IPC분류정보
국가/구분 |
United States(US) Patent
등록
|
국제특허분류(IPC7판) |
|
출원번호 |
US-0184115
(2002-06-28)
|
등록번호 |
US-7365822
(2008-04-29)
|
우선권정보 |
KR-2002-9096(2002-02-20); KR-2002-10170(2002-02-26) |
발명자
/ 주소 |
- Lee,Sang Seok
- Park,Sang Ho
- Park,Moo Yeol
- Jung,Sung Su
|
출원인 / 주소 |
|
대리인 / 주소 |
McKenna Long & Aldridge, LLP
|
인용정보 |
피인용 횟수 :
2 인용 특허 :
49 |
초록
▼
A method for fabricating an LCD includes the steps of (a) loading a first substrate and a second substrate having seals formed thereon on a bonding chamber, (b) bonding the first and second substrates, (c) fixing the bonded first and second substrates, and (d) unloading the fixed first and second su
A method for fabricating an LCD includes the steps of (a) loading a first substrate and a second substrate having seals formed thereon on a bonding chamber, (b) bonding the first and second substrates, (c) fixing the bonded first and second substrates, and (d) unloading the fixed first and second substrates.
대표청구항
▼
What is claimed is: 1. A method for fabricating a liquid crystal display (LCD), comprising: preparing a first substrate and a second substrate; providing a liquid crystal on at least one of the first and second substrates; providing main seals for sealing the liquid crystal applied on a plurality o
What is claimed is: 1. A method for fabricating a liquid crystal display (LCD), comprising: preparing a first substrate and a second substrate; providing a liquid crystal on at least one of the first and second substrates; providing main seals for sealing the liquid crystal applied on a plurality of LCD panels and fixing seals outside the main seals on at least one of the first and second substrates; loading the first substrate and the second substrate into a bonding chamber; bonding the first and second substrates; curing the fixing seal in the bonding chamber, thereby fixing the first substrate to the second substrate; and unloading the fixed first and second substrates. 2. A method as claimed in claim 1, wherein the curing includes at least one of directing a light, applying heat, and applying pressure to the portion of the main seals. 3. A method as claimed in claim 1, further comprising curing after the bonding is complete. 4. A method as claimed in claim 1, wherein the curing includes the step of at least one of directing a light, applying heat, and applying pressure to the fixing seals. 5. A method as claimed in claim 4, wherein the fixing seals are formed in a periphery region. 6. A method as claimed in claim 4, wherein the fixing seals are formed in a periphery region of the first substrate. 7. A method as claimed in claim 4, wherein the fixing seals are formed in parts to be cut between panels and in a periphery region. 8. A method as claimed in claim 1, further including a dummy seal for protecting the main seals; and the curing includes the step of at least one of directing a light, applying heat, and applying pressure to the fixing seals, thereby fixing the first and second substrates. 9. A method as claimed in claim 8, wherein the dummy seal surrounds the main seals. 10. A method as claimed in claim 8, wherein the dummy seal surrounds each of the main seals. 11. A method as claimed in claim 8, wherein the fixing seals are formed in a periphery region of the substrate or in regions between panels. 12. A method as claimed in claim 1, wherein the fixing seals are formed on the first substrate or the second substrate. 13. A method as claimed in claim 1, further including a dummy seal for protecting the plurality of main seals, and the curing includes the step of at least one of directing a light, applying heat, and applying pressure to the dummy seal, thereby fixing the first and second substrates. 14. A method as claimed in claim 13, wherein the main seals are formed on the second substrate and the dummy seal is formed on the first substrate. 15. A method as claimed in claim 13, wherein the dummy seal surrounds the plurality of main seals. 16. A method as claimed in claim 13, wherein the dummy seal surrounds each of the main seals. 17. A method as claimed in claim 13, wherein the curing includes curing a portion of the dummy seal. 18. A method as claimed in any one of claims 2, 4, 8, and 13, wherein the light has a power of about 50-500 mW and is directed for more than about 5 seconds. 19. A method as claimed in any one of claims 2, 4, 8, and 13, wherein the heat is applied at a temperature of about 50-200�� C. for more than about 10 seconds. 