$\require{mediawiki-texvc}$

연합인증

연합인증 가입 기관의 연구자들은 소속기관의 인증정보(ID와 암호)를 이용해 다른 대학, 연구기관, 서비스 공급자의 다양한 온라인 자원과 연구 데이터를 이용할 수 있습니다.

이는 여행자가 자국에서 발행 받은 여권으로 세계 각국을 자유롭게 여행할 수 있는 것과 같습니다.

연합인증으로 이용이 가능한 서비스는 NTIS, DataON, Edison, Kafe, Webinar 등이 있습니다.

한번의 인증절차만으로 연합인증 가입 서비스에 추가 로그인 없이 이용이 가능합니다.

다만, 연합인증을 위해서는 최초 1회만 인증 절차가 필요합니다. (회원이 아닐 경우 회원 가입이 필요합니다.)

연합인증 절차는 다음과 같습니다.

최초이용시에는
ScienceON에 로그인 → 연합인증 서비스 접속 → 로그인 (본인 확인 또는 회원가입) → 서비스 이용

그 이후에는
ScienceON 로그인 → 연합인증 서비스 접속 → 서비스 이용

연합인증을 활용하시면 KISTI가 제공하는 다양한 서비스를 편리하게 이용하실 수 있습니다.

System capable of determining applied and anodized coating thickness of a coated-anodized product 원문보기

IPC분류정보
국가/구분 United States(US) Patent 등록
국제특허분류(IPC7판)
  • G01B-011/02
출원번호 US-0031967 (2005-01-07)
등록번호 US-7365860 (2008-04-29)
발명자 / 주소
  • Price,Joseph K.
출원인 / 주소
  • Sensory Analytics
대리인 / 주소
    Kilpatrick Stockton LLP
인용정보 피인용 횟수 : 4  인용 특허 : 46

초록

A system for forming an anodized coating on at least a portion of a substrate thereby creating an anodized substrate is disclosed. The system includes a bath, a coating thickness monitor, at least one probe and at least one controller. The coating thickness monitor includes at least one radiation so

대표청구항

What is claimed is: 1. A coating thickness monitor for measuring the thickness of at least a portion of a coated-anodized coating on at least a portion of a substrate, said coating thickness monitor including: (a) at least one radiation source directed at at least a portion of the anodized substrat

이 특허에 인용된 특허 (46)

