$\require{mediawiki-texvc}$

연합인증

연합인증 가입 기관의 연구자들은 소속기관의 인증정보(ID와 암호)를 이용해 다른 대학, 연구기관, 서비스 공급자의 다양한 온라인 자원과 연구 데이터를 이용할 수 있습니다.

이는 여행자가 자국에서 발행 받은 여권으로 세계 각국을 자유롭게 여행할 수 있는 것과 같습니다.

연합인증으로 이용이 가능한 서비스는 NTIS, DataON, Edison, Kafe, Webinar 등이 있습니다.

한번의 인증절차만으로 연합인증 가입 서비스에 추가 로그인 없이 이용이 가능합니다.

다만, 연합인증을 위해서는 최초 1회만 인증 절차가 필요합니다. (회원이 아닐 경우 회원 가입이 필요합니다.)

연합인증 절차는 다음과 같습니다.

최초이용시에는
ScienceON에 로그인 → 연합인증 서비스 접속 → 로그인 (본인 확인 또는 회원가입) → 서비스 이용

그 이후에는
ScienceON 로그인 → 연합인증 서비스 접속 → 서비스 이용

연합인증을 활용하시면 KISTI가 제공하는 다양한 서비스를 편리하게 이용하실 수 있습니다.

Cooling apparatus for portable computer 원문보기

IPC분류정보
국가/구분 United States(US) Patent 등록
국제특허분류(IPC7판)
  • F28D-015/00
  • H05K-007/20
출원번호 US-0965794 (2004-10-18)
등록번호 US-7325590 (2008-02-05)
우선권정보 KR-10-2003-0080761(2003-11-14); KR-10-2003-0085656(2003-11-28)
발명자 / 주소
  • Kim,Ye Yong
  • Ko,Ki Tak
출원인 / 주소
  • LG Electronics Inc.
대리인 / 주소
    Birch, Stewart, Kolasch & Birch, LLP
인용정보 피인용 횟수 : 31  인용 특허 : 9

초록

A cooling structure for a portable computer includes a cooling fan creating an air stream to release heat generated in a main body of the computer to the outside through at least one vent. First and second heat pipes transfer heat generated in first and second heat sources on a main board of the com

대표청구항

What is claimed is: 1. A cooling apparatus for a computer, comprising: a cooling fan unit for creating at least one air stream to remove heat generated inside a main body of a computer to the outside through at least one vent, said cooling fan unit including a cooling fan; a first heat pipe for tra

이 특허에 인용된 특허 (9)

  1. William W. Y. Chu ; Tony Man ; Peng Cheng Lin, Computer module device and method.
  2. Mochizuki Masataka,JPX ; Mashiko Koichi,JPX ; Goto Kazuhiko,JPX ; Saito Yuji,JPX ; Eguchi Katsuo,JPX ; Nagaki Yoshihiro,JPX ; Takamiya Akihiro,JPX ; Nguyen Thang Toan,JPX, Cooler for electronic devices.
  3. Masahiro Suzuki JP, Cooling device of electronic part having high and low heat generating elements.
  4. Hiroshi Nakamura JP; Chihei Kitahara JP; Kentaro Tomioka JP; Katsuhiko Yamamoto JP, Cooling unit for cooling a heat-generating component in an electronic apparatus.
  5. Pei Hsien-Shen,TWX ; Sun Chung-Yung,TWX ; Lee Chao-Yang,TWX, Heat sink system.
  6. Michael, Mihalis, High-performance heat sink for printed circuit boards.
  7. Nelson Daryl (Beaverton OR), Multiple-fan microprocessor cooling through a finned heat pipe.
  8. Amaike, Takeshi; Heo, Seon Meyong; Watanabe, Makoto; Yasaku, Takayuki; Izumi, Shinya; Shikamura, Naoya, Server unit comprising stacked multiple server unit cabinets accommodating multiple cartridge type server units.
  9. Phillips, Alfred L.; Khrustalev, Dmitry K.; Wert, Kevin L.; Wilson, Michael J.; Wattelet, Jonathan P.; Broadbent, John, Thermal bus for electronics systems.

