초록 ▼

There is provided a peeling method capable of preventing a damage to a layer to be peeled. Thus, not only a layer to be peeled having a small area but also a layer to be peeled having a large area can be peeled over the entire surface at a high yield. Processing for partially reducing contact proper

There is provided a peeling method capable of preventing a damage to a layer to be peeled. Thus, not only a layer to be peeled having a small area but also a layer to be peeled having a large area can be peeled over the entire surface at a high yield. Processing for partially reducing contact property between a first material layer (11) and a second material layer (12) (laser light irradiation, pressure application, or the like) is performed before peeling, and then peeling is conducted by physical means. Therefore, sufficient separation can be easily conducted in an inner portion of the second material layer (12) or an interface thereof.

대표청구항 ▼

What is claimed is: 1. A method of peeling a layer to be peeled from a substrate, comprising: forming a first material layer on the substrate, wherein the first material layer includes tensile stress; forming a second material layer on the first material layer, wherein the second material layer inc

What is claimed is: 1. A method of peeling a layer to be peeled from a substrate, comprising: forming a first material layer on the substrate, wherein the first material layer includes tensile stress; forming a second material layer on the first material layer, wherein the second material layer includes compressive stress; forming a layer to be peeled over the second material layer; partially irradiating laser light to a portion of the first material layer; and peeling the layer to be peeled from the substrate to which the first material layer is provided at one of an inner portion of the second material layer and an interface between the second material layer and the first material layer, wherein laser light is irradiated to the first material layer from a side of the layer to be peeled. 2. A method according to claim 1, wherein the peeling by the physical means is conducted from an outer edge near the portion irradiated with the laser light. 3. A method according to claim 1, wherein the second material layer indicates compression stress of-1 dyne/cm2 to-1��1010 dyne/cm2 before the peeling and the first material layer indicates tensile stress of 1 dyne/cm2 to 1��1010 dyne/cm2 before peeling. 4. A method according to claim 1, wherein the laser light is emitted from a laser selected from the group consisting of a solid laser using one of YAG, YVO4, YLF, and YAlO3 which is doped with one of Nd, Tm, and Ho, an excimer laser, a CO2 laser, an argon laser, and a semiconductor laser. 5. A method according to claim 1, wherein: the layer to be peeled has semiconductor layers formed over a first portion of the layer to be peeled, and partially irradiating laser light comprising doing so to a second portion located between the first portion and an outer edge of the substrate. 6. A method of peeling a layer to be peeled from a substrate, comprising: forming a first material layer on the substrate, wherein the first material layer includes tensile stress; forming a second material layer on the first material layer, wherein the second material layer includes compressive stress; forming a layer to be peeled over the second material layer; partially irradiating laser light to a portion of the first material layer; bonding a support to the layer to be peeled; and peeling the layer to be peeled to which the support is bonded from the substrate to which the first material layer is provided at one of an inner portion of the second material layer and an interface between the second material layer and the first material layer, wherein laser light is irradiated to the first material layer from a side of the layer to be peeled. 7. A method according to claim 6, wherein the peeling by the physical means is conducted from an outer edge near the portion irradiated with the laser light. 8. A method according to claim 6, wherein the second material layer indicates compression stress of-1 dyne/cm2 to-1��1010 dyne/cm2 before the peeling and the first material layer indicates tensile stress of 1 dyne/cm2 to 1��1010 dyne/cm2 before peeling. 9. A method according to claim 6, wherein the laser light is emitted from a laser selected from the group consisting of a solid laser using one of YAG, YVO4, YLF, and YAlO3 which is doped with one of Nd, Tm, and Ho, an excimer laser, a CO2 laser, an argon laser, and a semiconductor laser. 10. A method according to claim 6, wherein: the layer to be peeled has semiconductor layers formed over a first portion of the layer to be peeled, and partially irradiating laser light comprising doing so to a second portion located between the first portion and an outer edge of the substrate. 11. A method of manufacturing a semiconductor device, comprising forming a first material layer on a substrate, wherein the first material layer includes tensile stress; forming a second material layer on the first material layer, wherein the second material layer includes compressive stress; forming a layer to be peeled which includes an element over the second material layer; bonding a support to the layer to be peeled which includes the element; peeling the layer to be peeled and the support from the substrate; and bonding a transfer body to the layer to be peeled which includes the element to sandwich the element between the support and the transfer body, wherein laser light is partially irradiated to a portion of the first material layer before the peeling, and wherein laser light is irradiated to the first material layer from a side of the layer to be peeled. 