein the turbine drives the pump through the magnetic coupling to pump secondary coolant through the secondary flow path. 18. The cooled electronics system of claim 17, wherein the coolant flow drive apparatus further comprises a center chassis separating the turbine and the pump, the center chassis comprising a seal-less non-magnetic structure. 19. The cooled electronics system of claim 18, wherein the center chassis comprises a solid region, and wherein the magnetic coupling comprises first permanent magnets associated with an impeller of the turbine and second permanent magnets associated with an impeller of the pump, wherein the first permanent magnets and the second permanent magnets magnetically couple across the solid region of the center chassis. 20. The cooled electronics system of claim 17, wherein the turbine comprises a hydraulic radial flow turbine, and the pump comprises a centrifugal pump.
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Campbell, Levi A.; Chu, Richard C.; David, Milnes P.; Ellsworth, Jr., Michael J.; Iyengar, Madhusudan K.; Simons, Robert E., Heat sink structure with a vapor-permeable membrane for two-phase cooling.
Campbell, Levi A.; Chu, Richard C.; David, Milnes P.; Ellsworth, Jr., Michael J.; Iyengar, Madhusudan K.; Simons, Robert E., Heat sink structure with a vapor-permeable membrane for two-phase cooling.
Campbell, Levi A.; Chu, Richard C.; David, Milnes P.; Ellsworth, Jr., Michael J.; Iyengar, Madhusudan K.; Simons, Robert E., Heat sink structure with a vapor-permeable membrane for two-phase cooling.
Campbell, Levi A.; Chu, Richard C.; David, Milnes P.; Ellsworth, Jr., Michael J.; Iyengar, Madhusudan K.; Simons, Robert E., Heat sink structure with a vapor-permeable membrane for two-phase cooling.
Campbell, Levi A.; Chu, Richard C.; David, Milnes P.; Ellsworth, Jr., Michael J.; Iyengar, Madhusudan K.; Simons, Robert E., Heat sink structure with a vapor-permeable membrane for two-phase cooling.
Campbell, Levi A.; Chu, Richard C.; David, Milnes P.; Ellsworth, Jr., Michael J.; Iyengar, Madusudan K.; Simons, Robert E., Heat sink structure with a vapor-permeable membrane for two-phase cooling.
Campbell, Levi A.; Chu, Richard C.; David, Milnes P.; Ellsworth, Jr., Michael J.; Iyengar, Madhusudan K.; Simons, Robert E., Valve controlled, node-level vapor condensation for two-phase heat sink(s).
Campbell, Levi A.; Chu, Richard C.; David, Milnes P.; Ellsworth, Jr., Michael J.; Iyengar, Madhusudan K.; Simons, Robert E., Valve controlled, node-level vapor condensation for two-phase heat sink(s).
Campbell, Levi A.; Chu, Richard C.; David, Milnes P.; Ellsworth, Jr., Michael J.; Iyengar, Madhusudan K.; Simons, Robert E., Valve controlled, node-level vapor condensation for two-phase heat sink(s).
Campbell, Levi A.; Chu, Richard C.; David, Milnes P.; Ellsworth, Jr., Michael J.; Iyengar, Madusudan K.; Simons, Robert E., Valve controlled, node-level vapor condensation for two-phase heat sink(s).
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