[특허]Method for making a passive device structure

[미국특허] Method for making a passive device structure 원문보기

IPC분류정보
국가/구분	United States(US) Patent 등록
국제특허분류(IPC7판)	H01G-007/00
출원번호	US-0971829 (2004-10-21)
등록번호	US-7290315 (2007-11-06)
발명자 / 주소	Palanduz,Cengiz A. Min,Yongki
출원인 / 주소	Intel Corporation
대리인 / 주소	Blakely, Sokoloff, Taylor & Zafman LLP
인용정보	피인용 횟수 : 7 인용 특허 : 21

초록 ▼

A method including forming a ceramic material directly on a sheet of a first conductive material; forming a second conductive material on the ceramic material; and sintering the ceramic material. A method including forming a ceramic material directly on a sheet of a first conductive material; forming a second conductive material on the ceramic material so that the ceramic material is disposed between the first conductive material and the second conductive material; thermal processing at a temperature sufficient to sinter the ceramic material and form a film of the second conductive material; and coating an exposed surface of at least one of the first conduct material and the second conductive material with a different conductive material. An apparatus including first and second electrodes; and a ceramic material between the first electrode and the second electrode, wherein the ceramic material is sintered directly on one of the first and second electrode.

대표청구항 ▼

What is claimed is: 1. A method comprising: forming a ceramic material directly on a sheet of a first conductive material comprising a nickel foil material; forming a second conductive material on the ceramic material; sintering the ceramic material; then coating at least one of an exposed surface of the first conductive material and an exposed surface of the second conductive material with a copper material. 2. The method of claim 1, wherein the second conductive material is a paste and a condition for sintering the ceramic material converts the paste to a film. 3. The method of claim 1, wherein coating comprises plating the copper material. 4. The method of claim 1, wherein coating comprises depositing a copper paste comprising copper particles and sintering the copper particles in the paste. 5. The method of claim 1, wherein sintering the ceramic material comprises sintering in a reducing atmosphere. 6. The method of claim 1, wherein the second conductive material comprises a nickel paste material. 7. The method of claim 1, wherein the ceramic material has a thickness on the order of less than one micron. 8. The method of claim 1, further comprising plating nickel material to form the nickel foil material. 9. The method of claim 8, further comprising singulating the ceramic material, first conductive material, and second conductive material. 10. The method of claim 1, further comprising rolling nickel material to form the nickel foil material. 11. The method of claim 10, further comprising singulating the ceramic material, first conductive material, and second conductive material. 12. A method comprising: forming a ceramic material directly on a sheet of a first conductive material comprising a nickel foil material; forming a second conductive material on the ceramic material so that the ceramic material is disposed between the first conductive material and the second conductive material, wherein the first conductive material, the ceramic material, and the second conductive material comprise a composite structure; thermal processing at a temperature and a duration of time sufficient to sinter the ceramic material; coating an exposed surface of at least one of the first conductive material and the second conductive material with a different conductive material; and coupling the composite structure to an organic substrate. 13. The method of claim 12, wherein the different conductive material comprises copper and coating comprises plating the copper material. 14. The method of claim 12, wherein the composite structure is a first composite structure coupled to a first surface of the organic substrate and the method comprises coupling a second composite capacitor structure to an opposite second surface of the organic substrate. 15. The method of claim 12, wherein the second conductive material comprises a nickel paste material. 16. The method of claim 12, wherein the ceramic material has a thickness on the order of less than one micron. 17. A method comprising: forming a ceramic material directly on a sheet of a first conductive material comprising a nickel foil material; forming a second conductive material on the ceramic material; and sintering the ceramic material, wherein the first conductive material, the ceramic material, and the second conductive material comprise a composite structure and the method comprises coupling the composite structure to an organic substrate. 18. The method of claim 17, wherein the composite structure is a first composite structure coupled to a first surface of the organic substrate and the method comprises coupling a second composite capacitor structure to an opposite second surface of the organic substrate.