12. A method according to claim 11, wherein the peeling by the physical means is conducted from an outer edge near the portion irradiated with the laser light. 13. A method according to claim 11, wherein the peeling by the physical means is conducted by blowing a gas onto the outer edge of the substrate. 14. A method according to claim 11, wherein the peeling by the physical means is conducted by blowing a gas onto the outer edge of the substrate together with irradiation of laser light. 15. A method according to claim 14, wherein the gas is a heated nitrogen gas. 16. A method according to claim 11, wherein the peeling by the physical means is conducted by blowing the gas onto the outer edge of the substrate together with scanning using the laser light from the region for which the treatment for reducing the contact property is performed. 17. A method according to claim 11, wherein an oscillation type of the laser light is one of continuous oscillation and pulse oscillation. 18. A method according to claim 11, wherein the laser light is emitted from a laser selected from the group consisting of a solid laser using one of YAG, YVO4, YLF, and YAlO3 which is doped with one of Nd, Tm, and Ho, an excimer laser, a CO2 laser, an argon laser, and a semiconductor laser. 19. A method according to claim 11, wherein: the layer to be peeled has semiconductor layers formed over a first portion of the layer to be peeled, and partially irradiating laser light comprising doing so to a second portion located between the first portion and an outer edge of the substrate. 20. A method of peeling a layer to be peeled from a substrate, comprising: forming a first material layer on the substrate, wherein the first material layer; forming a second material layer on the first material layer; forming a layer to be peeled over the second material layer; partially irradiating laser light to a portion of the first material layer; and peeling the layer to be peeled from the substrate to which the first material layer is provided at one of an inner portion of the second material layer and an interface between the second material layer and the first material layer, wherein laser light is irradiated to the first material layer from a side of the layer to be peeled. 21. A method according to claim 20, wherein the laser light is emitted from a laser selected from the group consisting of a solid laser using one of YAG, YVO4, YLF, and YAlO3 which is doped with one of Nd, Tm, and Ho, an excimer laser, a CO2 laser, an argon laser, and a semiconductor laser. 22. A method according to claim 20, wherein: the layer to be peeled has semiconductor layers formed over a first portion of the layer to be peeled, and partially irradiating laser light comprising doing so to a second portion located between the first portion and an outer edge of the substrate. 23. A method of peeling a layer to be peeled from a substrate, comprising: forming a first material layer on the substrate; forming a second material layer on the first material layer; forming a layer to be peeled over the second material layer; partially irradiating laser light to a portion of the first material layer; bonding a support to the layer to be peeled; and peeling the layer to be peeled to which the support is bonded from the substrate to which the first material layer is provided at one of an inner portion of the second material layer and an interface between the second material layer and the first material layer, wherein laser light is irradiated to the first material layer from a side of the layer to be peeled. 24. A method according to claim 23, wherein the laser light is emitted from a laser selected from the group consisting of a solid laser using one of YAG, YVO4, YLF, and YAlO3 which is doped with one of Nd, Tm, and Ho, an excimer laser, a CO2 laser, an argon laser, and a semiconductor laser. 25. A method according to claim 23, wherein: the layer to be peeled has semiconductor layers formed over a first portion of the layer to be peeled, and partially irradiating laser light comprising doing so to a second portion located between the first portion and an outer edge of the substrate. 26. A method of manufacturing a semiconductor device, comprising forming a first material layer on a substrate; forming a second material layer on the first material layer; forming a layer to be peeled which includes an element over the second material layer; bonding a support to the layer to be peeled which includes the element; peeling the layer to be peeled and the support from the substrate; and bonding a transfer body to the layer to be peeled which includes the element to sandwich the element between the support and the transfer body, wherein laser light is partially irradiated to a portion of the first material layer before the peeling, and wherein laser light is irradiated to the first material layer from a side of the layer to be peeled. 27. A method according to claim 26, wherein the laser light is emitted from a laser selected from the group consisting of a solid laser using one of YAG, YVO4, YLF, and YAlO3 which is doped with one of Nd, Tm, and Ho, an excimer laser, a CO2 laser, an argon laser, and a semiconductor laser. 28. A method according to claim 26, wherein: the layer to be peeled has semiconductor layers formed over a first portion of the layer to be peeled, and partially irradiating laser light comprising doing so to a second portion located between the first portion and an outer edge of the substrate.