[특허]Methods of making microelectronic packages with conductive elastomeric posts

[미국특허] Methods of making microelectronic packages with conductive elastomeric posts 원문보기

IPC분류정보
국가/구분	United States(US) Patent 등록
국제특허분류(IPC7판)	H01L-021/00
출원번호	US-0289743 (2005-11-29)
등록번호	US-7276400 (2007-10-02)
발명자 / 주소	Fjelstad,Joseph
출원인 / 주소	Tessera, Inc.
대리인 / 주소	Lerner, David, Littenberg, Krumholz & Mentlik, LLP
인용정보	피인용 횟수 : 5 인용 특허 : 113

초록 ▼

A method of making a microelectronic assembly includes providing a first microelectronic element having a first surface and a plurality of contacts exposed at the first surface; providing a second microelectronic element having a top surface and a plurality of contacts exposed at the top surface, forming a plurality of conductive elastomeric posts that connect at least some of the contacts of the first microelectronic element to at least some of the contacts of the second microelectronic element, and injecting a compliant material between the first surface of the first microelectronic element and the top surface of the second microelectronic element to form a compliant layer.

대표청구항 ▼

The invention claimed is: 1. A method of making a microelectronic assembly comprising: providing a first microelectronic element having a first surface and a plurality of contacts exposed at the first surface; providing a second microelectronic element having a top surface and a plurality of contacts exposed at the top surface; forming a plurality of conductive elastomeric posts that connect at least some of the contacts of the first microelectronic element to at least some of the contacts of the second microelectronic element; and injecting a compliant material between the first surface of the first microelectronic element and the top surface of the second microelectronic element to form a compliant layer. 2. The method as claimed in claim 1, wherein the conductive elastomeric posts comprise an elastomeric matrix and conductive particles. 3. The method as claimed in claim 1, wherein the second microelectronic element is a semiconductor chip. 4. The method as claimed in claim 1, further comprising juxtaposing the first surface of the first microelectronic element with the top surface of the second microelectronic element. 5. The method as claimed in claim 1, further comprising bonding the conductive elastomeric posts to at least some of the contacts of the first and second microelectronic elements. 6. The method as claimed in claim 1, further comprising planarizing the conductive elastomeric posts. 7. The method as claimed in claim 1, wherein one of the first and second microelectronic elements comprises a dielectric substrate wiring layer. 8. The method as claimed in claim 1, wherein the dielectric substrate wiring layer is flexible. 9. The method as claimed in claim 1, further comprising, after the injecting step, curing the compliant material between the first surface of the first microelectronic element and the top surface of the second microelectronic element. 10. The method as claimed in claim 2, wherein the conductive particles are silver or gold. 11. The method as claimed in claim 2, wherein the elastomeric matrix is a silicone elastomer or a low modulus polymer blend. 12. The method as claimed in claim 2, wherein the conductive particles include a nonconductive portion and a conductive portion that surrounds the nonconductive portion. 13. The method as claimed in claim 1, wherein the first microelectronic element is a semiconductor chip. 14. The method as claimed in claim 4, wherein the juxtaposing step includes aligning at least one of the contacts of the first microelectronic element with at least one of the contacts of the second microelectronic element. 15. The method as claimed in claim 7, wherein the dielectric substrate wiring layer has conductive terminal accessible at one or more surfaces thereof. 16. A method of making a microelectronic assembly comprising: providing a microelectronic element having a first surface and a plurality of contacts accessible at the first surface; providing a dielectric substrate having a top surface and a plurality of contacts accessible at the top surface; juxtaposing the first surface of the microelectronic element with the top surface of the dielectric substrate; forming a plurality of conductive elastomeric posts that connect at least some of the contacts of the first microelectronic element to at least some of the contacts of the dielectric substrate; and injecting a compliant material between the first surface of the first microelectronic element and the top surface of the dielectric substrate to form a compliant layer. 17. The method as claimed in claim 16, wherein the dielectric substrate comprises conductive traces overlying the top surface thereof. 18. The method as claimed in claim 16, wherein the dielectric substrate comprises metalized vias. 19. The method as claimed in claim 16, wherein the dielectric substrate comprises conductive traces extending between the top surface and a bottom surface thereof. 20. The method as claimed in claim 16, wherein the dielectric substrate is flexible.

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IPC	Description
A	생활필수품
A62	인명구조; 소방(사다리 E06C)
A62B	인명구조용의 기구, 장치 또는 방법(특히 의료용에 사용되는 밸브 A61M 39/00; 특히 물에서 쓰이는 인명구조 장치 또는 방법 B63C 9/00; 잠수장비 B63C 11/00; 특히 항공기에 쓰는 것, 예. 낙하산, 투출좌석 B64D; 특히 광산에서 쓰이는 구조장치 E21F 11/00)
A62B-1/08	.. 윈치 또는 풀리에 제동기구가 있는 것

내보내기 구분	파일저장 인쇄 메일전송
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[미국특허] Methods of making microelectronic packages with conductive elastomeric posts 원문보기

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[미국특허] Methods of making microelectronic packages with conductive elastomeric posts 원문보기

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이 특허에 인용된 특허 (113) 인용/피인용 타임라인 분석

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