초록 ▼

High brightness LEDs are mounted directly on a heat pipe or are mounted on a substrate, which is mounted on the heat pipe. The heat pipe can be a common electrode for the LEDs mounted on the heat pipe. Multiple heat pipes can be arranged so that the LED arrays form a light recycling cavity to emit

High brightness LEDs are mounted directly on a heat pipe or are mounted on a substrate, which is mounted on the heat pipe. The heat pipe can be a common electrode for the LEDs mounted on the heat pipe. Multiple heat pipes can be arranged so that the LED arrays form a light recycling cavity to emit and reflect light.

대표청구항 ▼

What is claimed is: 1. An illumination system, comprising: a first array of light emitting diodes, wherein said first array of light emitting diodes emits light and wherein said first array of light emitting diodes reflects incident light; a first heat pipe, said first array of light emitting diode

What is claimed is: 1. An illumination system, comprising: a first array of light emitting diodes, wherein said first array of light emitting diodes emits light and wherein said first array of light emitting diodes reflects incident light; a first heat pipe, said first array of light emitting diodes being bonded to said first heat pipe, wherein said first heat pipe dissipates heat from said first array of light emitting diodes; a second array of light emitting diodes, wherein said second array of light emitting diodes emits light and wherein said second array of light emitting diodes reflects incident light; a second heat pipe, said second array of light emitting diodes being bonded to said second heat pipe, wherein said second heat pipe dissipates heat from said second array of light emitting diodes; a third array of light emitting diodes, wherein said third array of light emitting diodes emits light and wherein said third array of light emitting diodes reflects incident light; a third heat pipe, said third array of light emitting diodes being bonded to said third heat pipe, wherein third first heat pipe dissipates heat from said third array of light emitting diodes; a fourth array of light emitting diodes, wherein said fourth array of light emitting diodes emits light and wherein said fourth array of light emitting diodes reflects incident light; a fourth heat pipe, said fourth array of light emitting diodes being bonded to said fourth heat pipe, wherein said fourth heat pipe dissipates heat from said fourth array of light emitting diodes; a fifth array of light emitting diodes, wherein said fifth array of light emitting diodes emits light and wherein said fifth array of light emitting diodes reflects incident light; a fifth heat pipe, said fifth array of light emitting diodes being bonded to said fifth heat pipe, wherein said fifth heat pipe dissipates heat from said fifth array of light emitting diodes; wherein said first heat pipe, said second heat pipe, said third heat pipe and said fourth heat pipe extend at right angles to the adjacent heat pipe, further wherein said fifth heat pipe is at right angles to first heat pipe, said second heat pipe, said third heat pipe and said fourth heat pipe, said heat pipes forming a cubical light recycling cavity; and a light recycling means in said cubical light recycling cavity formed by said first array of light emitting diodes on said first heat pipe; said second array of light emitting diodes on said second heat pipe; said third array of light emitting diodes on said third heat pipe; said fourth array of light emitting diodes on said fourth heat pipe; and said fifth array of light emitting diodes on said fifth heat pipe; wherein said light recycling means reflects and recycles a portion of said light emitted by said first array of light emitting diodes; reflects and recycles a portion of said light emitted by said second array of light emitting diodes; reflects and recycles a portion of said light emitted by said third array of light emitting diodes; reflects and recycles a portion of said light emitted by said fourth array of light emitting diodes; and reflects and recycles a portion of said light emitted by said fifth array of light emitting diodes. 2. The illumination system of claim 1, wherein said first heat pipe is electrically conductive for supplying power to said first array of light emitting diodes, said second heat pipe is electrically conductive for supplying power to said second array of light emitting diodes, said third heat pipe is electrically conductive for supplying power to said third array of light emitting diodes, said fourth heat pipe is electrically conductive for supplying power to said fourth array of light emitting diodes, and said fifth heat pipe is electrically conductive for supplying power to said fifth array of light emitting diodes. 3. The illumination system of claim 1, wherein said first array of light emitting diodes, said second array of light emitting diodes, said third array of light emitting diodes, said fourth array of light emitting diodes and said fifth array of light emitting diodes emit light of at least two different colors. 4. The illumination system of claim 1 wherein at least one of wherein said first array of light emitting diodes, said second array of light emitting diodes, said third array of light emitting diodes, said fourth array of light emitting diodes and said fifth array of light emitting diodes emits light of at least two different colors. 5. The illumination system of claim 1, wherein said first heat pipe is bent at a 90 degree angle, said second heat pipe is bent at a 90 degree angle, said third heat pipe is bent at a 90 degree angle, said fourth heat pipe is bent at a 90 degree angle, and said fifth heat pipe is bent at a 90 degree angle. 6. The illumination system of claim 1, further comprising: a first thermally conductive substrate between said first array of light emitting diodes and said first heat pipe, wherein said first thermally conductive substrate is bonded to said first array of light emitting diodes and to a flat surface of said first heat pipe, wherein said first thermally conductive substrate conducts heat generated by said first array of light emitting diodes to said first heat pipe, and wherein said first thermally conductive substrate reflects light within said light recycling cavity; a second thermally conductive substrate between said second array of light emitting diodes and said second heat pipe, wherein said second thermally conductive substrate is bonded to said second array of light emitting diodes and to a flat surface of said second heat pipe, wherein said second thermally conductive substrate conducts heat generated by said second array of light emitting diodes to said second heat pipe, and wherein said second thermally conductive substrate reflects light within said light recycling cavity; a third thermally conductive substrate between said third array of light emitting diodes and said third heat pipe, wherein said third thermally conductive substrate is bonded to said third array of light emitting diodes and to a flat surface of said third heat pipe, wherein said third thermally conductive substrate conducts heat generated by said third array of light emitting diodes to said third heat pipe, and wherein said third thermally conductive substrate reflects light within said light recycling cavity; a fourth thermally conductive substrate between said fourth array of light emitting diodes and said fourth heat pipe, wherein said fourth thermally conductive substrate is bonded to said fourth array of light emitting diodes and to a flat surface of said fourth heat pipe, wherein said fourth thermally conductive substrate conducts heat generated by said fourth array of light emitting diodes to said fourth heat pipe, and wherein said fourth thermally conductive substrate reflects light within said light recycling cavity; and a fifth thermally conductive substrate between said fifth array of light emitting diodes and said fifth heat pipe, wherein said fifth thermally conductive substrate is bonded to said fifth array of light emitting diodes and to a flat surface of said fifth heat pipe, wherein said fifth thermally conductive substrate conducts heat generated by said fifth array of light emitting diodes to said fifth heat pipe, and wherein said fifth thermally conductive substrate reflects light within said light recycling cavity. 7. The illuminations system of claim 6, wherein said first thermally conductive substrate is electrically conductive and said first heat pipe is electrically conductive for supplying power to said first array of light emitting diodes; said second thermally conductive substrate is electrically conductive and said second heat pipe is electrically conductive for supplying power to said second array of light emitting diodes; said third thermally conductive substrate is electrically conductive and said third heat pipe is electrically conductive for supplying power to said third array of light emitting diodes; and said fourth thermally conductive substrate is electrically conductive; said fourth heat pipe is electrically conductive for supplying power to said fourth array of light emitting diodes; and said fifth heat pipe is electrically conductive for supplying power to said fifth array of light emitting diodes.