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Aircraft heat sink and electronics enclosure 원문보기

IPC분류정보
국가/구분 United States(US) Patent 등록
국제특허분류(IPC7판)
  • B64C-001/14
  • B64C-001/00
출원번호 US-0656695 (2003-09-04)
등록번호 US-7325772 (2008-02-05)
발명자 / 주소
  • Hanewinkel, III,William H
  • Williams,Mark G
출원인 / 주소
  • L 3 Communications Corporation
대리인 / 주소
    Harrington & Smith, PC
인용정보 피인용 횟수 : 18  인용 특허 : 28

초록

An aircraft component including a first section adapted to be attached at an exterior surface of an aircraft to close an access opening through the exterior surface; and a second section extending outward from the first section and forming heat transfer surfaces to transfer heat from the first secti

대표청구항

What is claimed is: 1. An aircraft component comprising: a first section adapted to be attached at an exterior surface of an aircraft to close an access opening through the exterior surface; a second section extending outward from the first section and forming at least one heat transfer surface to

이 특허에 인용된 특허 (28)

  1. Merensky Harald (Hamburg DEX), Airplane.
  2. Gourdine Meredith C. (Houston TX), Apparatus and method for cooling heat generating electronic components in a cabinet.
  3. Scaringe Robert Peter, Compact avionics-pod-cooling unit thermal control method and apparatus.
  4. Haushalter Frederick W. (Kenton OH), Compressed fin heat sink.
  5. Martin Jacob H. (Wellesley MA), Conforming heat sink assembly.
  6. Lee Lawrence Y. (Santa Ana CA), Electronic cooling chassis.
  7. Glenn E. Wheelock ; Josef Berger ; Russell K. Layton, Jr., Enclosure for microwave radio transceiver with integral refractive antenna.
  8. Gregory T. Wyler ; Peter B. Favini ; Blaine C. Wotring ; Bibek Chapagain, Folded fin heat sink and fan attachment.
  9. Michel Engelhardt, Heat pipe cooling of aircraft skins for infrared radiation matching.
  10. He, Li; Lee, Tsung-Lung; Lai, Cheng-Tien, Heat sink clip assembly.
  11. Beane Glenn L., Heat-sinking structures and electrical sockets for use therewith.
  12. Garza Jose Arturo ; Kent Dales Morrison ; Ramirez Ciro Neal ; Sinha Rajeev Ranjan, Heatsink retention and air duct assembly.
  13. Herman W. Chu ; Rakesh Bhatia, High performance notebook PC cooling system.
  14. James M. Nagashima ; Terence G. Ward ; Scott D. Downer, Integrated power electronics cooling housing.
  15. Clark, William; Heckaman, Douglas; Bajgrowicz, Edward, Interconnect structure for interconnecting electronic modules.
  16. Arnold, Alanson J., Marine keel cooler.
  17. Altoz Frank E. (Catonsville MD) Winn William H. (Linthicum MD), Mechanical heat transfer device.
  18. Aniekan Udobot ; Ron Brager ; Larry Reed, Method and apparatus for improved aircraft environmental control system utilizing parallel heat exchanger arrays.
  19. Houf Robert E. (Glendale WI) Frey ; Jr. Sydney W. (Brookfield WI) Marasch Richard D. (Germantown WI) Wroblewski Edwin J. (Cudahy WI), Modular electric load controller.
  20. Fluegel Kyle G. (Greenville TX), Modular liquid skin heat exchanger.
  21. Fluegel Kyle G. (Greenville TX), Modular liquid skin heat exchanger.
  22. Davis David R. ; Erickson Vernon ; Schindler John, Multi-electronic module mounting and retention mechanism.
  23. Howard Robert W. (Anaheim CA), Skin heat exchanger.
  24. Lambiaso, Guy A., Storage compartment with universal mounting capability.
  25. Niggemann Richard E. (Rockford IL), Structural cooling unit.
  26. Connolly Jerome J. (Arlington TX) Barrick Michael D. (Arlington TX) D\Agostino William L. (Irving TX) Thomas Gerald F. (Arlington TX) Williams Thomas W. (Grand Prairie TX), Structurally-embedded electronics assembly.
  27. Lutzer Wilhelm,DEX, System for removing incident heat from aircraft during flight.
  28. Altoz Frank E. (Baltimore MD), Temperature controlled airborne electronic assembly.

이 특허를 인용한 특허 (18)

  1. Vicich, Anthony L.; Fix, Martin G.; Rogers, Charles K.; Bopp, Jayson K., Aircraft canister design.
  2. Mayo, Richard Hammond, Apparatus comprising an antenna array.
  3. Steenwyk, Meredith Marie; Coxon, Danny Weldon; Streyle, John Jay; Vander Ploeg, Benjamin Jon, Avionics chassis.
  4. Streyle, John Jay; Vander Ploeg, Benjamin Jon; Steenwyk, Meredith Marie; Coxon, Danny Weldon, Avionics chassis.
  5. Vander Ploeg, Benjamin Jon; Steenwyk, Meredith Marie; Coxon, Danny Weldon; Horton, Paul James; Streyle, John Jay, Avionics chassis.
  6. Tomasi, Marc; De Kergommeaux, Matthieu; Bertandeau, Laurent; Banis, Christian, Electrical devices module for an avionics bay.
  7. Gross, Claus-Peter; Thomaschewski, Oliver Sascha, Installation system for an airplane.
  8. Cardell, Per-Erik; Johansson, Andreas, Mounting device for electronic components in UAV helicopters.
  9. Savoye, Guillaume; Morra, Flavien; Vuillet, Jean-Francois, Navigation electronic card support for a rotary wing drone.
  10. Mayo, Richard, Phased array antenna and a method of operating a phased array antenna.
  11. Mayo, Richard, Phased array antenna and a method of operating a phased array antenna.
  12. Mayo, Richard Hammond, Processing a noisy analogue signal.
  13. Mayo, Richard Hammond, Processing a noisy analogue signal.
  14. Blanding, David E.; Muley, Arun; Coffman, Jeffrey C.; Affelen, Doug Van, Structurally integrated thermal management system for aerospace vehicles.
  15. Belik, Pavel; Szarek, Thomas; Torres, Gabriel E.; Fraye, Vernon P., UAV having hermetically sealed modularized compartments and fluid drain ports.
  16. Collette, Daniel, UAV pod cooling using integrated duct wall heat transfer.
  17. Tighe, James Joseph; Long, Geoffrey Alan; Tzarnotzky, Uri, Ventilated rotor mounting boom for personal aircraft.
  18. Tighe, James Joseph; Long, Geoffrey Alan; Tzarnotzky, Uri, Ventilated rotor mounting boom for personal aircraft.
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