Method for two-stage transfer molding device to encapsulate MMC module
원문보기
IPC분류정보
국가/구분
United States(US) Patent
등록
국제특허분류(IPC7판)
H01L-021/44
H01L-021/02
H01L-021/48
H01L-021/50
출원번호
US-0322819
(2005-12-30)
등록번호
US-7288441
(2007-10-30)
발명자
/ 주소
Bolken,Todd O.
출원인 / 주소
Micron Technology, Inc.
대리인 / 주소
TraskBritt, PC
인용정보
피인용 횟수 :
0인용 특허 :
57
초록▼
A method for fabricating a semiconductor card includes a printed circuit substrate upon which is mounted a card circuit including one or more semiconductor components such as dice or packages. External contacts link the card circuit to the circuit of another apparatus by removable insertion therein.
A method for fabricating a semiconductor card includes a printed circuit substrate upon which is mounted a card circuit including one or more semiconductor components such as dice or packages. External contacts link the card circuit to the circuit of another apparatus by removable insertion therein. The substrate is defined by a peripheral opening in a surrounding frame, which may be part of a multiframe strip. The substrate is connected to the frame by connecting segments. The card includes a first plastic casting molded to the substrate and encapsulating the semiconductor components while leaving a peripheral portion of the substrate uncovered. A second plastic casting is molded to the peripheral portion to abut the first plastic casting and form the card periphery.
대표청구항▼
What is claimed is: 1. A method for fabricating a card having a substrate having a circuit side and a back side, the substrate generally separated from a surrounding frame by a peripheral opening spanned by at least one connecting segment between the substrate and the frame, the substrate having at
What is claimed is: 1. A method for fabricating a card having a substrate having a circuit side and a back side, the substrate generally separated from a surrounding frame by a peripheral opening spanned by at least one connecting segment between the substrate and the frame, the substrate having at least one electrical circuit and at least one connector for communicating between the at least one electrical circuit and an external circuit, comprising: clamping the substrate and the frame between a first plate and a second plate of a first molding assembly forming a first mold cavity for injecting a first material into the first mold cavity for molding a first plastic casting onto the circuit side of the substrate and encapsulating the at least one electrical circuit while leaving a peripheral portion of the circuit side free of the first material, the first plastic casting having an exposed surface and clamping the frame, the substrate and the first plastic casting between a first plate and a second plate of a second molding assembly, at least a portion of the exposed surface of the first plastic casting compressed for sealingly engaging a portion of the back side of the substrate against the first plate of the second molding assembly, the first plate and the second plate of the second molding assembly forming a second mold cavity for injecting a second material into the second mold cavity for molding a second plastic casting surrounding the first plastic casting and enclosing the peripheral portion of the circuit side and an edge of the substrate, the second plastic casting having a peripheral outer edge; removing the card from the first mold cavity; and singulating the substrate from the frame. 2. The method of claim 1, further comprising: applying antiflash material to the back side of the substrate prior to clamping in the second molding assembly. 3. The method of claim 2, wherein the antiflash material comprises a film. 4. The method of claim 1, wherein the substrate has peripheral edges thereabout, and the at least one connecting segment comprises at least one connecting segment on each of two opposed peripheral edges of the substrate. 5. The method of claim 1, wherein the at least one electrical circuit includes at least one semiconductor component mounted on the circuit side. 6. The method of claim 1, further comprising: subjecting the first plastic casting to a curing step prior to clamping in the second molding assembly. 7. The method of claim 1, further comprising: subjecting the second plastic casting to a curing step after removal from the second molding assembly. 8. The method of claim 1, wherein the at least one connector is mounted on the back side of the substrate. 9. The method of claim 1, wherein the second molding assembly is configured to form the second plastic casting having an inner peripheral portion contiguous with the exposed surface of the first plastic casting, and an outer peripheral portion displaced from the exposed surface for attachment of a label covering an interface between the first plastic casting and the second plastic casting. 10. The method of claim 1, comprising: forming a notch in the second plastic casting during the molding thereof configured to enclose an exposed end of a connecting segment following singulation thereof. 11. The method of claim 10, wherein molding of the second plastic casting is performed by placing a pin in contact with the at least one connecting segment to form the notch. 12. The method of claim 10, wherein the singulation comprises cutting the connecting segment within the notch. 13. The method of claim 12, wherein the singulation comprises cutting the connecting segment with a cutter die. 14. The method of claim 1, wherein the second plastic casting is formed by compressing the frame and the substrate in the second molding assembly with the first plastic casting compressed for sealingly depressing the substrate to a displaced position relative to the frame. 