  1. Ledger Anthony M. (New Fairfield CT), Apparatus and method for measuring the thickness of thin films.
  2. Ledger Anthony M. (New Fairfield CT), Apparatus and method for performing thin film layer thickness metrology on a thin film layer having shape deformations a.
  3. Mumola Peter B. (Huntington CT), Apparatus and method for performing thin film layer thickness metrology using a correlation reflectometer.
  4. Takeuchi Masayuki,JPX ; Nakagawa Shinya,JPX, Apparatus for monitoring in-situ the thickness of a film during film deposition and a method thereof.
  5. Loch David M. (Seattle WA), Automated alternating polarity direct current pulse electrolytic processing of metals.
  6. Brayden ; Jr. Thomas H. ; Winters ; Jr. Thomas D., Coating thickness measurement system and method of measuring a coating thickness.
  7. Kawai Satoshi (Chigasaki JA) Yamagiwa Yoichi (Chigasaki JA) Mizusawa Masashi (Fujisawa JA) Watanabe Hiroshi (Hiratsuka JA) Ando Yoshio (Tokyo JA) Takahashi Masaaki (Tokyo JA), Continuous electrolytical treatment of aluminum or its alloys.
  8. Calotychos Jean Andre (London GB2) Miles Mark (Witham GB2) McBride John Mather (Emmer Green GB2), Control of paint spraying machines and the like.
  9. Krall ; Jr. Rudy A. ; Taylor Matthew A. ; Burch Shaun D. ; Puleo Adam J., Control system monitor.
  10. Woodman Edward C. (Newburyport MA) Ellersick William F. (Watertown MA), Controller for multiple-axis machine.
  11. Ehlig Peter N. (Houston TX) Boutaud Frederic (Roquefort les Pius FRX), Devices and systems with parallel logic unit, and methods.
  12. Sekiguchi Hiroshi (Tokyo JPX), Drive control system for electric equipment.
  13. Sheasby Peter G. (Bloxham GB2) Short Edward P. (North Aston GB2) Gupta Tarun K. S. (Maharahstra INX), Electrolytic coloring of anodized aluminium by means of optical interference effects.
  14. Johnson Edward A. ; Morse Theodore F., Fiber optic reflectance apparatus for in situ characterization of thin films.
  15. Ledger Anthony M. (New Fairfield CT), Film thickness measurement of structures containing a scattering surface.
  16. Inaba Hajimu (Hino JPX) Nakajima Seiichiro (Hino JPX) Inagaki Shigemi (Musashino JPX), Industrial robot.
  17. Kchel Michael (Oberkochen DEX), Interferometer for measuring optical phase differences.
  18. Gerlinger Hermann (Aalen-Ebnat DEX) Hohberg Gerhard (Aalen-Dewangen DEX) Schneider Horst (Knigsbronn DEX), Measuring apparatus for characterizing a surface having color directional reflectance properties.
  19. Suzuki Takahisa,JPX ; Ohta Motoji,JPX ; Suzuki Masaru,JPX, Method and apparatus for evaluating the layers.
  20. Case, William R.; Johnson, Wildey E., Method and apparatus for measuring thickness of epitaxial layer by infrared reflectance.
  21. White Jeffrey S. ; LaPlant Frederick P. ; Dixon John W., Method and system for measuring a physical parameter of at least one layer of a multilayer article without damaging the article and sensor head for use therein.
  22. Wong Chun-Ming (Seattle WA) Moji Yukimori (Seattle WA), Method for anodizing aluminum.
  23. Kubota Hiroo,JPX ; Inukai Yuzo,JPX, Method for anodizing aluminum material.
  24. Novacek, William G., Method for continuously monitoring oxide thickness on moving aluminum foil.
  25. Marcus Michael A. ; Lee Jiann-Rong ; Gross Stanley ; Harris Harry W., Method for measuring material thickness profiles.
  26. Cielo Paolo (Montreal CAX) Cole Kenneth C. (St. Hubert CAX) Lamontagne Mario (Longueuil CAX), Method for on-line thickness monitoring of a transparent film.
  27. Kondo Noriyuki (Kyoto JPX), Method of and apparatus for measuring film thickness.
  28. Moji Yukimori (Bainbridge Island WA) Marceau J. Arthur (Seattle WA), Method of anodizing titanium to promote adhesion.
  29. Tabata Hidetoshi (Kawasaki JPX), Method of measuring film thickness.
  30. Schnelle Joseph W. (Cincinnati OH) Webb Gregory (Cincinnati OH) Tarvin Ronald L. (Cincinnati OH) Brown James V. (Amelia OH), Method of moving and orienting a tool along a curved path.
  31. McDaniel George H. (Northville MI) Hartford Thomas W. (Livonia MI) Hungerford William R. (Detroit MI) Perzanowski William J. (Troy MI) Benaglio Reno V. (Bloomfield Hills MI), Microprocessor based process control system.
  32. Ropelato Michell (22/24 ; rue Marceau F-92170 Vanves FRX), Modular device for controlling industrial processes.
  33. Brown David W. ; Clark Jay S., Motion control systems.
  34. Shih I-Fu (Los Alamitos CA) Chang David B. (Tustin CA) Vali Victor (Laguna Hills CA), Noncontact, on-line determination of phosphate layer thickness and composition of a phosphate coated surface.
  35. Greenberg Jeffrey S. (5 Miramar Ave. Santa Barbara CA 93108) Robinson Jay E. (1545 Kendall Dr. Boulder CO 80303) Young James M. (P.O. Box 40449 Santa Barbara CA 93140) Cohen Daniel A. (309-B Consuelo, Optical profiler for films and substrates.
  36. Dobschal Hans-Juergen,DEX ; Fuchs Werner,DEX ; Graefe Dieter,DEX ; Gauglitz Guenter,DEX ; Brecht Andreas,DEX, Process and apparatus for detecting structural changes of specimens.
  37. Brown James Vaughn ; Kuhl David K. ; Ondrasek Michael J., Process and apparatus for imparting linear motion to tooling attached to the end of a manipulator device having two diff.
  38. Krivoshein Ken D. ; Christensen Dan D., Process control system including automatic sensing and automatic configuration of devices.
  39. Impink ; Jr. Albert J. (Murrysville PA), Process facility monitor using fuzzy logic.
  40. Paulet Jean-Franois (Siblingen CHX), Process for continuously anodizing strips or wires of aluminum.
  41. Burton Charles A. (Columbus OH), Programmable positioning and operating mechanism for industrial operating head.
  42. Johnson ; Charles H. ; Booker ; Robert A., Rate control system for manipulator arms.
  43. Gerlinger Hermann (Aalen-Ebnat DEX) Hohberg Gerhard (Oberkochen DEX), Reflectance measuring apparatus for making contactless measurements.
  44. Hohberg Gerhard (Aalen-Dewangen DEX) Gerlinger Hermann (Aalen-Ebnat DEX), Reflectance measuring apparatus for making contactless measurements.
  45. Hyatt Gilbert P. (11101 Amigo Ave. Northridge CA 91324), System for interfacing a computer to a machine.
  46. Laine Donald D. (San Carlos CA) Rochte Jerry E. (Los Altos CA) Wolcott Frederick C. (Los Altos CA), XYZ positioner.

이 특허를 인용한 특허 (4)

  1. Hayashi, Hidekazu; Imaoku, Takao, Die inspection method.
  2. Nesbitt, Bruce, Electrosurgical electrode and method of manufacturing same.
  3. Nesbitt, Bruce, Electrosurgical electrode and method of manufacturing same.
  4. Nesbitt, Bruce, Electrosurgical electrode and method of manufacturing same.
섹션별 컨텐츠 바로가기

AI-Helper ※ AI-Helper는 오픈소스 모델을 사용합니다.

AI-Helper 아이콘
AI-Helper
안녕하세요, AI-Helper입니다. 좌측 "선택된 텍스트"에서 텍스트를 선택하여 요약, 번역, 용어설명을 실행하세요.
※ AI-Helper는 부적절한 답변을 할 수 있습니다.

선택된 텍스트

맨위로