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LED with current confinement structure and surface roughening 원문보기

IPC분류정보
국가/구분 United States(US) Patent 등록
국제특허분류(IPC7판)
  • H01L-027/15
출원번호 US-0042030 (2005-01-24)
등록번호 US-7335920 (2008-02-26)
발명자 / 주소
  • Denbaars,Steven P.
  • Nakamura,Shuji
  • Batres,Max
출원인 / 주소
  • Cree, Inc.
대리인 / 주소
    Koppel, Patrick, Heybl & Dawson
인용정보 피인용 횟수 : 78  인용 특허 : 13

초록

An LED having a p-type layer of material with an associated p-contact, an n-type layer of material with an associated n-contact and an active region between the p-type layer and the n-type layer, includes a confinement structure that is formed within one of the p-type layer of material and the n-typ

대표청구항

We claim: 1. A light emitting diode (LED) comprising: a base LED structure comprising; a p-type layer of material having an associated p-contact; an n-type layer of material having an associated n-contact; an active region sandwiched between and in adjacent contact with the p-type layer and the n-t

이 특허에 인용된 특허 (13)

  1. Jewell Jack L., Conductive element with lateral oxidation barrier.
  2. Carter-Coman, Carrie; Hofler, Gloria; Kish, Jr., Fred A., Diffusion barrier for increased mirror reflectivity in reflective solderable contacts on high power led chip.
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  4. Brian Thibeault ; Steven DenBaars, Enhanced light extraction through the use of micro-LED arrays.
  5. Lee Biing-Jye,TWX ; Jou Ming-Jiunn,TWX ; Tarn Jacob C.,TWX, Light emitting diode having transparent conductive oxide formed on the contact layer.
  6. Hsing Kung ; Mark Devito ; Chin-Wang Tu, Light emitting diode of improved current blocking and light extraction structure.
  7. Huang Kuo-Hsin (10-1Fl. ; No. 36 ; Sec. 1 ; Kwang Fu Road. Hsinchu City TWX) Chen Tzer-Perng (3Fl. ; No. 55 ; Alley 10 ; Lane 81 ; Kwang Hua Street 2 Hsinchu City TWX), Light emitting diode with current blocking layer.
  8. Nai-Chuan Chen TW; Bor-Jen Wu TW; Yuan-Hsin Tzou TW; Nae-Guann Yih TW; Chien-An Chen TW, Method for forming a semiconductor device having a metallic substrate.
  9. Kong Hua-Shuang (Raleigh NC) Carter ; Jr. Calvin H. (Cary NC), Method of improving mechanically prepared substrate surfaces of alpha silicon carbide for deposition of beta silicon car.
  10. Tzer-Perng Chen TW; Chih-Sung Chang TW; Holin Chang TW, Method of manufacturing light emitting diode with current blocking structure.
  11. Palmour John W. (Raleigh NC) Kong Hua-Shuang (Raleigh NC) Edmond John A. (Apex NC), Method of preparing silicon carbide surfaces for crystal growth.
  12. Sano, Masahiko; Nonaka, Mitsuhiro; Kamada, Kazumi; Yamamoto, Masashi, Nitride semiconductor element with a supporting substrate.
  13. Davis Robert F. (Raleigh NC) Carter ; Jr. Calvin H. (Raleigh NC) Hunter Charles E. (Durham NC), Sublimation of silicon carbide to produce large, device quality single crystals of silicon carbide.

이 특허를 인용한 특허 (78)

