초록 ▼

Heating devices are formed of a conductive loaded resin-based material. The conductive loaded resin-based material comprises micron conductive powder(s), conductive fiber(s), or a combination of conductive powder and conductive fibers in a base resin host. The ratio of the weight of the conductive p

Heating devices are formed of a conductive loaded resin-based material. The conductive loaded resin-based material comprises micron conductive powder(s), conductive fiber(s), or a combination of conductive powder and conductive fibers in a base resin host. The ratio of the weight of the conductive powder(s), conductive fiber(s), or a combination of conductive powder and conductive fibers to the weight of the base resin host is between about 0.20 and 0.40. The micron conductive powders are formed from non-metals, such as carbon, graphite, that may also be metallic plated, or the like, or from metals such as stainless steel, nickel, copper, silver, that may also be metallic plated, or the like, or from a combination of non-metal, plated, or in combination with, metal powders. The micron conductor fibers preferably are of nickel plated carbon fiber, stainless steel fiber, copper fiber, silver fiber, or the like.

대표청구항 ▼

What is claimed is: 1. A heating device comprising: a heating element comprising a conductive loaded, resin-based material comprising micron conductive fiber substantially homogenized in a base resin host wherein said micron conductive fiber has a diameter of between 3 μm and 12 μm and a

What is claimed is: 1. A heating device comprising: a heating element comprising a conductive loaded, resin-based material comprising micron conductive fiber substantially homogenized in a base resin host wherein said micron conductive fiber has a diameter of between 3 μm and 12 μm and a length of between 2 mm and 14 mm; a first terminal connected at a first end of said heating element; and a second terminal connected at a second end of said heating element. 2. The device according to claim 1 wherein the ratio, by weight, of said micron conductive fiber to said resin host is between about 0.20 and about 0.40. 3. The device according to claim 1 wherein said conductive loaded resin-based material further comprises metal powder. 4. The device according to claim 3 wherein said metal powder is nickel, copper, or silver. 5. The device according to claim 3 wherein said metal powder is a non-conductive material with a metal plating. 6. The device according to claim 5 wherein said metal plating is nickel, copper, or silver. 7. The device according to claim 3 wherein said metal powder comprises a diameter of between about 3 μm and about 12 μm. 8. The device according to claim 1 wherein said conductive loaded resin-based material further comprises non-metal powder. 9. The device according to claim 8 wherein said non-metal powder is carbon, graphite, or an amine-based material. 10. The device according to claim 1 wherein said conductive loaded resin-based material further comprises a combination of metal powder and non-metal powder. 11. The device according to claim 1 wherein said micron conductive fiber comprises metal fiber. 12. The device according to claim 1 wherein said micron conductive fiber is nickel plated carbon fiber, stainless steel fiber, copper fiber, silver fiber or combinations thereof. 13. The device according to claim 1 wherein said micron conductive fiber comprises a nonconductive core and metal plating. 14. The device according to claim 1 further comprising an electrically insulating layer surrounding said heating element. 15. The device according to claim 14 wherein said electrically insulating layer is highly thermally conductive. 16. The device according to claim 14 wherein said electrically insulating layer is a resin-based material. 17. The device according to claim 14 wherein said heating element and said electrically insulating layer are flexible. 18. The device according to claim 14 further comprising a wire embedded in said electrically insulating layer. 19. The device according to claim 14 wherein said base resin and said electrically insulating layer comprise flame-retardant materials. 20. The device according to claim 1 further comprising a metal layer overlying said heating element. 21. The device according to claim 1 wherein said heating element comprises a planar pad. 22. The device according to claim 21 wherein said planar pad is a spiral pattern. 23. The device according to claim 1 wherein said heating device is embedded in a seating apparatus. 24. The device according to claim 1 wherein said heating device is laminated to a transparent panel. 25. The device according to claim 24 wherein said base resin is transparent. 26. The device according to claim 1 wherein said heating device is attached to a mirror. 27. The device according to claim 1 wherein said heating device is embedded in a flooring system. 28. The device according to claim 1 wherein said heating device is a cartridge. 29. The device according to claim 1 wherein said heating device further comprises a plurality of conductive fins. 30. The device according to claim 29 wherein said conductive fins comprise conductive loaded resin-based material. 31. The device according to claim 1 wherein said heating device is coupled around a pipe. 32. The device according to claim 1 wherein said heating device is a hollow pipe or tube capable of transporting a fluid. 33. The device according to claim 1 wherein said heating device is a circular rod. 34. The device according to claim 1 further comprising a wire embedded into said heating element. 35. A heating device comprising: a heating element comprising a conductive loaded, resin-based material comprising micron conductive fiber substantially homogenized in a base resin host wherein said micron conductive fiber is a metal fiber and wherein said micron conductive fiber has a diameter of between 3 μm and 12 μm and a length of between 2 mm and 14 mm; an electrically insulating layer surrounding said heating element; a first terminal connected at a first end of said heating element; and a second terminal connected at a second end of said heating element. 36. The device according to claim 35 wherein the ratio, by weight, of said micron conductive fiber to said resin host is between about 0.20 and about 0.40. 37. The device according to claim 35 wherein said conductive loaded resin-based material further comprises non-metal powder. 38. The device according to claim 37 wherein said non-metal powder is carbon, graphite, or an amine-based material. 39. The device according to claim 35 wherein said conductive loaded resin-based material further comprises metal powder. 40. The device according to claim 39 wherein said metal powder is nickel, copper, or silver. 41. The device according to claim 39 wherein said metal powder is a non-conductive material with a metal plating. 42. The device according to claim 41 wherein said metal plating is nickel, copper, or silver. 43. The device according to claim 35 wherein said micron conductive fiber comprises metal fiber. 44. The device according to claim 35 wherein said micron conductive fiber is nickel plated carbon fiber, stainless steel fiber, copper fiber, silver fiber or combinations thereof. 45. The device according to claim 35 wherein said micron conductive fiber comprises a nonconductive core and metal plating. 46. The device according to claim 35 wherein said electrically insulating layer is a resin-based material. 47. The device according to claim 35 wherein said heating element and said electrically insulating layer are flexible.