Low loss glass-ceramic materials, method of making same and electronic packages including same
원문보기
IPC분류정보
국가/구분
United States(US) Patent
등록
국제특허분류(IPC7판)
B32B-017/06
C03C-010/14
C03C-010/00
C03C-010/04
출원번호
US-0084722
(2005-03-18)
등록번호
US-7387838
(2008-06-17)
발명자
/ 주소
Rita,Robert A.
출원인 / 주소
Delaware Capital Formation, Inc.
대리인 / 주소
Burr & Brown
인용정보
피인용 횟수 :
0인용 특허 :
60
초록▼
A glass-ceramic is provided having a thermal expansion coefficient in a range of 3-6 ppm/�� C., a dielectric constant that is less than 5 and a Quality factor Q of at least 400. The glass-ceramic consists essentially of SiO2 in a range of 45-58 wt %, Al2O3 in a range of 10-18 wt % and MgO in a range
A glass-ceramic is provided having a thermal expansion coefficient in a range of 3-6 ppm/�� C., a dielectric constant that is less than 5 and a Quality factor Q of at least 400. The glass-ceramic consists essentially of SiO2 in a range of 45-58 wt %, Al2O3 in a range of 10-18 wt % and MgO in a range of 10-25 wt %. A method of making the glass-ceramic is also provided. Further, an electronic package is also provided, including a base member and a glass-ceramic substrate bonded to the base member.
대표청구항▼
What is claimed is: 1. A glass-ceramic material consisting essentially of SiO2 in a range of 45-58 wt %, Al2O3 in a range of 10-18 wt %, MgO in a range of 10-25 wt % and B2O3 present in an amount up to 10 wt %, said glass-ceramic material having a thermal expansion coefficient in a range of 3-6 ppm
What is claimed is: 1. A glass-ceramic material consisting essentially of SiO2 in a range of 45-58 wt %, Al2O3 in a range of 10-18 wt %, MgO in a range of 10-25 wt % and B2O3 present in an amount up to 10 wt %, said glass-ceramic material having a thermal expansion coefficient in a range of 3-6 ppm/�� C., a dielectric constant of less than 5 and a Quality factor (Q) of at least 400. 2. The glass-ceramic material of claim 1, further including at least one of P2O5 in an amount up to 4 wt %, and GeO2 in an amount up to 10 wt %. 3. The glass-ceramic material of claim 1, wherein said glass-ceramic material further includes an additive that is added as a particulate after said glass-ceramic material is formed and pulverized into a powder, said additive comprising at least one material selected form the group consisting of crystalline silica, a material having a high thermal expansion coefficient and a main phase of crystalline silica, cordierite, fused silica and a borosilicate glass. 4. The glass-ceramic material of claim 3, wherein said additive comprises 1-15 wt % crystalline silica. 5. The glass-ceramic material of claim 3, wherein said additive comprises 4-12 wt % of a borosilicate glass. 6. The glass-ceramic material of claim 3, wherein said additive comprises 1-15 wt % of a material consisting essentially of 50-55 wt % SiO2, 12-18 wt % Al2O3, 10-18 wt % MgO and 4-16 wt % ZnO and having a crystalline silica main crystal phase. 7. An electronic package comprising: a base member; and a glass-ceramic substrate bonded to said base member, said glass-ceramic substrate consisting essentially of SiO2 in a range of 45-58 wt %, Al2O3 in a range of 10-18 wt %, MgO in a range of 10-25 wt % and B2O3 present in an amount up to 10 wt %, said glass-ceramic substrate having a thermal expansion coefficient in a range of 3-6 ppm/�� C., a dielectric constant of less than 5 and a Quality factor (Q) of at least 400. 8. The electronic package of claim 7, further comprising a bonding layer interposed between said base member and said glass-ceramic substrate. 9. The electronic package of claim 8, wherein said bonding layer comprises one of a solder and a bond glass. 10. The electronic package of claim 7, wherein said glass-ceramic material further includes an additive that is added as a particulate after said glass-ceramic material is formed and pulverized into a powder, said additive comprising at least one material selected form the group consisting of crystalline silica, a material having a high thermal expansion coefficient and a main phase of crystalline silica, cordierite, fused silica and a borosilicate glass. 11. A substrate for an electronic package comprising the glass-ceramic material of claim 1.
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