IPC분류정보
| 국가/구분 |
United States(US) Patent
등록
|
| 국제특허분류(IPC7판) |
|
| 출원번호 |
US-0414548
(2006-05-01)
|
| 등록번호 |
US-7301780
(2007-11-27)
|
|
발명자
/ 주소 |
- AbuGhazaleh,Shadi A.
- Baxter,Robert C.
- Mahmood,Rehan
- Miller,Alan C.
- O'Connor,Michael R.
|
| 출원인 / 주소 |
|
| 인용정보 |
피인용 횟수 :
11 인용 특허 :
38 |
초록
▼
A compensating advanced feature patch panel that can include removable modular or fixed electronic components located directly on the patch panel which are separately or in combination capable of providing advanced features such as device detection and power insertion. The patch panel provides commu
A compensating advanced feature patch panel that can include removable modular or fixed electronic components located directly on the patch panel which are separately or in combination capable of providing advanced features such as device detection and power insertion. The patch panel provides communications between an insulation displacement connector (IDC) at a PD/User end, and any standard interface type using unshielded twisted pair cables, such as an RJ45 connector at a switch end at performance levels of at least category 3, 5, 6 e, 6 and/or higher (e.g. 6 e or 7) and equivalent performance levels by compensating for the active electronics used in providing advanced features. Compensation is achieved in part through the separation and isolation of active and communication circuit elements.
대표청구항
▼
What is claimed is: 1. A compensating advanced feature patch panel that can include removable modular or fixed electronic components, wherein the patch panel provides improved performance levels, said patch panel comprising: a multilayered patch panel printed circuit board comprising a plurality of
What is claimed is: 1. A compensating advanced feature patch panel that can include removable modular or fixed electronic components, wherein the patch panel provides improved performance levels, said patch panel comprising: a multilayered patch panel printed circuit board comprising a plurality of layers; a communication circuit disposed on at least a first layer of said plurality and electrically coupled between an insulation displacement connector (IDC) at a PD/User end and an RJ45 connector at a telecommunication equipment end; at least one of a removable modular or fixed electronic component electrically coupled with said communication circuit, said component comprised of at least one active circuit disposed on at least a second layer of said plurality to provide an advanced feature and a data manager to monitor, control and collect data; and a compensating separation mechanism comprised of at least a third layer of said plurality and disposed between said first and second layers to isolate said active circuit from said communication circuit and to substantially minimize at least one adverse effect resulting from said active circuit and thereby providing improved performance levels. 2. The compensating advanced feature patch panel that can include removable modular or fixed electronic components as claimed in claim 1, wherein said communication circuit includes at least one of a signal carrying trace or a telecommunication routing circuit. 3. The compensating advanced feature patch panel that can include removable modular or fixed electronic components as claimed in claim 1, wherein said advanced feature includes at least one of a device detection feature, logical operation feature and power insertion feature. 4. The compensating advanced feature patch panel that can include removable modular or fixed electronic components as claimed in claim 1, wherein said removable modular electronic component comprises at least one dual in-line memory module (DIMM). 5. The compensating advanced feature patch panel that can include removable modular or fixed electronic components as claimed in claim 1, wherein said active circuit includes at least one of an active circuit secondary routing layer, active circuit component, IDC component, plug-in module connector and primary routing for active circuitry. 6. The compensating advanced feature patch panel that can include removable modular or fixed electronic components as claimed in claim 1, wherein said third layer includes at least one of a core layer, prepreg layer, ground plane layer and voltage plane layer. 7. The compensating advanced feature patch panel that can include removable modular or fixed electronic components as claimed in claim 1, wherein said multilayered patch panel printed circuit board further comprises a 3U panel size having at least 48 ports. 8. The compensating advanced feature patch panel that can include removable modular or fixed electronic components as claimed in claim 1, wherein said multilayered patch panel printed circuit board further consists of a panel having at least 48 ports and at least one of a height dimension of 1U, 2U and 3U. 9. The compensating advanced feature patch panel that can include removable modular or fixed electronic components as claimed in claim 1, wherein said multilayered patch panel printed circuit board further comprises a cable management mechanism. 10. The compensating advanced feature patch panel that can include removable modular or fixed electronic components as claimed in claim 1, wherein said multilayered patch panel printed circuit board further comprises said active circuit and cable management mechanism arranged adjacent to and between said communication circuit upon a surface of said patch panel printed circuit board. 11. The compensating advanced feature patch panel that can include removable modular or fixed electronic components as claimed in claim 3, wherein said data manager monitors, controls and collects data from at least one of a remote device network, the device detection feature, and the power insertion feature. 12. The compensating advanced feature patch panel that can include removable modular or fixed electronic components as claimed in claim 4, further comprising a removable cover for covering said at least one DIMM. 13. The compensating advanced feature patch panel that can include removable modular or fixed electronic components as claimed in claim 4, wherein said multilayered patch panel printed circuit board further comprises a user accessible first side from which said at least one DIMM and said RJ45 connector are extended. 14. The compensating advanced feature patch panel that can include removable modular or fixed electronic components as claimed in claim 11, wherein said collected data can be periodically provided to a network server for system management purposes. 15. A method of making an advanced feature patch panel that can include removable modular or fixed electronic components which are separately or in combination capable of providing advanced features such as device detection and power insertion, wherein the patch panel provides improved performance levels, said method comprising the steps of: assembling a multilayered patch panel printed circuit board having a plurality of layers; disposing upon at least a first layer of said plurality a communication circuit, said communication circuit electrically coupled between an insulation displacement connector (IDC) at a PD/User end and an RJ45 connector at a telecommunication equipment end; disposing upon at least a second layer of said plurality at least one of a removable modular and fixed electronic component electrically coupled with said communication circuit, said component comprised of at least one active circuit for use in providing an advanced feature and a data manager to monitor, control and collect data; and isolating said first layer from said second layer via a compensating separation mechanism comprised of at least a third layer of said plurality disposed between said first and second layer to isolate said active circuit from said communication circuit and substantially minimize at least one adverse effect resulting from said active circuit and thereby providing improved performance levels. 16. The method of making an advanced feature patch panel as claimed in claim 15, further comprising the step of disposing upon said first layer of said plurality a communication circuit including at least one of a signal carrying trace or a communication routing circuit. 17. The method of making an advanced feature patch panel as claimed in claim 15, further comprising the step of disposing upon said second layer of said plurality at least one of a removable modular or fixed electronic component including at least one of an active circuit secondary routing layer, active circuit component, IDC component, plug-in module connector and primary routing for active circuitry. 18. The method of making an advanced feature patch panel as claimed in claim 15, wherein said data manager monitors, controls and collects data from at least one of a remote device network, the device detection feature, and the power insertion feature. 19. The method of making an advanced feature patch panel as claimed in claim 18, further comprising the step of periodically providing said collected data to a network server for system management purposes.
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