초록 ▼

According to one embodiment, an electronic apparatus includes: a casing having a bottom portion; a circuit board housed in the casing, the circuit board having first and second areas; a heating element mounted on the first area of the circuit board; an elastically-deformable partition member interpo

According to one embodiment, an electronic apparatus includes: a casing having a bottom portion; a circuit board housed in the casing, the circuit board having first and second areas; a heating element mounted on the first area of the circuit board; an elastically-deformable partition member interposed between the circuit board and the bottom portion and surrounding the first area; and a fan having an air take-in port through which air in the first area is taken in.

대표청구항 ▼

What is claimed is: 1. An electronic apparatus comprising: a casing having a bottom portion in which an air inlet port is formed; a circuit board housed in the casing; a heating element which is mounted on the circuit board and faces to the air inlet port; a fan which is housed in the casing, takes

What is claimed is: 1. An electronic apparatus comprising: a casing having a bottom portion in which an air inlet port is formed; a circuit board housed in the casing; a heating element which is mounted on the circuit board and faces to the air inlet port; a fan which is housed in the casing, takes in internal air of the casing, and blows the air to outside of the casing; and an elastically-deformable partition member interposed between the circuit board and the bottom portion, the partition member surrounding the heating element and defining an air guide passage in the casing in cooperation with the circuit board and the bottom portion, the air guide passage extending from the heating element to the fan. 2. The electronic apparatus according to claim 1, wherein the partition member is sponge, and is affixed to the circuit board by a double-sided adhesive tape. 3. The electronic apparatus according to claim 2, wherein the partition member is compressed between the circuit board and the bottom portion in a thicknesswise direction of the casing. 4. The electronic apparatus according to claim 1, wherein the air inlet port is situated at an upstream end of the air guide passage, and the fan is situated at a downstream end of the air guide passage. 5. The electronic apparatus according to claim 4, further comprising a thermal diffusion plate thermally connected to the heating element; wherein the air taken into the air guide passage from the air inlet port during operation of the fan is blown to the thermal diffusion plate. 6. The electronic apparatus according to claim 5, further comprising a mounting bracket by which the thermal diffusion plate is supported on the circuit board, the mounting bracket having a spring property for pressing the thermal diffusion plate toward the heating element. 7. The electronic apparatus according to claim 1, wherein the partition member has first and second end portions connected to a fan case of the fan, respectively. 8. An electronic apparatus comprising: a casing having a bottom portion; a circuit board housed in the casing; a heating element mounted on the circuit board; an elastically-deformable partition member interposed between the circuit board and the bottom portion and defining an area in the casing in cooperation with the circuit board and the bottom portion, the area containing the heating element; and a fan having an air take-in port positioned within the area and an air outlet port positioned outside the area. 9. The electronic apparatus according to claim 8, wherein the partition member is sponge, and is affixed to the circuit board by a double-sided adhesive tape. 10. The electronic apparatus according to claim 9, wherein the partition member is compressed between the circuit board and the bottom portion in a thicknesswise direction of the casing. 11. The electronic apparatus according to claim 8, further comprising a thermal diffusion plate thermally connected to the heating element; and a mounting bracket by which the thermal diffusion plate is supported on the circuit board, the mounting bracket having a spring property for pressing the thermal diffusion plate toward the heating element. 12. The electronic apparatus according to claim 8, wherein the partition member has first and second end portions connected to a fan case of the fan, respectively. 13. An electronic apparatus comprising: a casing having a bottom portion; a circuit board housed in the casing, the circuit board having first and second areas; a heating element mounted on the first area of the circuit board; an elastically-deformable partition member interposed between the circuit board and the bottom portion and surrounding the first area; and a fan having an air take-in port through which air in the first area is taken in. 14. The electronic apparatus according to claim 13, wherein the partition member is sponge, and is affixed to the circuit board by a double-sided adhesive tape. 15. The electronic apparatus according to claim 14, wherein the partition member is compressed between the circuit board and the bottom portion in a thicknesswise direction of the casing. 16. The electronic apparatus according to claim 13, further comprising a thermal diffusion plate thermally connected to the heating element; and a mounting bracket by which the thermal diffusion plate is supported on the circuit board, the mounting bracket having a spring property for pressing the thermal diffusion plate toward the heating element. 17. The electronic apparatus according to claim 13, wherein the partition member has first and second end portions connected to a fan case of the fan, respectively.