초록 ▼

A sensor package apparatus includes a lead frame substrate that supports one or more electrical components, which are connected to and located on the lead frame substrate. A plurality of wire bonds are also provided, which electrically connect the electrical components to the lead frame substrate, w

A sensor package apparatus includes a lead frame substrate that supports one or more electrical components, which are connected to and located on the lead frame substrate. A plurality of wire bonds are also provided, which electrically connect the electrical components to the lead frame substrate, wherein the lead frame substrate is encapsulated by a thermoset plastic to protect the plurality of wire bonds and at least one electrical component, thereby providing a sensor package apparatus comprising the lead frame substrate, the electrical component(s), and the wire bonds, while eliminating a need for a Printed Circuit Board (PCB) or a ceramic substrate in place of the lead frame substrate as a part of the sensor package apparatus. A conductive epoxy and/or solder can also be provided for maintaining a connection of the electrical component(s) to the lead frame substrate. The electrical components can constitute, for example, an IC chip and/or a sensing element (e.g., a magnetoresistive component) or sense die.

대표청구항 ▼

What is claimed is: 1. A sensor over-mold apparatus, comprising: a sensor subassembly comprising a plurality of electrical components for performing a sensing operation; a lead frame comprising a plurality of electrically conducting terminals, wherein said lead frame forms a part of said sensor sub

What is claimed is: 1. A sensor over-mold apparatus, comprising: a sensor subassembly comprising a plurality of electrical components for performing a sensing operation; a lead frame comprising a plurality of electrically conducting terminals, wherein said lead frame forms a part of said sensor subassembly, wherein said plurality of electrically conducting terminals communicate electrically with said plurality of electrical components of said sensor subassembly; and a thermoplastic material over-molded about said sensor subassembly to form a sensor over-mold apparatus comprising a thermoset package that can withstand high-temperature environments; and a magnetic sensing component located on said lead frame and over-molded with a thermoset material on said lead frame, wherein said thermoset material is further over-molded about said plurality of electrically conducting materials. 2. The apparatus of claim 1 wherein said thermoset material comprises an epoxy molding compound. 3. The apparatus of claim 1 wherein said plurality of electrically conducting terminals of said lead frame are utilized to locate said subassembly in a mold comprising said thermoplastic material during an over-molding of said sensor subassembly with said thermoplastic material. 4. The apparatus of claim 3 further comprising at least one retractable pin accepting feature for receiving a retractable pin associated with said sensor subassembly, wherein said at least one retractable pin is pullable during said over-molding of said sensor assembly with said thermoplastic material to allow for a complete coverage of said thermoplastic material about said sensor subassembly. 5. The apparatus of claim 1 wherein said high-temperature environment comprises a temperature greater than or approximately equal to 200�� C. 6. The apparatus of claim 1 wherein said sensor over-mold apparatus comprises a speed sensor. 7. The apparatus of claim 6 wherein said speed sensor comprises a turbocharger speed sensor. 8. A sensor over-mold apparatus, comprising: a sensor subassembly comprising a plurality of electrical components for performing a sensing operation; a lead frame comprising a plurality of electrically conducting terminals, wherein said lead frame forms a part of said sensor subassembly, wherein said plurality of electrically conduction terminals communicate electrically with said plurality of electrical components of said sensor subassembly; a magnetic sensing component located on said lead frame and over-molded with a thermoset material on said lead frame, wherein said thermoset material is further over-molded about said plurality of electrically conducting materials, such that said plurality of electrically conducting terminals of said lead frame are utilized to locate said subassembly in a mold comprising said thermoplastic material during an over-molding of said sensor subassembly with said thermoplastic material; and a thermoplastic material over-molded about said sensor subassembly to form a sensor over-mold apparatus comprising a thermoset package that can withstand high-temperature environments. 9. The apparatus of claim 8 wherein said thermoset material comprises an epoxy molding compound and wherein said thermoplastic material comprises Polyphenylene Sulfide (PPS). 10. The apparatus of claim 8 further comprising at least one retractable pin accepting feature for receiving a retractable pin associated with said sensor subassembly, wherein said at least one retractable pin is pullable during said over-molding of said sensor assembly with said thermoplastic material to allow for a complete coverage of said thermoplastic material about said sensor subassembly. 11. The apparatus of claim 8 wherein said high-temperature environment comprises a temperature greater than or approximately equal to 200�� C. 12. The apparatus of claim 8 wherein said sensor over-mold apparatus comprises a speed sensor. 13. The apparatus of claim 12 wherein said speed sensor comprises a turbocharger speed sensor. 14. A sensor over-mold apparatus, comprising: a sensor subassembly comprising a plurality of electrical components for performing a sensing operation; a lead frame comprising a plurality of electrically conducting terminals, wherein said lead frame forms a part of said sensor subassembly, wherein said plurality of electrically conducting terminals communicate electrically with said plurality of electrical components of said sensor subassembly; and a thermoplastic material over-molded about said sensor subassembly to form a sensor over-mold apparatus comprising a thermoset package that can withstand high-temperature environments, wherein said thermoset material comprises an epoxy molding compound; and at least one retractable pin accepting feature for receiving a retractable pin associated with said sensor subassembly, wherein said at least one retractable pin is pullable during said over-molding of said sensor assembly with said thermoplastic material to allow for a complete coverage of said thermoplastic material about said sensor subassembly. 15. The apparatus of claim 14 wherein said high-temperature environment comprises a temperature greater than or approximately equal to 200�� C. 16. The apparatus of claim 14 wherein said sensor over-mold apparatus comprises a speed sensor. 17. The apparatus of claim 14 wherein said speed sensor comprises a turbocharger speed sensor. 18. The apparatus of claim 14 wherein said thermoset material comprises an epoxy molding compound and wherein said thermoplastic material comprises Polyphenylene Sulfide (PPS).