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An electronics equipment heat exchanger system for thermally managing the electronic devices of a computer server and the exhaust air emitted from the computer server. The electronics equipment heat exchanger system generally includes a heat exchanger attached near an air outlet of a support unit fo

An electronics equipment heat exchanger system for thermally managing the electronic devices of a computer server and the exhaust air emitted from the computer server. The electronics equipment heat exchanger system generally includes a heat exchanger attached near an air outlet of a support unit for a support rack, a thermal management unit fluidly connected to the heat exchanger, and a thermal conditioning unit fluidly connected to the thermal management unit and the heat exchanger. The thermal management unit directly thermally manages one or more electronic devices of the server mainboard while the heat exchanger thermally manages the exhaust air before the exhaust air exits through the outlet of the support unit of the computer server.

대표청구항 ▼

We claim: 1. An electronics equipment heat exchanger system, comprising: a support unit, wherein said support unit includes an air inlet to allow air to enter said support unit and an air outlet to allow air to exit; an electronic device attached to said support unit; a heat exchanger having an inl

We claim: 1. An electronics equipment heat exchanger system, comprising: a support unit, wherein said support unit includes an air inlet to allow air to enter said support unit and an air outlet to allow air to exit; an electronic device attached to said support unit; a heat exchanger having an inlet and an outlet, wherein said heat exchanger is positioned within said support unit to thermally condition heated air within said support unit before said heated air exits through said air outlet; a liquid thermal management unit fluidly connected to said outlet of said heat exchanger, wherein said liquid thermal management unit thermally manages at least one heat producing device on said electronic device; and a thermal conditioning unit fluidly connected to said inlet of said heat exchanger to provide thermally conditioned liquid coolant to said heat exchanger, wherein said thermally conditioned liquid coolant conducts heat within said heat exchanger from said heated air before entering said liquid thermal management unit. 2. The electronics equipment heat exchanger system of claim 1, including a support rack and wherein said support unit is attached within said support rack. 3. The electronics equipment heat exchanger system of claim 1, wherein said heat exchanger is positioned near said air outlet of said support unit. 4. The electronics equipment heat exchanger system of claim 1, wherein said heat exchanger extends across at least fifty-percent of a width of said support unit. 5. The electronics equipment heat exchanger system of claim 1, including an air moving device to move outside air through said air inlet and through said air outlet of said support unit. 6. The electronics equipment heat exchanger system of claim 5, wherein said air moving device is positioned near said air inlet. 7. The electronics equipment heat exchanger system of claim 5, wherein said air moving device is comprised of a fan. 8. The electronics equipment heat exchanger system of claim 1, wherein said heat exchanger is diagonally positioned within said support unit with a first end positioned closer to said air inlet and a second end positioned closer to said air outlet of said support unit. 9. The electronics equipment heat exchanger system of claim 1, wherein said heat exchanger is comprised of a V-shaped structure. 10. An electronics equipment heat exchanger system, comprising: a support rack to support a computer server; a heat exchanger having an inlet and an outlet, wherein said heat exchanger thermally conditions air heated by said computer server before the heated air exits said support rack; a liquid thermal management unit fluidly connected to said outlet of said heat exchanger, wherein said liquid thermal management unit thermally manages at least one heat producing device of said computer server; and a thermal conditioning unit fluidly connected to said inlet of said heat exchanger to provide thermally conditioned liquid coolant to said heat exchanger, wherein said thermally conditioned liquid coolant conducts heat within said heat exchanger from said heated air before entering said liquid thermal management unit. 11. The electronics equipment heat exchanger system of claim 10, wherein said heat exchanger is positioned within a door of said support rack. 12. The electronics equipment heat exchanger system of claim 10, wherein said heat exchanger is positioned near a door of said support rack. 13. The electronics equipment heat exchanger system of claim 10, including an air moving device to move outside air through said air inlet and through said air outlet of said support unit. 14. The electronics equipment heat exchanger system of claim 13, wherein said air moving device is comprised of a fan. 15. An electronics equipment heat exchanger system, comprising: a support rack; a support unit attached within said support rack, wherein said support unit includes an air inlet to allow air to enter said support unit and an air outlet to allow air to exit; an electronic device attached to said support unit; a heat exchanger having an inlet and an outlet, wherein said heat exchanger is positioned within said support unit to thermally condition heated air within said support unit before said heated air exits through said air outlet; wherein said heat exchanger is positioned within an air flow of said support unit wherein said heat exchanger is positioned near said air outlet of said support unit; an air moving device attached to said support unit to move outside air through said air inlet and through said air outlet of said support unit; a liquid thermal management unit fluidly connected to said outlet of said heat exchanger, wherein said liquid thermal management unit thermally manages at least one heat producing device on said electronic device; and a thermal conditioning unit fluidly connected to said inlet of said heat exchanger to provide thermally conditioned liquid coolant to said heat exchanger and fluidly connected to an exhaust port of said liquid thermal management unit to receive heated exhaust coolant, wherein said thermally conditioned liquid coolant conducts heat within said heat exchanger from said heated air before entering said liquid thermal management unit. 16. The electronics equipment heat exchanger system of claim 15, wherein said air moving device is positioned near said air inlet. 17. The electronics equipment heat exchanger system of claim 15, wherein said air moving device is comprised of a fan. 18. The electronics equipment heat exchanger system of claim 15, wherein said heat exchanger is diagonally positioned within said support unit with a first end positioned closer to said air inlet and a second end positioned closer to said air outlet of said support unit. 19. The electronics equipment heat exchanger system of claim 15, wherein said heat exchanger is comprised of a V-shaped structure. 20. The electronics equipment heat exchanger system of claim 15, including at least one baffle to direct air to said heat exchanger.