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Apparatus for packaging electronic components including a reel entrained with desiccating material 원문보기

IPC분류정보
국가/구분 United States(US) Patent 등록
국제특허분류(IPC7판)
  • B65D-085/00
  • B65D-081/26
  • B65B-009/00
  • B65H-075/18
  • H01L-021/00
출원번호 US-0005289 (2004-12-06)
등록번호 US-7389877 (2008-06-24)
발명자 / 주소
  • Dick,Stefan
  • Martin,Michelle
  • Dessus,Francois
출원인 / 주소
  • Sud Chemie Inc.
대리인 / 주소
    Cox,Scott R.
인용정보 피인용 횟수 : 2  인용 특허 : 55

초록

An apparatus for packaging electronic components, particularly integrated circuits, which includes a carrier tape into or on which the integrated circuits can be secured, a packing reel, to which is secured the carrier tape, wherein one or more components of the packing reel is composed of a plastic

대표청구항

The invention claimed is: 1. An apparatus for packaging integrated circuits comprising a carrier tape for holding integrated circuits, and a packing reel, wherein a composition of one or more components of the packing reel comprises a plastic material, and a desiccating material for adsorbing moist

이 특허에 인용된 특허 (55)

  1. Shaler Amos J. (705 W. Park Ave. State College PA 16801) McLean Daniel C. (4029 Alicante Fort Worth TX 76133), Adsorbent body and method for making same.
  2. Lancesseur Didier,FRX ; Wiles Stewart John,GBX, Assay devices.
  3. Hekal Ihab M., Barrier pack having an absorbing agent applied to the interior of the pack.
  4. Kawada,Seiichi, Carrier reel, carriage method using the carrier reel, and method for manufacturing electronic device.
  5. Seiichi Kawada JP, Carrier reel, carriage method using the carrier reel, and method for manufacturing electronic device.
  6. Weiler Joseph E. (Colfax WI) Tidemann Dale R. (Eau Claire WI) Juntunen Timothy J. (Eau Claire WI), Carrier tape with cover strip.
  7. Moratalla Jose (3359 Lake Shore La. Clearwater FL 34621), Ceramic desiccant device.
  8. Ihab M. Hekal, Co-continuous interconnecting channel morphology composition.
  9. Ihab M. Hekal, Co-continuous interconnecting channel morphology polymer having controlled gas transmission rate through the polymer.
  10. Hekal, Ihab M., Co-continuous interconnecting channel morphology polymer having modified surface properties.
  11. Stover Mary M. (Austin TX) Gerke Robert D. (Austin TX), Compartmentalized humidity sensing indicator.
  12. Moritani Tohei (Kurashiki JPX), Composition, process for producing the same and multi-layer structure.
  13. Duncan William V. (Scottsdale AZ), Container having an observation window.
  14. Hekal Ihab M., Desiccant entrained polymer.
  15. Hekal Ihab M., Desiccant entrained polymer.
  16. Hekal Ihab M., Desiccant entrained polymer.
  17. Fischer John C. (Marietta GA), Desiccant-coated substrate and method of manufacture.
  18. Fischer John C. (Marietta GA) Mescher Kirk T. (Columbia MO), Desiccant-coated substrate and method of manufacture.
  19. Hekal Ihab M., Dessicant entrained polymer.
  20. Farrell Christopher J. (Arlington Heights IL) Tsai Boh C. (Rolling Meadows IL) Wachtel James A. (Buffalo Grove IL), Drying agent in multi-layer polymeric structure.
  21. Taylor R. Daniel (North Ridgeville OH), Flexible desiccant body.
  22. Kremen Irwin (216 Forestwood Dr. Durham NC 27707), Hermetic enclosure assembly for preservational storage and/or display of otherwise degradable objects.
  23. Troxtell Clessie ; Hayden Michael, Lightweight, high temperature packing reel for integrated circuits.
  24. Michael L. Hayden ; Clessie A. Troxtell, Jr., Matched thermal expansion carrier tape assemblage for semiconductor devices.
  25. Ritchie Kim (Phoenix AZ) Smith James N. (Tempe AZ), Method for incorporating a desiccant in a semiconductor package.
