Methods and systems for detection of selected defects particularly in relatively noisy inspection data
원문보기
IPC분류정보
국가/구분
United States(US) Patent
등록
국제특허분류(IPC7판)
G06F-011/30
출원번호
US-0858420
(2004-06-01)
등록번호
US-7373277
(2008-05-13)
발명자
/ 주소
Wu,Sean
Chen,Haiguang
Kirk,Michael D.
출원인 / 주소
KLA Tencor Technologies Corp.
대리인 / 주소
Baker & McKenzie LLP
인용정보
피인용 횟수 :
13인용 특허 :
13
초록▼
Various methods and systems for detection of selected defects particularly in relatively noisy inspection data are provided. One method includes applying a spatial filter algorithm to raw inspection data acquired across an area on a substrate to determine a first portion of the raw inspection data t
Various methods and systems for detection of selected defects particularly in relatively noisy inspection data are provided. One method includes applying a spatial filter algorithm to raw inspection data acquired across an area on a substrate to determine a first portion of the raw inspection data that has a higher probability of being a selected type of defect than a second portion of the raw inspection data. The selected type of defect includes a non-point defect. The method also includes generating a raw two-dimensional map illustrating the first portion of the raw inspection data. In addition, the method includes searching the raw two-dimensional map for an event that has spatial characteristics that approximately match spatial characteristics of the selected type of defect. The method further includes determining if the event corresponds to a defect having the selected type.
대표청구항▼
What is claimed is: 1. A computer-implemented method for detecting defects on a substrate, comprising: applying a spatial filter algorithm to raw inspection data acquired across an area on the substrate to determine a first portion of the raw inspection data that has a higher probability of being a
What is claimed is: 1. A computer-implemented method for detecting defects on a substrate, comprising: applying a spatial filter algorithm to raw inspection data acquired across an area on the substrate to determine a first portion of the raw inspection data that has a higher probability of being a selected type of defect than a second portion of the raw inspection data, wherein the selected type of defect comprises a non-point defect; generating a raw two-dimensional map illustrating the first portion of the raw inspection data; searching the raw two-dimensional map for an event that has spatial characteristics that approximately match spatial characteristics of the selected type of defect; and determining if the event corresponds to a defect having the selected type. 2. The method of claim 1, wherein the raw inspection data contains a significant amount of noise. 3. The method of claim 1, wherein the raw inspection data has a relatively low signal-to-noise ratio. 4. The method of claim 1, wherein the raw inspection data comprises one or more raw scan images. 5. The method of claim 1, wherein the area on the substrate equals approximately an entire area of a surface of the substrate. 6. The method of claim 1, wherein the raw inspection data comprises data acquired by optical inspection of the substrate. 7. The method of claim 1, wherein the substrate comprises a wafer or a reticle. 8. The method of claim 1, wherein the substrate comprises a patterned wafer. 9. The method of claim 1, wherein the selected type of the defect comprises a scratch. 10. The method of claim 1, wherein said searching comprises applying a Hough transform to the raw two-dimensional map, and wherein the spatial characteristics of the selected type of defect are substantially linear. 11. The method of claim 1, wherein said determining comprises applying a thresholding algorithm to the event. 12. The method of claim 1, wherein said applying comprises extracting the first portion of the raw inspection data, and wherein the raw two-dimensional map illustrates only the first portion of the raw inspection data. 13. The method of claim 1, further comprising accentuating the first portion of the raw inspection data, wherein the raw two-dimensional map illustrates the accentuated first portion of the raw inspection data. 14. The method of claim 1, further comprising generating a processed two-dimensional map illustrating only the defect having the selected type. 15. The method of claim 1, further comprising substantially simultaneously searching the raw two-dimensional map for one or more events that have spatial characteristics that approximately match spatial characteristics of more than one selected type of defect and determining if the one or more events correspond to defects having one of the more than one selected type. 16. A storage medium, comprising program instructions executable on a processor for: applying a spatial filter algorithm to raw inspection data acquired across an area on a substrate to determine a first portion of the raw inspection data that has a higher probability of being a selected type of defect than a second portion of the raw inspection data, wherein the selected type of defect comprises a non-point defect; generating a raw two-dimensional map illustrating the first portion of the raw inspection data; searching the raw two-dimensional map for an event that has spatial characteristics that approximately match spatial characteristics of the selected type of defect; and determining if the event corresponds to a defect having the selected type. 17. The storage medium of claim 16, wherein the raw inspection data contains a significant amount of noise. 18. The storage medium of claim 16, wherein the raw inspection data has a relatively low signal-to-noise ratio. 19. The storage medium of claim 16, wherein the selected type of the defect comprises a scratch. 20. The storage medium of claim 16, wherein said searching comprises applying a Hough transform to the raw two-dimensional map, and wherein the spatial characteristics of the selected type of defect are substantially linear. 21. The storage medium of claim 16, wherein said determining comprises applying a thresholding algorithm to the event. 22. The storage medium of claim 16, wherein said applying comprises extracting the first portion of the raw inspection data, and wherein the raw two-dimensional map illustrates only the first portion of the raw inspection data. 23. The storage medium of claim 16, wherein the program instructions are further executable for accentuating the first portion of the raw inspection data, and wherein the raw two-dimensional map illustrates the accentuated first portion of the raw inspection data. 24. A system configured to detect defects on a substrate comprising: a processor; and a storage medium comprising program instructions executable on the processor for: applying a spatial filter algorithm to raw inspection data acquired across an area on the substrate to determine a first portion of the raw inspection data that has a higher probability of being a selected type of defect than a second portion of the raw inspection data, wherein the selected type of defect comprises a non-point defect; generating a raw two-dimensional map illustrating the first portion of the raw inspection data; searching the raw two-dimensional map for an event that has spatial characteristics that approximately match spatial characteristics of the selected type of defect; and determining if the event corresponds to a defect having the selected type. 25. The system of claim 24, wherein the system further comprises an inspection module coupled to the processor, and wherein the inspection module is configured to generate the raw inspection data.
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이 특허에 인용된 특허 (13)
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Chen, Haiguang; Kavaldjiev, Daniel; Vintro, Louis; Kren, George, Computer-implemented methods, computer-readable media, and systems for determining one or more characteristics of a wafer.
Chen, David; Steinbach, Andrew; Kavaldjiev, Daniel; Belyaev, Alexander; Reich, Juergen, Methods and systems for detecting pinholes in a film formed on a wafer or for monitoring a thermal process tool.
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