15. The method of claim 14, wherein the second mold cavity provides for molding of laterally extending wings from a central portion of the peripheral outer edge of the second plastic casting, the wings extending outwardly beyond the peripheral outer edge. 16. The method of claim 14, wherein the displaced position provides encapsulation of the at least one connecting segment within the second plastic casting. 17. The method of claim 15, wherein singulating comprises cutting the wings and the at least one connecting segment from the second plastic casting along the peripheral outer edge thereof. 18. The method of claim 1, further comprising: removing extraneous hardened plastic attached to the first plastic casting. 19. A method for fabricating a semiconductor card having a substrate having at least one circuit formed thereon and at least one connector from a plurality of spaced-apart substrates in a strip, the strip having a plurality of peripheral openings defining the plurality of substrates and a plurality of connecting segments attaching the plurality of substrates to the strip, the method comprising: mounting a card circuit on each substrate of the plurality of spaced-apart substrates, each card circuit comprising at least one semiconductor component and apparatus for communication between each card circuit and an external circuit; molding first plastic castings to the plurality of substrates using a first molding assembly comprising a plurality of mold cavities for forming a first plastic casting over each circuit while leaving a peripheral portion of each substrate uncovered and molding second plastic castings encapsulating the peripheral portions of the plurality of substrates; removing the strip from the second molding assembly; removing the card from the first molding assembly; and severing the plurality of connecting segments to singulate individual semiconductor cards from the strip. 20. A method of fabricating a substrate having a circuit side and a back side, the substrate generally separated from a surrounding frame by a peripheral opening spanned by at least one connecting segment between the substrate and the frame, the substrate having an electrical circuit and at least one external connector for communicating between the electrical circuit and an external circuit, the method comprising: placing the substrate and the frame in a first molding assembly for injecting a first material into a first mold cavity formed by first and second plates to mold a first plastic casting onto the circuit side of the substrate and to encapsulate the electrical circuit while leaving a peripheral portion of the circuit side uncovered, the first plastic casting having an exposed surface; removing the frame, the substrate and the first plastic casting from the first molding assembly; placing the frame, the substrate and the first plastic casting between first and second plates of a second molding assembly, the exposed surface of the first plastic casting compressed for sealingly engaging the back side of the substrate against one of the first plate and the second plate of the second molding assembly for injecting a second material into a second mold cavity of the second molding assembly to mold a second plastic casting surrounding the first plastic casting and enclosing the uncovered peripheral portion and an edge of the substrate, the second plastic casting having a peripheral outer edge; removing the frame, the substrate and the first and second plastic castings from the second molding assembly; and performing a severing operation on the frame. 21. A method for fabricating a card comprising: providing a substrate having a circuit side and a back side, the substrate having a first portion thereof having a peripheral edge separated from a second portion of the substrate by a peripheral opening spanned by at least one connecting segment between the first portion of the substrate and the second portion of the substrate; placing the substrate between a first plate and a second plate of a first molding assembly, the first plate and the second plate forming a first mold cavity for injecting a first material into the first mold cavity for molding a first plastic casting onto at least a portion of the circuit side of the substrate and leaving a peripheral portion of the circuit side free of the first material, the first plastic casting having an exposed surface; placing the second portion of the substrate and the first plastic casting between a first plate and a second plate of a second molding assembly with at least a portion of the back side of the substrate engaging a portion of the first plate of the second molding assembly, the first plate and the second plate of the second molding assembly forming a second mold cavity for injecting a second material into the second mold cavity for molding a second plastic casting surrounding the first plastic casting and enclosing the peripheral edge of the first portion of the substrate, the second plastic casting having a peripheral outer edge; and removing the card from the first mold cavity. 22. A method for fabricating a card in a first molding assembly having a first plate and a second plate forming a first mold cavity and a second molding assembly having a first plate and a second plate forming a second mold cavity, the card having a substrate having a circuit side and a back side, the substrate generally separated from a surrounding frame by a peripheral opening spanned by at least one connecting segment between the substrate and the frame, the substrate having at least one electrical circuit and at least one connector for communicating between the at least one electrical circuit and an external circuit, comprising: placing the substrate and the frame between the first plate and the second plate of the first molding assembly for engaging at least portions of the first plate and at least potions of the second plate of the first molding assembly with at least portions of the substrate and the frame for injecting a first material into the first mold