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Process for packaging plastic materials like hot melt adhesives 원문보기

IPC분류정보
국가/구분 United States(US) Patent 등록
국제특허분류(IPC7판)
  • B65B-063/08
  • B65B-063/00
  • B65B-009/12
  • B65B-009/10
출원번호 US-0976943 (2004-10-29)
등록번호 US-7328547 (2008-02-12)
발명자 / 주소
  • Mehta,Atul
  • Neperud,Michael A.
  • Sajot,Nicolas E.
  • Chiarabini,Dominique
  • Morel Fourrier,Chrisophe
출원인 / 주소
  • Bostik, Inc.
대리인 / 주소
    Andrus, Sceales, Starke & Sawall, LLP
인용정보 피인용 횟수 : 24  인용 특허 : 31

초록

A method for packaging plastic material using a film to surround the material, and more particularly to a method for packaging hot melt adhesives, the resulting package formed thereby, and the film composition used therein. The method is preferably a coextrusion process for packaging a pressure sens

대표청구항

We claim: 1. A method of packaging a plastic mass, comprising the steps of: providing a plastic mass, and surrounding the plastic mass with a polymeric film, said polymeric film comprising a composition having at least 25% by weight of a wax material, an enthalpy of fusion of at least about 100 J/g

이 특허에 인용된 특허 (31)

  1. Cameron Janelle C. ; Fischer Carolyn A. ; Lehman Nicholas C. ; Lindquist Jeffrey S. ; Olson Christopher E. ; Fox Steve A., Hot melt adhesive pellet comprising continuous coating of pelletizing aid.
  2. Bozich Frank (Clarendon Hills IL) King Charles J. (Stickney IL), Hot-melt pressure sensitive adhesive packaging, preform, and method.
  3. Ornsteen ; Robert L., Method for forming a hot melt adhesive cartridge.
  4. Cameron Janelle C. ; Fischer Carolyn A. ; Lehman Nicholas C. ; Lindquist Jeffrey S. ; Olson Christopher E. ; Fox Steve A., Method for making hot melt adhesive pellet comprising continuous coating of pelletizing aid.
  5. Hatfield Stephen (Somerville NJ) Puletti Paul (Pittstown NJ) Giese Robert (Wall NJ) Thorpe Roger (Skillman NJ), Method for packaging hot melt adhesives.
  6. Heuer Glenn C. ; Brand Norris R. ; Nelson Randall D. ; Weber Wolfgang,DEX, Method for packaging thermoplastic compositions comprising sufficiently cooling composition.
  7. Taylor Malcolm ; Bateson George ; Posner Brian ; Heuer Glenn, Method for packaging thermoplastic compositions using a thermally conductive rigid mold.
  8. Winter Jurgen,DEX ; Kleinhans Matthias,DEX ; Baumann Warnfried,DEX, Method for producing and coating melt portions as well as system and apparatus.
  9. Hull Mark (Marine On The St. Croix MN), Method for tackless packaging of hot melt adhesive.
  10. Hatfield Stephen (Somerville NJ) Gore Shelley (Neshanic Station NJ) Fame David (Newtown PA) Rindone Anthony (Flemington NJ), Method for tackless packaging of hot melt adhesives.
  11. Bozich Frank ; King Charles James, Method for the tack-free packaging of a hot-melt pressure sensitive adhesive.
  12. Peter Remmers DE; Joachim Baumung DE; Michelle M. Chanak ; Kevin W. McKay ; Thomas Wittkopf DE, Method of packaging a thermoplastic composition with a film having a low complex viscosity and corresponding packaged article.
  13. Rouyer Alain,FRX ; Pariente Emmanuelle,FRX ; Yeboa-Kodie Peter,DEX ; Werenicz Harald,DEX, Method of packaging an adhesive composition and corresponding packaged article.
  14. Waver Bruce A. ; Mechling David E. ; Hickman Barclay S. ; Bildusas Leon, Method of preparing a hot melt adhesive.
  15. Waver Bruce A. ; Mechling David E. ; Hickman Barclay S., Methods and apparatus for preparing a hot melt adhesive.
  16. Hamer Craig E. ; Moon John D. ; Kotnour Thomas A., Methods of making packaged viscoelastic compositions.
  17. Waver Bruce A. ; Mechling David E. ; Hickman Barclay S. ; Bildusas Leon, Packaged adhesive mass.
  18. Jain Surendra, Packaging of hot melt adhesives.
  19. Simmons Eugene R. ; Sweeney Kevin J. ; Lindquist Jeffrey S. ; Olson Christopher E. ; Carter Freddie C. ; Farmer James R., Polymeric composition in pellet form.
  20. Simmons Eugene R. ; Sweeney Kevin J. ; Lindquist Jeffrey S. ; Olson Christopher E. ; Carter Freddie C. ; Farmer James R., Polymeric composition in pellet form.
  21. McCoskey Steven L. (Longview TX) Hooker Stephen R. (Longview TX) Jarrell Don W. (Henderson TX) Somers Marc S. (Longview TX) Coe Stephen W. (Longview TX), Pourable particles of normally tacky plastic materials and process for their preparation.
  22. Rizzieri Giorgio,ITX, Process and packaging plant for packaging sticky substances in the fluid state.
  23. Cooper Barry A. (Wayzata MN), Process and polymer blend composition for stretch wrap film.
  24. Puletti Paul ; Hatfield Stephen, Process for coating hot melt adhesives.
  25. Fayolle Jean,FRX ; Grandin Daniel,FRX ; Niethen Heinrich,FRX ; Pierron Michel,FRX ; Prevot Jean-Louis,FRX, Process for continuous abherent treatment of a surface adherent holt-melt adhesive.
  26. Kik Michael,DEX ; Petry Gerald,DEX ; Huesemann Lutz,DEX ; Holze Joachim,DEX ; Biehle Alfred,DEX ; Toeritz Bernhard,DEX, Process for production of hotmelt adhesives.
  27. Waagen Geert N. (Baarn NLX) Bastiaansen Cornelis W. M. (Dongen NLX) Kirschbaum Robert (Sittard NLX), Process for the preparation of ultrastretchable polymer material, ultrastretchable material, as well as a process for th.
  28. Colombani Jean J. (Auffargis FRX), Process for the production of non-sticky thermofusible autoadhesive shapes.
  29. Berrier Bernard (Chateauneuf les Martigues FRX) Thiersault Jean P. (Ville D\Avray FRX), Stretchable cling film composition based on polyethylene.
  30. Winter Jurgen,DEX ; Kleinhans Matthias,DEX ; Baumann Warnfried,DEX, System for producing and coating melt portions.
  31. Wittmann Claude (Compiegne FRX) Lambert Jean-Patrick (Compiegne FRX), Thermofusible autoadhesive shapes and process for their production.

