초록 ▼

A chemical-mechanical polishing apparatus is provided with a downstream device for conditioning a web-shaped polishing pad. The device may be used to condition a glazed portion of the pad, and then the conditioned pad portion may be used again for polishing. The conditioning device is preferably arr

A chemical-mechanical polishing apparatus is provided with a downstream device for conditioning a web-shaped polishing pad. The device may be used to condition a glazed portion of the pad, and then the conditioned pad portion may be used again for polishing. The conditioning device is preferably arranged to apply different conditioning treatments to different portions of the glazed pad. The conditioning device may have roller segments that rotate at different speeds. Alternatively, the device may have non-cylindrical rollers that provide different rotational speeds at the pad surface, or the device may apply different pressures at different portions of the pad. The device may be arranged to provide uniform conditioning across the width of the pad. The invention is applicable to methods of planarizing semiconductor wafers. The invention may be used to condition circular pads in addition to web-shaped pads. The conditioning device may be adjusted or controlled in response to surface characteristics data obtained by measuring polished wafers.

대표청구항 ▼

What is claimed as new and desired to be protected by Letters Patent of the United States is: 1. A chemical-mechanical polishing method, said method comprising the steps of: moving a web-shaped polishing pad in first and second directions; dispensing slurry onto said web-shaped polishing pad; movin

What is claimed as new and desired to be protected by Letters Patent of the United States is: 1. A chemical-mechanical polishing method, said method comprising the steps of: moving a web-shaped polishing pad in first and second directions; dispensing slurry onto said web-shaped polishing pad; moving semiconductor devices in contact with said web-shaped polishing pad; and applying different conditioning treatments of a conditioning device to different portions of said web-shaped polishing pad, and conditioning said polishing pad by rotating independent roller segments of the conditioning device about a rotation axis and moving said roller segments laterally in an axial direction along said rotation axis. 2. The method of claim 1, wherein said step of moving said pad includes the step of unwinding said pad from a supply roller. 3. The method of claim 1, wherein said step of applying different conditioning treatments includes the step of rotating portions of a conditioning device at different speeds relative to the surface of said pad. 4. The method of claim 1, wherein said step of applying different conditioning treatments includes the step of applying different pressures to different portions of said pad. 5. The method of claim 1, further comprising the step of measuring the semiconductor devices, and wherein said step of applying said different conditioning treatments occurs subsequent to said measuring step. 6. A method of conditioning a polishing pad, said method comprising the steps of: applying different conditioning treatments of a conditioning device simultaneously during a conditioning process to the surface of said polishing pad; and during said step of applying said different conditioning treatments, providing relative rotation between said conditioning device and said polishing pad by rotating independent roller segments of the conditioning device about a rotation axis and moving said roller segments laterally in an axial direction along said rotation axis. 7. The conditioning method of claim 6, wherein said polishing pad is circular. 8. The conditioning method of claim 7, wherein said step of applying said different conditioning treatments includes the step of rotating roller segments at different speeds. 9. The conditioning method of claim 7, wherein said step of applying said different conditioning treatments includes the step of rotating a non-cylindrical roller. 10. The conditioning method of claim 7, wherein said step of applying said different conditioning treatments includes the step of applying different pressures to different portions of said pad. 11. The conditioning method of claim 6, further comprising the steps of obtaining surface characteristics data by measuring a work piece polished by said pad, and processing said data to control a conditioning device. 12. A chemical-mechanical polishing method, comprising: dispensing slurry onto a web-shaped polishing pad; pressing a semiconductor work piece against said web-shaped polishing pad, and moving said work piece relative to said web-shaped polishing pad; providing a conditioning device; moving said web-shaped polishing pad in first and second directions relative to said conditioning device, said step of moving said web-shaped polishing pad in said first direction includes the step of unwinding said web-shaped polishing pad from a supply roller; using said conditioning device to condition a glazed portion of said web-shaped polishing pad, said step of using said conditioning device includes the step of applying different conditioning treatments of the conditioning device to different portions of said web-shaped polishing pad, and conditioning said web-shaped polishing pad by rotating independent roller segments of the conditioning device about a rotation axis and moving said roller segments laterally in an axial direction along said rotation axis, wherein said step of applying different conditioning treatments includes the step of rotating portions of said conditioning device at different speeds relative to a surface of said web-shaped polishing pad. 13. The chemical-mechanical polishing method 12, wherein said step of conditioning said web-shaped polishing pad by moving roller segments includes the step of moving the roller segments in a direction along the direction of movement of said web-shaped polishing pad. 14. The chemical-mechanical polishing method 12, further comprising: measuring said semiconductor work piece using a measuring device to collect topographic data; processing said topographic data to update a uniformity data stored in a memory; and adjusting said conditioning device based on said uniformity data. 15. A method of conditioning a polishing pad, comprising: moving a glazed portion of a web-shaped polishing pad in a first direction for conditioning using a conditioning device, said step of moving said glazed portion of said pad includes the step of unwinding said pad from a supply roller; applying different conditioning treatments of a conditioning device simultaneously during a conditioning process to said glazed portion said web-shaped polishing pad, said step of applying said different conditioning treatments includes the step of providing relative rotation between said conditioning device and said polishing pad by rotating independent roller segments of the conditioning device about a rotation axis and moving said roller segments laterally in an axial direction along said rotation axis; moving a conditioned portion of said web-shaped polishing pad in a second direction to a polishing position; and repeating said steps of moving said glazed portion, applying different conditioning treatments, and moving said conditioned portion until said glazed portion or said conditioned portion of said pad cannot be efficiently conditioned. 16. The method of claim 15, further comprising: moving said glazed or conditioned portion in said first direction and onto a take-up reel; and unwinding a fresh portion of said pad from said supply roller.