Compound connector for two different types of electronic packages
국가/구분
United States(US) Patent
등록
국제특허분류(IPC7판)
H01R-013/62
출원번호
US-0330639
(2006-01-12)
등록번호
US-7367826
(2008-05-06)
우선권정보
TW-89210160 U(2000-06-14)
발명자
/ 주소
Wang,Leland
Chu,Stelar
Juang,Aruong
Hsu,Chan Ming
Chen,Jiann Jou
Tsai,Tsan Lung
출원인 / 주소
FCI Americas Technology, Inc.
대리인 / 주소
Woodcock Washburn LLP
인용정보
피인용 횟수 :
1인용 특허 :
35
초록▼
Disclosed is a smart card connector for transmitting signals between a smart card and an external electronic system, wherein the smart card has contacts on one of two major surfaces thereof, the connector comprising: guiding structure defining a storage space having a first end and an opposed second
Disclosed is a smart card connector for transmitting signals between a smart card and an external electronic system, wherein the smart card has contacts on one of two major surfaces thereof, the connector comprising: guiding structure defining a storage space having a first end and an opposed second end, through which second end, the smart card may be inserted, and contact terminals in the storage space for connecting with the contacts of the smart card to be inserted in the storage space; and an ejecting mechanism provided on the guiding structure and being operable to eject the smart card from the storage space. Further disclosed is a compound connector that comprises two types of I/O connectors, one of which I/O connectors may be a smart connector for use with an external electronic system.
대표청구항▼
What is claimed: 1. A compound connector device for connecting at least one of a first type of I/O electronic package having contacts on a leading edge thereof, and a second type of I/O electronic package different from said first type and having a leading edge and two major surfaces and having con
What is claimed: 1. A compound connector device for connecting at least one of a first type of I/O electronic package having contacts on a leading edge thereof, and a second type of I/O electronic package different from said first type and having a leading edge and two major surfaces and having contacts on one of said two major surfaces thereof, comprising: a connector section; first guiding structure connected to and extending lengthwise from the connector section and defining at least a first storage space for receiving the first type of I/O electronic package; the connector section having a contact array for connecting with the first contacts of the first type of I/O electronic package to be inserted in the first storage space; and second guiding structure affixed to the first guiding structure, and defining at least a second storage space for receiving the second type of I/O electronic package, the second guiding structure having contact terminals thereon different from the contact array of said connector section for connecting with the contacts of the second type of I/O electronic package to be inserted in the second storage space; wherein the first storage space and the second storage space are substantially coextensive. 2. The compound connector device as set forth in claim 1, wherein: said first type of I/O electronic package is a PCMCIA card; and said second type of I/O electronic package is a smart card. 3. The compound connector device according to claim 1, wherein said smart card is positioned above said PCMCIA card in said compound connector device. 4. The compound connector device as set forth in claim 1, wherein said second guiding structure includes a printed circuit board positioned as a top wall of said connector device. 5. The compound connector device as set forth in claim 1, wherein said second contact terminals protrude downwardly from said printed circuit board into said second storage space. 6. The compound connector device as set forth in claim 1, further comprising: a first ejector provided on the first guiding structure and being operable to eject the first type of I/O electronic package from the first storage space; and a second ejector provided on the second guiding structure and being operable to eject the second type of I/O package from the second storage space; wherein said first ejector is mechanically different from said second ejector. 7. The compound connector of claim 1, wherein said leading edge of said first type of I/O electronic package and said leading edge of said second type of I/O electronic package lie in substantially the same plane. 8. The compound connector according to claim 7, wherein said plane is adjacent said connector section. 9. The compound connector device as set forth in claim 1, wherein the second guiding structure comprises a connection for electrically connecting the second guiding structure to the first guiding structure. 10. The compound connector device as set forth in claim 9, wherein the connection is a flexible cable. 11. A compound connector device for connecting a first I/O electronic package having a leading edge and first type of contacts and a second I/O electronic package having a leading edge and a second type of contacts different from said first type of contacts, comprising: a connector section for connecting said compound connector to an external electronic system; first guiding structure extending lengthwise from the connector section and defining at least a first storage space for receiving the first I/O electronic package; the connector section having a contact array for connecting with the first type of contacts of the first I/O electronic package to be inserted in the first storage space; and second guiding structure affixed to the first guiding structure, and defining at least a second storage space for receiving the second I/O electronic package, the second guiding structure having contact terminals thereon for connecting with the second type of contacts of the second I/O electronic package to be inserted in the second storage space; said second I/O electronic package is positioned above said first I/O electronic package in said connector device; and said second guiding structure includes a printed circuit board positioned as a top wall of said connector device. 12. The compound connector device according to claim 11, wherein said first I/O electronic package is different from said second I/O electronic package besides for having different contacts. 13. The compound connector device according to claim 11, wherein said first I/O electronic package is a PCMCIA card and said second I/O electronic package is a smart card. 14. The compound connector device according to claim 13, wherein said smart card is positioned above said PCMCIA card in said compound connector device. 15. The compound connector of claim 11, wherein said leading edge of said first type of I/O electronic package and said leading edge of said second type of I/O electronic package lie in substantially the same plane. 16. The compound connector according to claim 15, wherein said plane is adjacent said connector section. 17. A compound connector device including a memory card connector and a smart card connector, the compound connector device comprising: a connector section; a first guiding structure connected to and extending lengthwise from the connector section, the first guiding structure comprising first and second spaced apart sidewalls to define a first storage space for receiving a memory card; and a second guiding structure comprising a base coextensive with and affixed to each of the first and second spaced apart sidewalls, and a plate spaced apart from and facing the base to define a second storage space for receiving a smart card. 18. The compound connector device according to claim 17, wherein the base is a printed circuit board. 19. The compound connector device according to claim 17, wherein the second guiding structure further comprises a separately formed guiding plate extending from the plate in a direction opposing the connector section. 20. A compound connector device for connecting two I/O electronic packages, the compound connector device comprising: a connector section; a first guiding structure connected to and extending lengthwise from the connector section and defining a first storage space for receiving a first I/O electronic package; and a second guiding structure comprising a base affixed to the first guiding structure, and a series of individual plate members that are collectively spaced apart from and facing the base to define a second storage space for receiving a second I/O electronic package. 21. The compound connector device according to claim 20, wherein the series of individual plate members includes a plate and a guiding plate extending therefrom. 22. The compound connector device according to claim 21, wherein the guiding plate is substantially parallel to the plate. 23. The compound connector device according to claim 20, wherein connector section, the first guiding structure, and first storage space define a memory card connector. 24. The compound connector device according to claim 23, wherein the second guiding structure and the second storage space define a smart card connector.
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이 특허에 인용된 특허 (35)
Klatt Dieter,DEX ; Pelke Bernhard,DEX, Adaptor for contacting card-shaped supports.
David James J. (Mechanicsburg PA) Duesterhoeft Scott S. (Etters PA) Spickler John M. (Marietta PA) Hiyama Naoki (Yokohama JPX), Eject activation mechanism for a memory card connector and method of use.
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