이 특허를 인용한 특허 (24)

  1. Zeng, Liang; Liu, Ya Qun; Chang, Wei; Zhang, Liqiang; Ding, Zhe; Wang, Wei Jun; Huang, Hong Min, Compressible thermal interface materials.
  2. Nair, Sujith; Stankovich, Sasha; Wang, Yunzhang; Raghavendran, Venkatkrishna, Consolidated fibrous structure.
  3. Nair, Sujith; Stankovich, Sasha; Wang, Yunzhang; Raghavendran, Venkatkrishna, Consolidated fibrous structure.
  4. Nair, Sujith; Stankovich, Sasha; Wang, Yunzhang; Raghavendran, Venkatkrishna, Consolidated fibrous structure.
  5. Dunn, Steven Bryan; Hatherill, Mark A.; Johnson, Kevin D.; Saxton, Matthew Joseph, Container for receiving multiple flexible bag assemblies.
  6. Dunn, Steven Bryan; Hatherill, Mark A.; Johnson, Kevin D.; Saxton, Matthew Joseph, Container for receiving multiple flexible bag assemblies.
  7. Dunn, Steven Bryan; Hatherill, Mark A.; Johnson, Kevin D.; Saxton, Matthew Joseph, Container for receiving multiple flexible bag assemblies.
  8. Dunn, Steven B.; Hatherill, Mark A.; Johnson, Kevin D., Diaper pail bag.
  9. Goubard, David, Hot-melt adhesive composition intended to form a film suitable for wrapping a hot-melt adhesive product, and its use.
  10. Dunn, Steven B.; Hatherill, Mark A.; Johnson, Kevin D., Method for disposing waste packages such as diapers.
  11. Nair, Sujith; Stankovich, Sasha; Wang, Yunzhang; Raghavendran, Venkatkrishna; Eleazer, Howell B., Method of forming a consolidated fibrous structure.
  12. Nair, Sujith; Stankovich, Sasha; Wang, Yunzhang; Raghavendran, Venkatkrishna, Method of forming a multi-layered fiber.
  13. Stravitz, David M., Method of inserting and storing waste for disposal.
  14. Nair, Sujith; Stankovich, Sasha; Wang, Yunzhang; Raghavendran, Venkatkrishna, Multi-layered fiber.
  15. Dunn, Steven B.; Hatherill, Mark A.; Johnson, Kevin D., Powder dispensing assembly for a waste container.
  16. Dunn, Steven B.; Hatherill, Mark A.; Johnson, Kevin D., Powder dispensing assembly for a waste container.
  17. Werner, Christian N.; Friedemann, Ronald E. H.; Maurer, Jessica, Stannous methanesulfonate solution with adjusted pH.
  18. Mann, William H., System and method for applying an adhesive coated cable to a surface.
  19. Dunn, Steven B.; Hatherill, Mark A.; Johnson, Kevin D., System and method for disposing waste packages such as diapers.
  20. Dunn, Steven B.; Hatherill, Mark A.; Johnson, Kevin D., System for disposing waste packages such as diapers.
  21. Dunn, Steven B.; Hatherill, Mark A.; Johnson, Kevin D., System for disposing waste packages such as diapers.
  22. Dunn, Steven B.; Hatherill, Mark A.; Johnson, Kevin D., System for disposing waste packages such as diapers.
  23. Liu, Ya Qun; Zeng, Liang; Wang, Hui; Zhang, Bright; Huang, Hong Min, Thermal interface material with ion scavenger.
  24. Stravitz, David, Waste disposal devices.
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