초록 ▼

A reduction resistant lead-free and cadmium-free glass composition that is particularly suitable for use in conductive ink applications is disclosed. The invention includes a capacitor, which includes a conductive copper termination. The copper termination is made by firing an ink including a glass

A reduction resistant lead-free and cadmium-free glass composition that is particularly suitable for use in conductive ink applications is disclosed. The invention includes a capacitor, which includes a conductive copper termination. The copper termination is made by firing an ink including a glass component, which may include ZnO, provided the amount does not exceed about 65 mole %; B2O3, provided the amount does not exceed about 61 mole %; and, SiO2, provided the amount does not exceed about 63 mole %. The molar ratio of B2O3 to SiO2 is from about 0.05 to about 3.

대표청구항 ▼

What is claimed is: 1. A capacitor comprising a copper termination, said copper termination made by firing a lead-free and cadmium-free ink including a glass component, said glass component comprising: a. ZnO, provided the amount does not exceed 65 mole %; b. B2O3, provided the amount does not exce

What is claimed is: 1. A capacitor comprising a copper termination, said copper termination made by firing a lead-free and cadmium-free ink including a glass component, said glass component comprising: a. ZnO, provided the amount does not exceed 65 mole %; b. B2O3, provided the amount does not exceed 61mole %; and, c. SiO2, provided the amount does not exceed 63 mole %; wherein the molar ratio of B2O3 to SiO2 is from about 0.05 to about 3. 2. The capacitor of claim 1 wherein the glass component further comprises: a. Al2O3, provided the amount does not exceed 17 mole %; and b. BaO+CaO, provided the amount does not exceed 40 mole %; wherein the glass component excludes alkali oxides. 3. The capacitor of claim 2 further comprising at least one ingredient selected from the group consisting of 2-25 mol % Li2O+Na2O+K2O+Rb2O+Cs2O+Fr 2O, and 0.1-15 mol % TiO2+ZrO2. 4. The capacitor of claim 1 wherein the molar ratio of B2O3 to SiO2 is from about 0.05 to about 3 and wherein the glass component comprises: a. about 10 to about 60 mole % ZnO; b. about 1 to about 40 mole % B2O3; c. about 1 to about 55 mole % SiO2; and further comprises d. about 0.1 to about 17 mole % Al2O3; and, e. BaO+CaO, provided the combined amount of BaO+CaO does not exceed about 30 mole %. 5. The capacitor of claim 4 further comprising at least one ingredient selected from the group consisting of: a. about 0.1 to about 20 mol % Co3O4; b. about 0.1 to about 20 mol % MnO2; and, c. about 0.1 to about 20 mol % CuO. 6. The capacitor of claim 4 further comprising about 5 to about 18 mole % Li2O +Na2O+K2O+Rb2O+Cs2O+Fr2O. 7. The capacitor of claim 1 wherein the glass component comprises: a. about 25 to about 55 mole % ZnO; b. about 15 to about 25 mole % B2O3; and, c. about 10 to about 30 mole % SiO2. 8. The capacitor of claim 7 wherein the glass component further comprises: a. about 1 to about 7 mole % Al2O3; b. about 5 to about 15 mole % BaO+CaO; and, c. wherein the glass component excludes alkali oxides. 9. The capacitor of claim 8, wherein the glass component further comprises at least one ingredient selected from the group consisting of a. about 5 to about 10 mole % TiO2+ZrO2; b. about 1 to about 10 mole % MgO; and, c. about 1 to about 20 mole % F. 10. The capacitor of claim 9 wherein the glass component further comprises about 5 to about 15 mole % Li2O+Na2O+K2O+Rb2O+Cs2O+Fr 2O. 11. The capacitor of claim 1, wherein the glass component comprises: a. about 20 to about 30 mole % ZnO; b. about 15 to about 25 mole % B2O3; and c. about 35 to about 50 mole % SiO2. 12. The capacitor of claim 11, wherein the glass component further comprises: a. about 0.1 to about 5 mole % Al2O3; b. about 1 to about 13 mole % Li2O+Na2O+K2O+Rb2O+Cs2O+Fr 2O; and c. about 5 to about 15 mole % TiO2+ZrO2. 13. The capacitor of claim 12, wherein the glass component further comprises at least one ingredient selected from the group consisting of a. about 1 to about 20 mole % F, and b. about 0.1 to about 5 mole % of at least one ingredient selected from the group consisting of In2O3, SnO, CuO, NiO, and MnO. 14. The capacitor of claim 1, wherein the glass component comprises: a. about 15 to about 25 mole % ZnO; b. about 15 to about 20 mole % B2O3; and, c. about 33 to about 49 mole % SiO2. 15. The capacitor of claim 14, wherein the glass component further comprises: a. about 0.1 to about 5 mole % Al2O3 and b. about 5 to about 10 mole % Li2O+Na2O+K2O+Rb2O+Cs2O+Fr 2O. 16. The capacitor of claim 15, wherein the glass component further comprises: a. about 5 to about 15 mole % TiO2ZrO2 and b. about 1 to about 20 mole % F. 17. A capacitor comprising a copper termination, said copper termination made by firing a lead-free and cadmium-free ink including a glass component, said glass component comprising a first glass and a second glass frit, wherein the first frit comprises: a. about 5 to about 20 mole % B2O3 and about 70 to about 90 mole % SiO2, and the second frit comprises b. about 25 to about 55 mole % ZnO, and about 15 to about 25 mole % B2O3, and about 10 to about 30 mole % SiO2, wherein the weight ratio of the first frit to the second frit is from about 1:20 to about 20:1, and wherein the overall molar ratio of B2O3 to SiO2 is from about 0.05 to about 1. 18. A lead-free and cadmium-free ink for forming a conductive copper pathway, said ink comprising a metal component and about 1 to about 22 percent by weight of glass component, said glass component comprising: a. ZnO, provided the amount does not exceed 65 mole % b. B2O3, provided the amount does not exceed 61 mole %; c. SiO2, provided the amount does not exceed 63 mole %; and, d. wherein the molar ratio of B2O3 to SiO2 is from about 0.05 to about 3. 19. The ink of claim 18, wherein the glass component further comprises at least one ingredient selected from the group consisting of: a. about 0.1 to about 20 mole % MgO; b. about 0.1 to about 40 mole % BaO+CaO; and, c. about 0.1 to about 17 mole % Al2O3. 20. A process for making a multilayer ceramic chip capacitor having conductive end terminations comprising: a. forming a green chip by stacking alternating layers of a dielectric material and a conductive electrode material, b. firing the green chip to form a multilayer ceramic chip capacitor body, c. applying a conductive lead-free and cadmium-free ink to the ceramic chip capacitor body, and said ink comprising a glass component, said glass component comprising: i. ZnO, provided the amount does not exceed 65 mole %; ii. B2O3, provided the amount does not exceed 61mole %; and, iii. SiO2, provided the amount does not exceed 63 mole %; iv. wherein the molar ratio of B2O3 to SiO2 is from about 0.05 to about 3; and, v. post-firing the chip and forming the conductive end terminations.