초록 ▼

The light-emitting module according to the present invention comprises a heat dissipation element, a substrate for example a metal core printed circuit board (MCPCB), or FR4 board which is coupled to one or more light-emitting elements and provides a means for operative connection of the light-emitt

The light-emitting module according to the present invention comprises a heat dissipation element, a substrate for example a metal core printed circuit board (MCPCB), or FR4 board which is coupled to one or more light-emitting elements and provides a means for operative connection of the light-emitting elements to a source of power. The substrate is positioned such that it is thermally coupled to the heat dissipation element. The light-emitting module further comprises a housing element which matingly connects with the heat dissipation element, wherein the housing element may further comprise an optical element integrated therein for manipulation of the light generated by the one or more light-emitting elements.

대표청구항 ▼

I claim: 1. A light-emitting module comprising: (a) a thermally conductive substrate having one or more light-emitting elements thermally connected thereto, the substrate configured to operatively couple a source of power to the one or more light-emitting elements, thereby providing a means for act

I claim: 1. A light-emitting module comprising: (a) a thermally conductive substrate having one or more light-emitting elements thermally connected thereto, the substrate configured to operatively couple a source of power to the one or more light-emitting elements, thereby providing a means for activation of the one or more light-emitting elements; (b) a heat dissipation element thermally coupled to the thermally conductive substrate; and (c) a housing element including fastening means for detachably coupling the housing element to the heat dissipation element, said substrate being enclosed between the heat dissipation element and said housing element, said housing element including a transparent region enabling transmission of light emitted by the one or more light-emitting elements therethrough. 2. The light-emitting module according to claim 1 further comprising one or more optical elements for manipulation of the light emitted by said one or more light-emitting elements, said optical element optically coupled to said housing element. 3. The light-emitting module according to claim 2, wherein the one or more optical elements and the housing element are integrally formed. 4. The light-emitting module according to claim 2, wherein the optical element is a reflective element, refractive element, diffractive element, diffusive element or holographic element. 5. The light-emitting module according to claim 4, wherein the optical element is a diffuser, lenticular element, Fresnel array or lens. 6. The light-emitting module according to claim 1, wherein the substrate is configured to operatively couple a source of power to the one or more light-emitting elements using solderless connections. 7. The light-emitting module according to claim 6, wherein the solderless connections are insulation displacement connectors. 8. The light-emitting module according to claim 1, wherein the substrate is a metal core printed circuit board or a FR4 board. 9. The light-emitting module according to claim 1, wherein the substrate includes internal electrical conductive paths. 10. The light-emitting module according to claim 1, wherein the substrate includes circuit traces forming electrical conductive paths. 11. The light-emitting module according to claim 1, wherein the housing element is formed from flexible material for releasably connecting to the heat dissipation element. 12. The light-emitting module according to claim 1, wherein a sealant substance is positioned between the housing element and the heat dissipation element for environmental sealing between the housing element and the heat dissipation element. 13. The light-emitting module according to claim 1, wherein the heat dissipation element is configured for thermal connection to a heat pipe or a thermosyphon. 14. The light-emitting module according to claim 1, wherein the heat dissipation element is configured for thermal connection to a heat dissipation system. 15. The light-emitting module according to claim 14, wherein the heat dissipation system is a forced convection mechanism, electro-cooling mechanism or a low temperature heat bath.