20. A method as claimed in any one of claims 2, 4, 8, and 13, wherein the step of at least directing a light, or applying heat includes the steps of: moving a light directing pin or a heating device from an upper side of the bonding chamber to a lower side of the bonding chamber, or moving a light directing pin or a heating device from a lower side of the bonding chamber to an upper side of the bonding chamber. 21. A method as claimed in claim 1, further comprising curing before the bonding is complete. 22. A method for fabricating an LCD, comprising: loading a first substrate having liquid crystal applied thereto and main seals formed thereon, and a second substrate having fixing seals formed thereon, into a bonding chamber, wherein the fixing seals are formed at a periphery of the second substrate; bonding the first and second substrates; curing the fixing seals to fix the first and second substrates together in the bonding chamber; and unloading the fixed first and second substrates. 23. A method as claimed in claim 22, further comprising: forming each main seal at a periphery of a corresponding panel region of the first substrate; and forming each fixing seal at a region of the second substrate that is aligned with portions of the first substrate not occupied a panel region. 24. A method for fabricating an LCD, comprising: loading a first substrate having liquid crystal dropped thereon and main seals and fixing seals formed thereon, and a second substrate, into a bonding chamber; bonding the first and second substrates; selectively curing the fixing seals with respect to the main seals to fix the first and second substrates together in the bonding chamber; and unloading the fixed first and second substrates. 25. A method as claimed in claim 24, further comprising: forming each main seal at a periphery of a corresponding panel region of the first substrate; and forming each fixing seal on portions of the first substrate not occupied a panel region. 26. A method for fabricating an LCD, comprising: loading a first substrate having liquid crystal dropped thereon and fixing seals formed thereon, and a second substrate having main seals formed thereon, into a bonding chamber, wherein the fixing seals are formed at a periphery of the first substrate; bonding the first and second substrates; curing the fixing seals to fix the first and second substrates together in the bonding chamber; and unloading the fixed first and second substrates. 27. A method as claimed in claim 26, further comprising: forming each main seal at a periphery of a corresponding panel region of the second substrate; and forming each fixing seal at a region of the first substrate that is aligned with portions of the second substrate not occupied a panel region. 28. A method for fabricating a liquid crystal display (LCD), comprising: loading a first substrate and a second substrate into a bonding chamber, wherein at least one of the first and second substrates has seals formed thereon; coating an adhesive with a setting property better than that of the seals to portions of the second substrate to be cut or to a periphery of the second substrate; curing the adhesive in the bonding chamber; bonding the first and second substrates; and fixing the bonded substrates using the adhesive. 29. A method for fabricating a liquid crystal display (LCD), comprising: providing a liquid crystal on a first substrate; providing a first seal on a second substrate, the first seal that seals the liquid crystal in a liquid crystal panel to be formed; providing a second seal on one of the first and second substrates; loading the first substrate and the second substrate into a bonding chamber; aligning and bonding the first and second substrates; curing the second seal in the bonding chamber to maintain an alignment of the bonded first and second substrate; unloading the fixed first and second substrates. 30. A method as claimed in claim 29, wherein the curing includes one of directing a light and applying heat. 31. A method as claimed in claim 30, wherein the second seal is formed at a periphery of said one of the first and second substrates. 32. A method as claimed in claim 31, further including a third seal between the first and second seals. 33. A method as claimed in claim 31, further comprising cleaning the second substrate after providing the first seal on the second substrate. 34. A method as claimed in claim 30, wherein the light has a power of about 50-500 mW and is directed for more than about 5 seconds. 35. A method as claimed in claim 30, wherein the heat is applied at a temperature of about 50-200�� C. for more than about 10 seconds.
※ AI-Helper는 부적절한 답변을 할 수 있습니다.