cavity for molding a first plastic casting onto the circuit side of the substrate and encapsulating the at least one electrical circuit while leaving a peripheral portion of the circuit side free of the first material, the first plastic casting having an exposed surface; placing the frame, substrate and first plastic casting between the first plate and the second plate of the second molding assembly, at least a portion of the exposed surface of the first plastic casting compressed for sealingly engaging a portion of the back side of the substrate against the first plate of the second molding assembly for injecting a second material into the second mold cavity for molding a second plastic casting surrounding the first plastic casting and enclosing the peripheral potion of the circuit side and an edge of the substrate, the second plastic casting having a peripheral outer edge; removing the card from the second molding assembly; and singulating the substrate from the frame. 23. A method for fabricating a plurality of semiconductor cards using a plurality of substrates in a strip having a plurality of spaced-apart substrates, the strip comprising a plurality of peripheral openings defining the plurality of substrates and a plurality of connecting segments attaching the plurality of substrates to the strip, each substrate of the plurality having at least one circuit thereon and at least one connector, the method comprising: mounting a card circuit on each substrate of the plurality, each card circuit comprising at least one semiconductor component and apparatus for communication between each card circuit and an external circuit; molding first plastic castings to the plurality of substrates using a first molding assembly comprising a plurality of mold cavities for forming a first plastic casting over each card circuit while leaving a peripheral portion of each substrate uncovered; molding second plastic castings to the plurality of substrates using a second molding assembly comprising a plurality of mold cavities for forming a second plastic casting encapsulating the peripheral portions of the plurality of substrates; removing the card from the first molding assembly; and forming singulated individual semiconductor cards from the strip. 24. A method of fabricating a card in a first molding assembly and a second molding assembly, the card having a circuit side, a back side, and a substrate generally separated from a surrounding frame by a peripheral opening spanned by at least one connecting segment between the substrate and the frame, the substrate having an electrical circuit and at least one external connector for communicating between the electrical circuit and an external circuit, the method comprising: placing the substrate and the frame between first and second plates of the first molding assembly for engaging at least portions of the substrate and the frame with at least portions of the first molding assembly for injecting a first material into a first mold cavity formed by the first and second plates to mold a first plastic casting onto a circuit side of the substrate and encapsulate the electrical circuit while leaving a peripheral portion of the circuit side uncovered, the first plastic casting having an exposed surface; placing the frame, the substrate and the first plastic casting between first and second plates of the second molding assembly, the exposed surface of the first plastic casting compressed for sealingly engaging a back side of the substrate against one of the first plate and the second plate of the second molding assembly for injecting a second material into a second mold cavity of the second molding assembly to mold a second plastic casting surrounding the first plastic casting and enclosing the uncovered peripheral portion and an edge of the substrate, the second plastic casting having a peripheral outer edge; removing the frame, the substrate and the first and second plastic castings from the first molding assembly and the second molding assembly when molding is finished in the first molding assembly and the second molding assembly; and performing a severing operation on the frame. 25. A method for fabricating a card having a substrate having a circuit side and a back side, the substrate having a first portion thereof having a peripheral edge separated from a second portion of the substrate by a peripheral opening spanned by at least one connecting segment between the first portion of the substrate and the second portion of the substrate in a first molding assembly and a second molding assembly comprising: placing the substrate between a first plate and a second plate of the first molding assembly, the first plate and the second plate forming a first mold cavity for engaging at least a portion of the substrate by portions of the first plate and portions of the second plate for injecting a first material into the first mold cavity for molding a first plastic casting onto at least a portion of the circuit side of the substrate and leaving a peripheral portion of the circuit side free of the first material, the first plastic casting having an exposed surface; placing the second portion of the substrate and the first plastic casting between a first plate and a second plate of the second molding assembly with at least a portion of the back side of the substrate engaging a portion of the first plate of the second molding assembly, the first plate and the second plate of the second molding assembly forming a second mold cavity for injecting a second material into the second mold cavity for molding a second plastic casting surrounding the first plastic casting and enclosing the peripheral edge of the first portion of the substrate, the second plastic casting having a peripheral outer edge; and removing the card from the second mold cavity.
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