  26. Kitamura Wahei (Kodaira JPX) Murakami Gen (Machida JPX) Nishi Kunihiko (Kokubunji JPX), Method of producing semiconductor memory.
  27. Kitamura Wahei (Kodaira JPX) Murakami Gen (Machida JPX) Nishi Kunihiko (Kokubunji JPX), Method of producing semiconductor memory packages.
  28. Weder, Donald E., Modified atmosphere packaging for a floral grouping.
  29. Hekal Ihab M., Modified polymers having controlled transmission rates.
  30. Hekal Ihab M., Modified polymers having controlled transmission rates.
  31. Shores A. Andrew (Venice CA), Moisture getting composition for hermetic microelectronic devices.
  32. Shigeta Katsumi (Ootsu JPX) Mukai Hisao (Naruto JPX) Isojima Eiji (Shiga JPX) Saita Yoshio (Naruto JPX), Moisture-absorbent compositions and molded items.
  33. Dereppe Michel (Brussels BEX) Leva Jean (Limelette BEX), Moldable compositions based on thermoplastic polymers, synthetic elastomers and vegetable fibrous materials, and use of.
  34. Hekal Ihab M., Monolithic composition having an activation material.
  35. Hekal, Ihab M., Monolithic composition having the capability of maintaining constant relative humidity in a package.
  36. Hekal Ihab M. ; Langer Robert S. ; Klibanov Alexander M. ; Mathiowitz Edith, Monolithic polymer composition having a water absorption material.
  37. Hekal Ihab M., Monolithic polymer composition having an absorbing material.
  38. Troxtell ; Jr. Clessie A. ; Hnilo Laura A. ; Hayden Michael L. ; Hess Charles M. ; Wikander Daniel R. ; Lewis Lee A., Multi-functional shipping system for integrated circuit devices.
  39. Oido Hikofumi (Katano JPX) Hayashi Yoshitake (Kawachinagano JPX) Yamamoto Minoru (Saijyo JPX), Package configuration of solar cell elements.
  40. Duncan William V ; Barton Richard J., Packaging apparatus and method.
  41. Dick, Stefan O.; Martin, Michelle B.; Nobilet, Roger; Bouvier, Frederic, Packaging container for electronic components.
  42. Martin Michelle ; Beltran Mark, Packaging container with humidity indicator.
  43. Takahashi Hideyuki,JPX ; Hatakeyama Hidetoshi,JPX ; Nakaya Futoshi,JPX ; Fujii Yuichi,JPX, Packing for lid.
  44. Lancesseur Didier (Choisy-Le-Roi FRX), Polymer-based dehydrating materials.
  45. Holden Geoffrey (Houston TX), Polymeric composition.
  46. Smalligan Wayne J. (Fremont MI) Kelly Vincent J. (Fremont MI) Enad Estela G. (Fremont MI), Preparation of a stabilized precooked baby food formulation thickened with modified tapioca starch.
  47. Itamura Sumio (Kurashiki JPX) Moritani Tohei (Kurashiki JPX) Sato Toshiaki (Kurashiki JPX) Negi Taichi (Kurashiki JPX), Resin composition.
  48. Degen Peter J. (Huntington NY) Gsell Thomas C. (Levittown NY), Self-supporting structures containing immobilized inorganic sorbent particles and method for forming same.
  49. Larson James M., Sorptive articles.
  50. Kitamura Wahei (Kodaira JPX) Murakami Gen (Machida JPX) Nishi Kunihiko (Kokubunji JPX), Surface package type semiconductor package.
  51. Okui Tokujiro (Toyonaka JPX) Taira Takahachiro (Ibaragi JPX), Taping package method for small-size electronic parts.
  52. Juhl Roger L. (Asheville NC) Lustig Stanley (Park Forest IL) Tijunelis Donatas (Buffalo Grove IL), Transferable modifier-containing film.
  53. Pakeriasamy Saragarvani, Tray for shipping PCMCIA cards.
  54. Sawaya Hiromichi (Kawasaki JPX), Wrapping member for semiconductor device and method for manufacturing the wrapping member.
  55. Ram Arunachalam Tulsi ; Blaisdell Brett Zippel ; Carroll-Yacoby Diane Marie, Zeolite molecular sieves for packaging structures.

이 특허를 인용한 특허 (2)

  1. Jewram, Radesh; McIntosh, William E., Method for packaging thermal interface materials.
  2. Jewram, Radesh; McIntosh, William E.; Schmitz, Jeremy J., Method for packaging thermal interface materials.
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