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  4. Shatalov, Maxim S.; Dobrinsky, Alexander; Shur, Michael; Gaska, Remigijus, Device with inverted large scale light extraction structures.
  5. Shatalov, Maxim S.; Dobrinsky, Alexander; Shur, Michael; Gaska, Remigijus, Device with inverted large scale light extraction structures.
  6. Lin, Chao-Kun, Distributed bragg reflector for reflecting light of multiple wavelengths from an LED.
  7. Lin, Chao-Kun, Distributed bragg reflector for reflecting light of multiple wavelengths from an LED.
  8. Chuang, Chih-Wei; Lin, Chao-Kun, Distributed current blocking structures for light emitting diodes.
  9. Shatalov, Maxim S.; Dobrinsky, Alexander; Shur, Michael; Gaska, Remigijus, Emitting device with improved extraction.
  10. Shatalov, Maxim S.; Dobrinsky, Alexander; Shur, Michael; Gaska, Remigijus, Emitting device with improved extraction.
  11. Yang, Long, GaN LEDs with improved area and method for making the same.
  12. Yang, Long, GaN LEDs with improved area and method for making the same.
  13. Yao, Zhimin Jamie, High efficiency LEDs.
  14. Edmond, John Adam; Slater, Jr., David Beardsley; Bharathan, Jayesh; Donofrio, Matthew, High efficiency group III nitride LED with lenticular surface.
  15. Chuang, Chih-Wei; Lin, Chao-Kun; Yang, Long; Hamaguchi, Norihito, High temperature gold-free wafer bonding for light emitting diodes.
  16. Ibbetson, James; Heikman, Sten, High voltage low current surface emitting LED.
  17. Ibbetson, James; Heikman, Sten; Garceran, Julio; Brandes, George, High voltage low current surface emitting light emitting diode.
  18. Yao, Zhimin Jamie, High voltage wire bond free LEDS.
  19. Chuang, Chia-Ming; Huo, Donald Tai-Chan; Chang, Chia-Chen; Yang, Tzu-Ling; Ou, Chen, High-efficiency light-emitting device and manufacturing method thereof.
  20. Chen, Zhen, LED having a low defect N-type layer that has grown on a silicon substrate.
  21. Chen, Zhen, LED on silicon substrate using zinc-sulfide as buffer layer.
  22. Duong, Dung T.; Winberg, Paul N.; Thomas, Matthew R., LED system and method.
  23. Duong, Dung T.; Winberg, Paul N.; Thomas, Matthew R.; Pickering, Elliot M., LED system and method.
  24. Chen, Zhen; Fu, Yi, LED that has bounding silicon-doped regions on either side of a strain release layer.
  25. Lester, Steven; Ramer, Jeff; Wu, Jun; Zhang, Ling, LED with improved injection efficiency.
  26. Lester, Steven; Ramer, Jeff; Wu, Jun; Zhang, Ling, LED with improved injection efficiency.
  27. Lester, Steven; Ramer, Jeff; Wu, Jun; Zhang, Ling, LED with improved injection efficiency.
  28. DenBaars, Steven P.; Nakamura, Shuji; Batres, Max, LED with surface roughening.
  29. Chen, Zhen; Fenwick, William; Lester, Steve, Laterally contacted blue LED with superlattice current spreading layer.
  30. Chen, Zhen; Fu, Yi, Led that has bounding silicon-doped regions on either side of a strain release layer.
  31. Jeong, Hwan Hee; Moon, Ji Hyung; Lee, Sang Youl; Song, June O, Light emitting device and light emitting device package having the same.
  32. Kang, Dae Sung, Light emitting device and light emitting device package including the same.
  33. Emerson, David Todd; Haberern, Kevin; Bergmann, Michael John; Slater, Jr., David B.; Donofrio, Matthew; Edmond, John, Light emitting devices having current reducing structures.
  34. Yang, Long; Fenwick, Will, Light emitting devices having dislocation density maintaining buffer layers.
  35. Lin, Chao-Kun; Yan, Li; Chuang, Chih-Wei, Light emitting devices having light coupling layers.
  36. Yan, Li; Lin, Chao-Kun; Chuang, Chih-Wei, Light emitting devices having light coupling layers.
  37. Yan, Li; Lin, Chao-Kun; Chuang, Chih-Wei, Light emitting devices having light coupling layers with recessed electrodes.
  38. Kar, Pritish; Slater, Jr., David Beardsley; Donofrio, Matthew; Williams, Brad, Light emitting diode (LED) contact structures and process for fabricating the same.
  39. Cronk, Michael Kent; Stephens, Owen Boyd, Light emitting diode illumination system.
  40. Ramer, Jeff; Ting, Steve, Light emitting regions for use with light emitting devices.
  41. Singh, Rajwinder; Epler, John Edward, Light extraction using feature size and shape control in LED surface roughening.
  42. Nicolai, Richard; Gaon, Martin, Lighting devices.
  43. Nicolai, Richard; Gaon, Martin, Lighting devices.
  44. Lester, Steven D., Method for reducing stress in epitaxial growth.
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  46. Lin, Chao Kun, Non-reactive barrier metal for eutectic bonding process.
  47. Fenwick, William E.; Ramer, Jeff, Nucleation of aluminum nitride on a silicon substrate using an ammonia preflow.
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  49. Ting, Steve, P-type doping layers for use with light emitting devices.
  50. Ting, Steve, P-type doping layers for use with light emitting devices.
  51. Ting, Steve, P-type doping layers for use with light emitting devices.
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  56. Park, Hyung Jo, Semiconductor light emitting device.
  57. Duong, Dung T.; Winberg, Paul N.; Thomas, Matthew R., Separate optical device for directing light from an LED.
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  60. Duong, Dung T.; Winberg, Paul N.; Thomas, Matthew R., Separate optical device for directing light from an LED.
  61. Lester, Steven D.; Chuang, Chih-Wei, Series connected segmented LED.
  62. Lester, Steven D.; Chuang, Chih-Wei, Series connected segmented LED.
  63. Lester, Steven D.; Chuang, Chih-Wei, Series connected segmented LED.
  64. Ko, Hyunchul; Johnson, Randall E.; Duong, Dung T.; Winberg, Paul N., System and method for a lens and phosphor layer.
  65. Duong, Dung T.; Ko, Hyunchul; Johnson, Randall E.; Winberg, Paul N.; Radkov, Emil, System and method for color mixing lens array.
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  67. Duong, Dung T.; Winberg, Paul N.; Thomas, Matthew R.; Pickering, Elliot M.; Khizar, Muhammad, System and method for emitter layer shaping.
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  69. Duong, Dung T.; Winberg, Paul N.; Vaz, Oscar, Systems and methods for packaging light-emitting diode devices.
  70. Lin, Chao Kun, Thin-film LED with P and N contacts electrically isolated from the substrate.
  71. Lin, Chao-Kun, Thin-film LED with P and N contacts electrically isolated from the substrate.
  72. Lin, Chao-Kun, Thin-film LED with P and N contacts electrically isolated from the substrate.
  73. Lin, Chao-Kun, Thin-film LED with p and n contacts electrically isolated from the substrate.
  74. Cui, Jie, Trenched substrate for crystal growth and wafer bonding.
  75. Yu, San; Chen, Chi-Chun, Vertical structure LED current spreading by implanted regions.
  76. Seo, Won Cheol; Cho, Dae Sung, Wafer-level light emitting diode and wafer-level light emitting diode package.
  77. Seo, Won Cheol; Cho, Dae Sung, Wafer-level light emitting diode package and method of fabricating the same.
  78. Seo, Won Cheol; Cho, Dae Sung, Wafer-level light emitting diode package and method of fabricating the same.
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