초록 ▼

A lithographic projection apparatus is provided with a sensor for detecting one of luminescence radiation, desorbed particles, or free charges produced by an interaction of the projection beam with a material at surface of a substrate. The luminescence radiation, desorbed particles, or free charges

A lithographic projection apparatus is provided with a sensor for detecting one of luminescence radiation, desorbed particles, or free charges produced by an interaction of the projection beam with a material at surface of a substrate. The luminescence radiation, desorbed particles, or free charges are indicative of the dose delivered to the substrate, and can be detected close to the substrate or at the substrate level to avoid errors due to transmission variations in the optical path from the radiation source to the substrate.

대표청구항 ▼

We claim: 1. A lithographic projection apparatus, comprising: an illumination system; a structure adapted to hold a patterning component in an illumination path from said illumination system; a substrate table adapted to be disposed in a path of radiation from said patterning component, said substr

We claim: 1. A lithographic projection apparatus, comprising: an illumination system; a structure adapted to hold a patterning component in an illumination path from said illumination system; a substrate table adapted to be disposed in a path of radiation from said patterning component, said substrate table being adapted to hold a substrate; a projection system adapted to be disposed between the patterning component and the substrate table; and a sensor arranged to detect secondary radiation resulting from an interaction of illumination radiation from said illumination system with a material of the substrate, wherein, in use, the secondary radiation comprises luminescence radiation, or desorbed particles, or free charges, or any combination thereof. 2. A lithographic projection apparatus according to claim 1, wherein, in use, luminescence radiation results from an interaction of the illumination radiation with the material of the substrate, and wherein the sensor is arranged to detect the resulting luminescence radiation. 3. A lithographic projection apparatus according to claim 2, wherein said sensor comprises a detector. 4. A lithographic projection apparatus according to claim 3, wherein the detector is provided with a radiation guide to direct the luminescence radiation to the detector. 5. A lithographic projection apparatus according to claim 4, wherein said radiation guide comprises a reflective element, an optical fiber, or both. 6. A lithographic projection apparatus according to claim 4, wherein the detector is remote from said projection system. 7. A lithographic projection apparatus according to claim 3, wherein the detector comprises a photodiode, a photomultiplier tube, or both. 8. A lithographic projection apparatus according to claim 1, wherein said sensor comprises a plurality of detectors and an arrangement to sum their outputs. 9. A lithographic projection apparatus according to claim 1, wherein said sensor comprises a plurality of detectors arranged around a periphery of said substrate. 10. A lithographic projection apparatus according to claim 1, further comprising an integrator in communication with said sensor, wherein said integrator is adapted to integrate over time the output of said sensor. 11. A lithographic projection apparatus according to claim 1, further comprising a controller responsive to the output of said sensor and adapted to control a dose delivered by said illumination radiation in an exposure. 12. A lithographic projection apparatus according to claim 1, wherein said illumination system is adapted to supply illumination radiation having a wavelength of less than 200 nm. 13. A lithographic projection apparatus according to claim 2, wherein said luminescence radiation is light in the visible spectrum, the infrared spectrum, or both. 14. A lithographic projection apparatus according to claim 1, wherein, in use, desorbed particles from said material result from an interaction of the illumination radiation with the material of the substrate, and said sensor is a particle detector adapted to detect the particles desorbed from the material. 15. A lithographic projection apparatus according to claim 14, wherein said particle detector is positioned to generally face a surface of the substrate such that the particles desorbed from the material are intercepted by the particle detector. 16. A lithographic projection apparatus according to claim 14, wherein said material at the surface of the substrate is a resist layer deposited on the surface of the substrate. 17. A lithographic projection apparatus according to claim 14, wherein said particle detector comprises a channeltron. 18. A lithographic projection apparatus according to claim 17, wherein said particle detector further comprises a mass selector. 19. A lithographic projection apparatus according to claim 14, wherein said particle detector comprises a plurality of detection devices arranged around a periphery of said substrate. 20. A lithographic projection apparatus according to claim 1, wherein, in use, free charges result from an interaction of the illumination radiation with the material of the substrate, and said sensor is a free charge detector configured to detect the free charges. 21. A lithographic projection apparatus according to claim 20, wherein said free charges comprise electrons. 22. A lithographic projection apparatus according to claim 20, wherein the free charge detector comprises an electrode and said electrode is positioned to be in contact with a surface of the substrate such that the free charges flow from the surface towards the electrode. 23. A lithographic projection apparatus according to claim 20, wherein the free charge detector comprises a plurality of electrodes disposed to be in contact with a surface of the substrate and distributed around the periphery of the surface of the substrate such that the free charges flow from the surface of the substrate toward the electrodes. 24. A lithographic projection apparatus according to claim 20, wherein said material at a surface of the substrate is a semiconductor material, a conductive material, or both. 25. A lithographic projection apparatus, comprising: an illumination system; patterning component adapted to be disposed in an illumination path from said illumination system; substrate table adapted to be disposed in a path of radiation from said patterning component, said substrate table adapted to hold a substrate; projection system adapted to be disposed between the patterning component and the substrate table; and detection means for detecting secondary radiation caused by interaction of radiation from said illumination system with the substrate wherein, in use, the detected secondary radiation comprises luminescence radiation, or desorbed particles, or free charges, or any combination thereof. 26. A lithographic projection apparatus according to claim 25, wherein said secondary radiation detected by the detection means during use comprises luminescence radiation. 27. A lithographic projection apparatus according to claim 25, wherein said secondary radiation detected by the detection means during use comprises desorbed particles. 28. A lithographic projection apparatus according to claim 25, wherein said secondary radiation detected by the detection means during use comprises free charges. 29. A device manufacturing method comprising: projecting a beam of radiation onto a patterning component to endow the projection beam with a pattern in its cross-section; projecting the patterned beam of radiation onto a target area of a substrate with a projection system; and detecting secondary radiation comprising resulting from interaction of the beam of radiation with the substrate, wherein the detected secondary radiation comprises luminescence radiation, or desorbed particles, or free charges, or any combination thereof. 30. A device manufacturing method according to claim 29, wherein said detected secondary radiation comprises luminescence radiation given off by the substrate. 31. A device manufacturing method according to claim 29, wherein said detected secondary radiation comprises particles desorbed from a surface of the substrate. 32. A device manufacturing method according to claim 29, wherein said detected secondary radiation comprises free charges formed at a surface of the substrate.