초록 ▼

The present invention is a cooling device for removing heat from an integrated circuit. In one embodiment, the cooling device includes a conduit and a flexible channel having a first open end and a second closed end. The flexible channel's first open end has an internal width and is coupled with the

The present invention is a cooling device for removing heat from an integrated circuit. In one embodiment, the cooling device includes a conduit and a flexible channel having a first open end and a second closed end. The flexible channel's first open end has an internal width and is coupled with the conduit. The flexible channel is comprised of a resilient material having spring-like characteristics. In one embodiment, this material provides a spring-like restoring force when compressed. The cooling device also includes an interconnect mechanism between the conduit and the flexible channel to allow a gas or a fluid introduced within the conduit to move between the conduit and the flexible channel.

대표청구항 ▼

What is claimed is: 1. A cooling device for removing heat from an integrated circuit, said cooling device comprising: a conduit; a flexible channel to alternate between a compressed position and an extended position and having a first open end and a second closed end, said first open end coupled wi

What is claimed is: 1. A cooling device for removing heat from an integrated circuit, said cooling device comprising: a conduit; a flexible channel to alternate between a compressed position and an extended position and having a first open end and a second closed end, said first open end coupled with said conduit, said open end having an internal width, said flexible channel comprised of a resilient material having spring-like characteristics, said material to provide a spring-like restoring force when compressed, the second closed end comprising a thermally conductive material attached to said flexible channel, said thermally conductive material having a substantially planar surface to interface directly with said integrated circuit when said flexible channel is extended and to detach from said integrated circuit in said compressed position, said flexible channel being conformable with an integrated circuit disposed at an angle relative to the first open end; an interconnect mechanism between said conduit and said flexible channel to allow a fluid introduced within said conduit to move between said conduit and said flexible channel; and a heat sink attached to an interior surface of said closed end in the compressed position and in the extended position to cause heat absorbed by said closed end to be conducted through said conduit and said flexible channel wherein said heat sink comprises a plurality of spaced apart planar fins wherein a portion of said spaced apart planar fins extends into said conduit in said extended position, the planar fins being perpendicular to a flow of the fluid through the conduit. 2. A cooling device as in claim 1, wherein said interconnect mechanism is an opening in a surface of said conduit. 3. A cooling device as in claim 1, wherein said opening has a width equal to said internal width of said open end. 4. A cooling device as in claim 1, wherein said open end is coupled with said conduit by a technique selected from the group consisting of soldering, sautering, welding, and adhering. 5. A cooling device as in claim 4, wherein said flexible channel, including said closed end, is sealed, and further comprising: a port for coupling to a pump coupled to said conduit configured to reduce a pressure in said conduit and said flexible channel to compress said flexible channel and to remove said conductive material from said integrated circuit. 6. A cooling device as in claim 1, wherein said thermally conductive material is copper. 7. A cooling device as in claim 1, wherein said resilient material comprises a material selected from the group of which phosphor bronze and beryllium copper are members. 8. A cooling device as in claim 1, wherein said resilient material is pleated. 9. A cooling device as in claim 1, wherein said flexible channel is in a compressed state. 10. A cooling device as in claim 9, further comprising: a vacuum pressure within said conduit and said flexible channel. 11. A cooling device as in claim 9, wherein a pressure within said flexible channel is less than 1.0 atmosphere. 12. A cooling device as in claim 9, wherein said fluid is within said flexible channel. 13. A cooling device as in claim 1, wherein said flexible channel is in an extended state. 14. A cooling device as in claim 13, wherein a pressure within said extended flexible channel approximately equals 1.0 atmosphere. 15. A cooling device as in claim 13, wherein a pressure within said extended flexible channel is not a vacuum pressure. 16. A cooling device as in claim 15, wherein said fluid is contained within said conduit and said flexible channel. 17. A cooling device as in claim 16, wherein said fluid is heated. 18. A cooling device as in claim 16, wherein said fluid is cooled. 19. A cooling device as in claim 16, wherein said closed end contacts said integrated circuit and wherein heat from said integrated circuit is dissipated by said fluid contained within said conduit and said flexible channel. 20. A cooling device as in claim 16, further comprising: a plurality of flow diverters attached within said conduit to create turbulence in said fluid. 21. A cooling device as in claim 1, wherein said flexible channel is compressed by creating a vacuum pressure within said flexible channel. 22. A cooling device as in claim 1, wherein said flexible channel is compressed by creating a pressure of less than 1.0 atmosphere within said flexible channel. 23. A cooling device as in claim 1, wherein said flexible channel is extended by equalizing a vacuum pressure within said flexible channel to approximately equal 1.0 atmosphere. 24. A cooling device as in claim 1, wherein said flexible channel is extended by creating a pressure approximately equal to 1.0 atmosphere within said flexible channel. 25. A cooling device as in claim 1 wherein said conduit is a heat pipe. 26. A cooling device as in claim 25, further comprising: wicking material contained within said heat pipe; and a reservoir coupled with said heat pipe, said reservoir to contain said fluid. 27. A cooling device as in claim 26, wherein said fluid is contained within said heat pipe. 28. A cooling device as in claim 26, wherein a gas is contained within said heat pipe.