초록 ▼

A package that resists creation of particles in a package cavity. A package according to one embodiment of the present invention contains a mechanical device attached to the floor of the package substrate. Epoxy typically is used to attach the device. Electrical connections are provided by bond wire

A package that resists creation of particles in a package cavity. A package according to one embodiment of the present invention contains a mechanical device attached to the floor of the package substrate. Epoxy typically is used to attach the device. Electrical connections are provided by bond wires connecting bond pads on the substrate with bond pads on the device. A window is attached to the substrate to form a cavity around the device. A thin masking layer on portions of the package cavity surface prevents the surface from generating particles. The thin masking layer may be any material that resists particle generation. The masking layer on the cavity walls optionally extends out of the cavity and onto the upper surface of the package.

대표청구항 ▼

What is claimed is: 1. A method of forming a package substrate comprising: forming a substrate, said substrate having a cavity; forming bond pads on a surface of said cavity; and coating portions of said cavity surface with a masking layer. 2. The method of claim 1, said forming a substrate comp

What is claimed is: 1. A method of forming a package substrate comprising: forming a substrate, said substrate having a cavity; forming bond pads on a surface of said cavity; and coating portions of said cavity surface with a masking layer. 2. The method of claim 1, said forming a substrate comprising forming a ceramic substrate. 3. The method of claim 1, said coating comprising coating portions of said cavity surface selected from a group consisting of a wall of said cavity and a floor of said cavity with said masking layer. 4. The method of claim 1, said coating comprising coating portions of said cavity surface with a masking layer selected from a group consisting of metal, gold, and epoxy. 5. The method of claim 1, said coating comprising coating portions of said cavity surface using a process selected from a group consisting of sputtering plating, spraying, and brushing. 6. The method of claim 1, said coating comprising coating portions of said cavity surface with a masking layer extending onto an upper surface of said substrate. 7. The method of claim 1, comprising removing portions of said masking layer by a process selected from the group consisting of chemical etching and laser etching. 8. A method of forming a package substrate comprising: forming a substrate, said substrate having a cavity; and coating portions of said cavity surface with a metal masking layer by a process selected from the group consisting of sputtering and plating. 9. The method of claim 8, said forming a substrate comprising forming a ceramic substrate. 10. The method of claim 8, said coating portions comprising coating portions of said cavity with a gold metal masking layer. 11. The method of claim 8, said coating portions comprising coating portions of said cavity selected from the group consisting of walls and a floor of said cavity. 12. The method of claim 8, said coating portions comprising coating portions of said cavity and an upper surface of said substrate with said metal masking layer. 13. The method of claim 8, comprising removing portions of said metal masking layer by a process selected from the group consisting of chemical etching and laser etching. 14. A method of forming a package substrate comprising: forming a substrate, said substrate having a cavity; and coating portions of said cavity surface with an epoxy masking layer. 15. The method of claim 14, said forming a substrate comprising forming a ceramic substrate. 16. The method of claim 14, said coating portions comprising coating portions of said cavity selected from the group consisting of walls and a floor of said cavity. 17. The method of claim 14, said coating portions comprising coating portions of said cavity and an upper surface of said substrate with said epoxy masking layer. 18. The method of claim 14, said coating portions comprising coating portions using an application process selected from the group consisting of brushing and spraying. 19. The method of claim 14, comprising removing portions of said epoxy masking layer by a process selected from the group consisting of chemical etching and laser etching.