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A method and apparatus for inhibiting the flow of a flowable adhesive material disposed adjacent to a substrate. A chip component is disposed adjacent to a substrate and a plurality of nanoparticles are disposed and cured adjacent to the substrate and proximate to the chip component. The nanoparticl

A method and apparatus for inhibiting the flow of a flowable adhesive material disposed adjacent to a substrate. A chip component is disposed adjacent to a substrate and a plurality of nanoparticles are disposed and cured adjacent to the substrate and proximate to the chip component. The nanoparticles possess surface properties that make them substantially immiscible with a flowable adhesive. The band of nanoparticles will inhibit the flow of a flowable adhesive material disposed between the chip and the nanoparticles, in a direction bounded by the plurality of nanoparticles, while adhesive flow in the direction of the component is promoted.

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We claim: 1. An apparatus, comprising: a substrate; a component disposed adjacent to the substrate; a plurality of nanoparticles disposed adjacent to the substrate and proximate to at least a first side of the component; the nanoparticles each having an outer surface, the outer surface having a cha

We claim: 1. An apparatus, comprising: a substrate; a component disposed adjacent to the substrate; a plurality of nanoparticles disposed adjacent to the substrate and proximate to at least a first side of the component; the nanoparticles each having an outer surface, the outer surface having a characteristic of being substantially immiscible with a flowable adhesive material. 2. The apparatus of claim 1, wherein the nanoparticles comprise at least one of silicone and fluorocarbon. 3. The apparatus of claim 1, wherein the nanoparticles comprise ceramic nanoparticles, the outer surface of the nanoparticles including at least one of silicone branch tails or fluorocarbon branch tails. 4. The apparatus of claim 1, wherein the plurality of nanoparticles is disposed in a plurality of layers. 5. The apparatus of claim 1, wherein the component comprises at least one of a flip chip component or a controlled collapse chip connect (C4) component. 6. The apparatus of claim 1, wherein the plurality of nanoparticles further comprises nanopores. 7. The apparatus of claim 1, wherein the nanoparticles are smaller than filler particles in the flowable adhesive material. 8. The apparatus of claim 1, wherein the plurality of nanoparticles inhibit the flow of the flowable adhesive material in a direction bounded by the nanoparticles. 9. An assembly, comprising: a substrate; a chip component disposed adjacent to the substrate; a plurality of nanoparticles disposed adjacent to the substrate and proximate to at least a first side of the chip component, the nanoparticles each having an outer surface, the outer surface of the nanoparticles having a characteristic of being substantially immiscible with a flowable adhesive material; another component disposed adjacent to the substrate proximate to a side of the nanoparticles opposite the chip component, the nanoparticles forming a boundary between the chip component and the other component; and a flowable adhesive disposed adjacent to the substrate and between the chip component and the nanoparticles. 10. The assembly of claim 9, wherein the plurality of nanoparticles are disposed as a plurality of layers. 11. The assembly of claim 9, wherein the plurality of nanoparticles comprise a boundary feature capable of substantially inhibiting the flow of the flowable adhesive material in at least a direction bounded by the plurality of nanoparticles. 12. The assembly of claim 9, wherein the substrate, the chip component, the other component and the plurality of nanoparticles comprise a portion of an electrical device. 13. The assembly of claim 9, wherein the nanoparticles comprise a material immiscible with the flowable adhesive. 14. The assembly of claim 9, wherein the substrate is selected from a group consisting of a printed circuit board, a package substrate, a card, a motherboard, and a flex substrate. 15. The assembly of claim 9, wherein the chip component is selected from a group consisting of a flip chip component, an unpackaged chip component, a packaged chip component, a processing device, a memory device, an input/output device, a graphics device, and audio device, a chipset device, a controller device, an optoelectronic device, and a network communications device. 16. The assembly of claim 12, wherein the electrical device is selected from a group consisting of a computing device, a communication device, an entertainment device, an analytical/monitoring device, a vehicle operation/safety device, a network device, and an industrial/manufacturing device. 17. The assembly of claim 12, wherein the chip component is at least one of a flip chip component or a controlled collapse chip connect (C4) component.