초록 ▼

An inspection apparatus and a semiconductor device manufacturing method using the same. The inspection apparatus is used for defect inspection, line width measurement, surface potential measurement or the like of a sample such as a wafer. In the inspection apparatus, a plurality of charged particles

An inspection apparatus and a semiconductor device manufacturing method using the same. The inspection apparatus is used for defect inspection, line width measurement, surface potential measurement or the like of a sample such as a wafer. In the inspection apparatus, a plurality of charged particles is delivered from a primary optical system to the sample, and secondary charged particles emitted from the sample are separated from the primary optical system and introduced through a secondary optical system to a detector. Irradiation of the charged particles is conducted while moving the sample. Irradiation spots of the charged particles are arranged by N rows along a moving direction of the sample and by M columns along a direction perpendicular thereto. Every row of the irradiation spots of the charged particles is shifted successively by a predetermined amount in a direction perpendicular to the moving direction of the sample.

대표청구항 ▼

The invention claimed is: 1. An inspection method for inspecting a sample for defects, wherein a primary electron beam is irradiated on a sample and secondary electrons emanated from the sample is guided by a secondary optical system and detected, said method comprising the steps of: obtaining an a

The invention claimed is: 1. An inspection method for inspecting a sample for defects, wherein a primary electron beam is irradiated on a sample and secondary electrons emanated from the sample is guided by a secondary optical system and detected, said method comprising the steps of: obtaining an apparent angle (α0) at the sample surface viewed from an objective lens from a half-angular aperture (αi) at an image field and magnification (M) for the secondary electrons, obtaining an acceptance angle (α1) at the sample surface from said apparent angle (α0), initial energy of the secondary electrons, and beam potential at the objective lens, obtaining an collecting efficiency (η) of the secondary electron from the acceptance angle (α1), and determining a distance between irradiating locations of the primary electron beams based on said collecting efficiency (η). 2. An inspection method according to claim 1, further comprising the steps of: irradiating a plurality of primary electron beams on the sample; and guiding said secondary electrons into a plurality of detectors; wherein said respective primary electron beams are irradiated on respective positions such that a distance between any locations may be apart more than that for the resolution of the secondary optical system. 3. An inspection method for inspecting a sample for defects, wherein a primary electron beam is irradiated on a sample and secondary electrons emanated from the sample is detected, said method comprising the steps of: calculating an acceptance angle α1 based on following first and second equations; description="In-line Formulae" end="lead"α1/α0=1/M (Eq. 1)description="In-line Formulae" end="tail" where α1 is a half-angular aperture at an image field for the secondary electrons, M is magnification for the secondary electrons, and α0 is an apparent angle at the sample surface viewed from an objective lens, description="In-line Formulae" end="lead"(α1/α0)2=v8/v ini (Eq. 2)description="In-line Formulae" end="tail" where α1 is an acceptance angle for the secondary electrons, V8 is beam potential at the objective lens, and Vini is initial energy of the secondary electrons; obtaining an collecting efficiency of the secondary electron from the acceptance angle α1, and determining a distance between irradiating locations of the primary electron beams based on said collecting efficiency (η). 4. An inspection method for inspecting a sample for defects, comprising the steps of: irradiating a plurality of primary electron beams on a sample; and guiding secondary electrons emanated from the sample to a plurality of detectors; wherein said respective primary electron beams are irradiated on respective positions such that a distance between any locations may be apart more than a half-angular aperture (αi) at an image field for the secondary electrons. 5. An inspection method according to claim 4, wherein said primary electron beams are scanned with intervals which are wider than the distance between irradiating locations. 6. An inspection method according to claim 5, wherein an electric field is applied for accelerating the secondary electrons, and the secondary electrons are emitted from the surface of the sample at an angle smaller than 45 degree from the sample surface.