이 특허를 인용한 특허 (31)

  1. Kamimura, Takuroh; Chonan, Tsutomu; Adachi, Takateru; Tatsuno, Kazuya; Akiyama, Shogo, Cooling for electronic equipment.
  2. Bhutani, Gurmeet; Wang, Cheng-Kuo; Chien, Hung-Pin; Liu, Li-Chung; Wu, Tien Hsiang, Dual operation centrifugal fan apparatus and methods of using same.
  3. Fujiwara, Nobuto, Electronic apparatus.
  4. Fujiwara, Nobuto, Electronic apparatus.
  5. Fujiwara,Nobuto, Electronic apparatus.
  6. Takeguchi, Koichiro; Kawawa, Tatsuya, Electronic apparatus.
  7. Watanabe, Hideki; Hayashi, Shigeo, Electronic apparatus.
  8. Fujiwara, Nobuto, Electronic apparatus and cooling fan.
  9. Fujiwara, Nobuto, Electronic apparatus and cooling fan.
  10. Huang, Lung-Chi; Yang, Chih-Hao, Electronic apparatus with heat dissipation module.
  11. Fujiwara, Nobuto, Electronic device.
  12. Hata, Yukihiko; Tomioka, Kentaro; Arakawa, Tatsuya; Wada, Kohei, Electronic device.
  13. Ito, Naoyuki; Shiraga, Kazuhiro; Goto, Shinji, Electronic device.
  14. Chikazawa, Nagahisa; Adachi, Katsumi, Electronic device and cooling unit.
  15. Wu, Hung-Yi; Ye, Zhen-Xing; Sun, Ke; Chen, Ming-Ke; Chen, Xiao-Zhu, Heat dissipation assembly.
  16. Yang, Jian; Zhang, Jing, Heat dissipation device and centrifugal fan thereof.
  17. Liu, Jin Biao; Yang, Hong Cheng; Chen, Chun Chi, Heat dissipation device with heat pipe.
  18. Liu, Cheng Shing; Chen, Ming Chih, Heat-dissipating module connecting to a plurality of heat-generating components and related device thereof.
  19. Nakamura, Fusanobu, Housing temperature suppressing structure in electronic device and portable computer.
  20. Hrehor, Jr., Robert D.; North, Travis Christian, Multi-component shared cooling system.
  21. Edwards, Jesse W.; June, M. Sean; Therrien, Robert Joseph; Yadav, Abhishek, Parallel thermoelectric heat exchange systems.
  22. Edwards, Jesse W.; Therrien, Robert Joseph; June, M. Sean, Physically separated hot side and cold side heat sinks in a thermoelectric refrigeration system.
  23. Wu, Kang, Server and heat dissipation method.
  24. Chamseddine, Ahmad; Wolfe, Mark, System, apparatus and method for cooling electronic components.
  25. Chamseddine, Amhad; Wolfe, Mark, System, apparatus and method for cooling electronic components.
  26. Stanley, Marshall; Barus, Daniel, Systems and methods for operating a thermoelectric module to increase efficiency.
  27. Edwards, Jesse W.; June, M. Sean; Therrien, Robert Joseph; Yadav, Abhishek, Systems and methods to mitigate heat leak back in a thermoelectric refrigeration system.
  28. Edwards, Jesse W.; June, M. Sean; Therrien, Robert Joseph; Yadav, Abhishek, Thermoelectric heat exchange system comprising cascaded cold side heat sinks.
  29. June, M. Sean; Therrien, Robert Joseph; Yadav, Abhishek; Edwards, Jesse W., Thermoelectric heat exchanger component including protective heat spreading lid and optimal thermal interface resistance.
  30. Edwards, Jesse W.; Therrien, Robert Joseph; June, M. Sean, Thermoelectric refrigeration system control scheme for high efficiency performance.
  31. Edwards, Jesse W.; June, M. Sean; Therrien, Robert Joseph; Yadav, Abhishek, Two-phase heat exchanger mounting.
섹션별 컨텐츠 바로가기

AI-Helper ※ AI-Helper는 오픈소스 모델을 사용합니다.

AI-Helper 아이콘
AI-Helper
안녕하세요, AI-Helper입니다. 좌측 "선택된 텍스트"에서 텍스트를 선택하여 요약, 번역, 용어설명을 실행하세요.
※ AI-Helper는 부적절한 답변을 할 수 있습니다.

선택된 텍스트

맨위로