이 특허에 인용된 특허 (21) 인용/피인용 타임라인 분석

Wen-Hsi Lee TW; Detlev Hennings DE; Herbert Schreinemacher DE, Capacitor comprising a BCZT dielectric.
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Palanduz, Cengiz A.; Prokofiev, Victor, Capacitor device and method.
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Howard James R. (Sacramento CA) Lucas Gregory L. (Newark CA), Capacitor laminate for use in capacitive printed circuit boards and methods of manufacture.
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Sakaguchi, Hideaki; Higashi, Mitsutoshi; Mochizuki, Takashi, Capacitor, circuit board with built-in capacitor and method of manufacturing the same.
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Ozawa Jyuichiro (Kyoto JPX) Wakino Kikuo (Kyoto JPX), Capacitor-containing wiring board and method of manufacturing the same.
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Nagashima Mitsuru,JPX ; Yoshida Kazuhiro,JPX ; Kishi Masanobu,JPX ; Murata Makoto,JPX, Ceramic capacitor.
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Stetson Harold W. (Newtown PA) Cabato Nellie L. (Plymouth Meeting PA), Ceramic glass material, capacitor made therefrom and method of making the same.
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Borland,William J., Co-fired ceramic capacitor and method for forming ceramic capacitors for use in printed wiring boards.
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Sato Shigeki,JPX ; Nomura Takeshi,JPX ; Sato Akira,JPX, Dielectric ceramic composition and electronic device.
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Chakravorty, Kishore K.; Wermer, Paul H.; Figueroa, David G.; Gupta, Debabrata, Electronic assembly comprising ceramic/organic hybrid substrate with embedded capacitors and methods of manufacture.
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Andrew T. Hunt ; Wen-Yi Lin ; Tzyy Jiuan Hwang ; Michelle Hendrick ; Helmut G. Hornis, Formation of thin film capacitors.
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Lucas Gregory L., In situ method of forming a bypass capacitor element internally within a capacitive PCB.
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Kishore K. Chakravorty ; Michael Walk, Interposer substrate with low inductance capacitive paths.
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Bowles, Philip Harbaugh; Mobley, Washington Morris; Parker, Richard Dixon; Ellis, Marion Edmond, Method of forming integral passive electrical components on organic circuit board substrates.
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Adae-Amoakoh, Sylvia; Lauffer, John M.; Lowell, Michael D.; Markovich, Voya R.; Sniezek, Joseph J., Method of making a parallel capacitor laminate.
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Singhdeo Narendra N. (New Haven CT) Pryor Michael J. (Woodbridge CT) Leedecke Charles J. (Northford CT) Masse Norman G. (Wallingford CT), Method of manufacturing glass capacitors and resulting product.
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Kingon, Angus; Dunn, Gregory J.; Streiffer, Stephen; Cheek, Kevin; Zhang, Min-Xian; Maria, Jon-Paul; Savic, Jovica, Multi-layer conductor-dielectric oxide structure.
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Hansen Peter,DEX ; Hennings Detlev,DEX ; Schreinemacher Baby S.,DEX, Multilayer capacitor comprising tungsten-containing BaTiO.sub.3.
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O'Bryan, Nelson B.; Kieschke, Robert R.; Peiffer, Joel S., Passive electrical article, circuit articles thereof, and circuit articles comprising a passive electrical article.
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Larson William (Colorado Springs CO) Davenport Thomas (Colorado Springs CO) DeSmith Constance (Colorado Springs CO), Series ferroelectric capacitor structure for monolithic integrated circuits and method.
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Anderson Wayne A. ; Chang Lin Huang,TWX, Thin film capacitor.
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이 특허를 인용한 특허 (7) 인용/피인용 타임라인 분석

Sturzebecher, Richard J., Capacitor forming method.
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Min, Yongki; Suh, Daewoong, Carbon nanotube coated capacitor electrodes.
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Borland, William; Palanduz, Cengiz Ahmet; Renovales, Olga L., Method of making thin-film capacitors on metal foil using thick top electrodes.
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Borland, William; Drozdyk, Lorri, Methods of making high capacitance density ceramic capacitors.
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Borland, William; Burn, Ian; Ihlefeld, Jon Fredrick; Maria, Jon Paul; Suh, Seigi, Methods of making thin film capacitors comprising a manganese doped barium titantate dielectric.
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Min, Yongki, Pre-patterned thin film capacitor and method for embedding same in a package substrate.
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Krishna, Kalaga Murali; Reddy, Sudhakar Eddula; Matani, Lohit, Resonator structures and method of making.
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IPC	Description
A	생활필수품
A62	인명구조; 소방(사다리 E06C)
A62B	인명구조용의 기구, 장치 또는 방법(특히 의료용에 사용되는 밸브 A61M 39/00; 특히 물에서 쓰이는 인명구조 장치 또는 방법 B63C 9/00; 잠수장비 B63C 11/00; 특히 항공기에 쓰는 것, 예. 낙하산, 투출좌석 B64D; 특히 광산에서 쓰이는 구조장치 E21F 11/00)
A62B-1/08	.. 윈치 또는 풀리에 제동기구가 있는 것

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[미국특허] Method for making a passive device structure 원문보기

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[미국특허] Method for making a passive device structure 원문보기

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